HUT76992A - Eljárás rádiófrekvenciás azonosító toldalék előállítására - Google Patents
Eljárás rádiófrekvenciás azonosító toldalék előállítására Download PDFInfo
- Publication number
- HUT76992A HUT76992A HU9701699A HU9701699A HUT76992A HU T76992 A HUT76992 A HU T76992A HU 9701699 A HU9701699 A HU 9701699A HU 9701699 A HU9701699 A HU 9701699A HU T76992 A HUT76992 A HU T76992A
- Authority
- HU
- Hungary
- Prior art keywords
- wire
- semiconductor chip
- substrate
- connection
- cut
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 131
- 239000000758 substrate Substances 0.000 claims abstract description 77
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- 238000010438 heat treatment Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 17
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- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 6
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- 239000002356 single layer Substances 0.000 claims description 4
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 2
- 241001581492 Attila Species 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 3
- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
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- 238000003698 laser cutting Methods 0.000 description 1
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- 239000000155 melt Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
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- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G—PHYSICS
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- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
- G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
- G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
- G06K7/086—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive sensing passive circuit, e.g. resonant circuit transponders
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/78—Apparatus for connecting with wire connectors
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- H01Q1/00—Details of, or arrangements associated with, antennas
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- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19041—Component type being a capacitor
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- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Artificial Intelligence (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33028894A | 1994-10-27 | 1994-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
HUT76992A true HUT76992A (hu) | 1998-01-28 |
Family
ID=23289095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU9701699A HUT76992A (hu) | 1994-10-27 | 1995-09-20 | Eljárás rádiófrekvenciás azonosító toldalék előállítására |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2818392B2 (fr) |
KR (1) | KR100192728B1 (fr) |
HU (1) | HUT76992A (fr) |
TW (1) | TW280897B (fr) |
WO (1) | WO1996013793A1 (fr) |
ZA (1) | ZA957085B (fr) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
JP2000216188A (ja) | 1999-01-22 | 2000-08-04 | Seiko Epson Corp | ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置 |
US6472747B2 (en) * | 2001-03-02 | 2002-10-29 | Qualcomm Incorporated | Mixed analog and digital integrated circuits |
US6732923B2 (en) * | 2001-04-04 | 2004-05-11 | Ncr Corporation | Radio frequency identification system and method |
JP4347340B2 (ja) * | 2004-05-18 | 2009-10-21 | 株式会社日立製作所 | 無線icタグ及びその製造方法 |
US7295161B2 (en) | 2004-08-06 | 2007-11-13 | International Business Machines Corporation | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
KR101038493B1 (ko) * | 2004-11-12 | 2011-06-01 | 삼성테크윈 주식회사 | 극초단파용 라디오 주파수 인식태그 제조방법 |
WO2006103981A1 (fr) | 2005-03-25 | 2006-10-05 | Toray Industries, Inc. | Antenne plane et procede de fabrication correspondant |
US7586193B2 (en) | 2005-10-07 | 2009-09-08 | Nhew R&D Pty Ltd | Mm-wave antenna using conventional IC packaging |
JP4316607B2 (ja) | 2006-12-27 | 2009-08-19 | 株式会社東芝 | アンテナ装置及び無線通信装置 |
WO2011083502A1 (fr) | 2010-01-05 | 2011-07-14 | 株式会社 東芝 | Dispositif d'antenne et sans fil |
JP5172925B2 (ja) | 2010-09-24 | 2013-03-27 | 株式会社東芝 | 無線装置 |
JP5417389B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
JP5414749B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
TW201325842A (zh) * | 2011-12-16 | 2013-07-01 | hong-ren Li | 工具盒結構 |
JP6121705B2 (ja) | 2012-12-12 | 2017-04-26 | 株式会社東芝 | 無線装置 |
CN117476624A (zh) * | 2014-12-19 | 2024-01-30 | 纳诺西斯有限公司 | 背板上的发光二极管阵列及其制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2519054C3 (de) * | 1974-04-30 | 1978-08-03 | Central Glass Co., Ltd., Ube, Yamaguchi (Japan) | Vorrichtung zum Aufbringen eines Drahtes auf eine Trägerfolie aus thermoplastischem Kunststoff nach einem vorgegebenen Muster |
NL9200396A (nl) * | 1992-03-03 | 1993-10-01 | Nedap Nv | Radiofrequente identificatielabel met relatief grote detectie-afstand en een minimum aantal electronische componenten. |
DE4345610B4 (de) * | 1992-06-17 | 2013-01-03 | Micron Technology Inc. | Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID) |
-
1995
- 1995-05-09 TW TW084104596A patent/TW280897B/zh active
- 1995-08-23 ZA ZA957085A patent/ZA957085B/xx unknown
- 1995-09-20 HU HU9701699A patent/HUT76992A/hu unknown
- 1995-09-20 WO PCT/EP1995/003703 patent/WO1996013793A1/fr not_active Application Discontinuation
- 1995-10-18 JP JP7269856A patent/JP2818392B2/ja not_active Expired - Lifetime
- 1995-10-24 KR KR1019950036741A patent/KR100192728B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1996013793A1 (fr) | 1996-05-09 |
JPH08213419A (ja) | 1996-08-20 |
KR100192728B1 (ko) | 1999-06-15 |
TW280897B (fr) | 1996-07-11 |
JP2818392B2 (ja) | 1998-10-30 |
ZA957085B (en) | 1996-03-11 |
KR960016656A (ko) | 1996-05-22 |
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