WO1996013793A1 - Procede de fabrication d'identificateurs h.f. - Google Patents

Procede de fabrication d'identificateurs h.f. Download PDF

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Publication number
WO1996013793A1
WO1996013793A1 PCT/EP1995/003703 EP9503703W WO9613793A1 WO 1996013793 A1 WO1996013793 A1 WO 1996013793A1 EP 9503703 W EP9503703 W EP 9503703W WO 9613793 A1 WO9613793 A1 WO 9613793A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
attaching
chip
bonding machine
semiconductor
Prior art date
Application number
PCT/EP1995/003703
Other languages
English (en)
Inventor
Michael John Brady
Thomas Anthony Cofino
Harley Kent Heinrich
Glen Walden Johnson
Paul Andrew Moskowitz
Philip Murhpy
George Frederick Walker
Original Assignee
International Business Machines Corporation
Ibm Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corporation, Ibm Deutschland Gmbh filed Critical International Business Machines Corporation
Publication of WO1996013793A1 publication Critical patent/WO1996013793A1/fr

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
    • G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
    • G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
    • G06K7/086—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive sensing passive circuit, e.g. resonant circuit transponders
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Definitions

  • This invention relates to the field of radio frequency (RF) tagging. More specifically, the invention relates to a method of making an improved small size, low cost RF tag that transmits multiple bits of information.
  • RF radio frequency
  • circuitry is manufactured on hard printed circuit boards or flexible substrates.
  • Printed circuit boards include materials like epoxy-resin or epoxy-glass boards.
  • One generic class on which these circuits are manufactured is FR4.
  • Alternative flexible substrates, also called “flex”, include structures of copper on polyimide. These circuits are generally used in automobiles, consumer electronics, and general interconnections.
  • Wire bonds are made from small diameter wires (approximately 25 microns in diameter) and with wires that are very short. Generally the wires connected by wire bonds are on the order of 1 millimeter (mm) in length. These wire lengths are normally kept short for several reasons:
  • Radio Frequency Identification is just one of many identification technologies for identifying objects.
  • the heart of the RF ID system lies in an information carrying tag.
  • the tag functions in response to a coded RF signal received from a base station.
  • the tag reflects the incident RF carrier back to the base station.
  • Information is transferred as the reflected signal is modulated bythe tag according to its programmed information protocol.
  • the tag consists of a semiconductor chip having RF circuits, logic, and memory.
  • the tag also has an antenna, often a collection of discrete components, capacitors and diodes, for example, a battery in the case of active tags, a substrate for mounting the components, interconnections between components, and a means of physical enclosure.
  • RF ID tags are manufactured by mounting the individual elements to a circuit card. This is done by using either short wire bond connections or soldered connections between the board and the circuit elements: chip, capacitors, diodes, antenna.
  • the circuit card may be of epoxy-fiberglass composition or ceramic.
  • the antennas are generally loops of wire soldered to the circuit card or consist of metal etched or plated on a circuit card. The whole assembly may be enclosed in a plastic box or molded into a three-dimensional plastic package.
  • RF ID While the application of RF ID technology is not as widespread as other ID technologies, barcode for example, RF ID is on its way to becoming a pervasive technology in some areas, notably vehicle identification. Growth in RF ID has been inhibited by the absence of infrastructure for manufacturing the tags, the high cost of tags, the bulkiness of most of the tags, problems of tag sensitivity and range, and the need for the simultaneous reading of multiple numbers of tags. A typical tag costs in the $5 to $10 range. Companies have focused on niche applications. Some prior art discloses RF tags used to identify railway boxcars. RF tags are now used in the automatic toll industry, e.g. on thruway and bridge tolls. RF tags are being tested for uses as contactless fare cards for buses. Employee identification badges and security badges have been produced. Animal identification tags are also commercially available as are RF ID systems for tracking components in manufacturing processes.
  • RF tags made from PC boards or flex must be manufactured first.
  • tags greater than one hundred million tags
  • new factories must be built to produce more board or flex.
  • RF tags made from these technologies are too expensive for many applications.
  • bar codes are a technology that is used for identification at a much lower cost than existing RF tagging technology.
  • An object of this invention is an improved method of making a radio frequency identification tag.
  • An object of this invention is an improved method of making a low cost radio frequency identification tag that is made from currently available materials.
  • Another object of this invention is an improved method of making a radio frequency identification tag that can be manufactured in very large quantities.
  • the present invention is a method of manufacture for a novel radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits.
  • the semiconductor is mounted on a substrate and is capable of receiving an RF signal through an antenna that is electrically connected to the semiconductor through contacts on the semiconductor.
  • the antenna is novel, has a novel structure, and is constructed by a novel use of wire bonding techniques.
  • the antenna is one or more wires, each connected to the semiconductor connections by one or two wire bonds. (In one preferred embodiment, the antenna is made of a pair or plurality of pairs of wires.)
  • One preferred wire bonding method spools out a length of wire required by the antenna design and cuts the second end of the wire without making any electrical connection at the second cut end.
  • the second cut end of the wire is held in place by attaching the cut end to the substrate with adhesive or by local heating of the substrate.
  • the wire bonding method is used to actually create a component of the RF tag circuit (the antenna) rather than to connect two components.
  • the resulting novel antenna structure is a long wire connected to the circuit by a wire bond.
  • Alternative embodiments include making multiple structures from a plurality of semiconductors on a strip of substrate with a wire bonding tool and making folded dipoles with a wire bonding tool.
  • the components of the novel RF tag are then covered in an organic cover that has a novel use in this type of device.
  • Fig. 1 is a flow chart showing the steps of the present invention.
  • Fig. 2 comprising Figures 2A to 21, is a drawing showing the Radio Frequency (RF) tag in each step of the method shown in Figure 1.
  • RF Radio Frequency
  • Figure 3 is a drawing comprising Figures 3A to 3E showing the details of various steps of the method.
  • Figure 4 is a drawing of an RF tag that is being made with a metal pad termination at the end of the antenna wires.
  • Figure 5 comprises Figures 5A and 5B, which are drawings of a continuous strip of RF tags being cut in order to make individual tags by two preferred embodiment of the present process.
  • Figure 6 shows a side view of a series of tags being cut into individual segments by an array of knife blades.
  • Figure 7 is a drawing of the fabrication of a loop antenna by using a temporary post to guide the placement of the antenna wire.
  • Figure 8 is a drawing of the fabrication of a loop antenna by using an embossed stud to guide the placement of the antenna wire.
  • Figure 9 is a drawing of the fabrication of a loop antenna by using a raised flap to guide the placement of the antenna wire.
  • Figure 10 shows the lamination of a tag with two loop antennas between organic covers.
  • Figure 1 is a flow chart depicting the steps in a preferred embodiment for chip attachment, wire bonding, and package sealing.
  • step 110 a semiconductor chip is placed and attached on an organic substrate 210.
  • the chip 205 is a radio frequency semiconductor chip. Structures like this are described in U.S. Patent Application number 08/303,976 to Brady et al. entitled “Radio Frequency Identification Tag” filed on September 9, 1994 which is herein incorporated by reference in its entirety.
  • the chip 205 is placed ( Figure 2A) on the substrate 210 by a component pick and place machine 202 which is well known in the semiconductor industry.
  • the chip 205 can be attached 110 to the substrate 210 by several preferred methods.
  • the chip may be attached 110 with an adhesive.
  • Preferred adhesives include pressure sensitive adhesives such as acrylics, silicones, urethanes, etc.
  • the adhesive is placed on the substrate 110 by an adhesive dispensing machine.
  • a drop of epoxy may be dispensed between the chip 205 and the substrate 210.
  • Another preferred method of attaching the chip 205 is by heating the substrate using a heating tool such as a heat stage 212.
  • the heat stage 212 can be placed in direct contact with the bottom of the substrate 210 that is opposite of the side where the chip is placed.
  • the substrate is heated to cause the substrate to partially reflow and become sticky so that the chip can be attached to the reflowed area.
  • the chip itself is heated. This can be done by first placing the chip on the substrate and then locally heating the chip which causes the substrate to reflow or melt and attaches the chip. The chip heating can be performed by a laser 206 or other known methods. Adhesive for attaching the chip can also be provided as a layer 211 on the substrate. Other attaching means known in the art are contemplated.
  • the chip 205 has at least two electrical contacts that are used for attachment of a radio frequency antenna.
  • the antenna is attached to the contacts (207, 208) and formed in a novel way using wire bonding ( Figure 2B) .
  • a first antenna connection is wire bonded 120 to the first contact using a wire bonding tool.
  • These tools are capable of ultrasonic wedge bonding, ball bonding, laser bonding, laser sonic bonding, thermocompression, soldering, or any combination of these techniques.
  • step 130 the wire is unspooled ( Figure 2C) after the first connection is made.
  • more wire is unspooled than in prior art methods because the unspooled wire is actually used to create the antenna component.
  • the lengths of the wire are determined by the resonant antenna frequency.
  • the wire has to be unspooled at a controlled rate in relation to the rate of travel of the head of the wire bonding tool so as not to place the unspooled wire in tension.
  • This is common practice in the wire bonding industry for short distance of spooled wire, i.e., 1 mm to 3 mm.
  • the present invention requires that this control be over larger distances of wire spooling.
  • the head will be controlled to slow down with respect to the wire feeding so that a curve or loop can be made during the formation of the antenna component. This spooling creates antennas between 10 mm and 1000 mm in length.
  • step 140 the second end of the first wire is cut and the cut end of the wire is left unconnected.
  • the cut can be performed by any well known method including knife blade 213 (swedge, guillotine), mechanical chopper, mechanical pincers. laser, etc.
  • Steps 150, 160, and 170 repeat steps 120, 130, and 140 for a second wire, respectively.
  • the cut end of the wire can be attached in place in several ways (steps 130 and 160).
  • the cut end of the wire can be held in place on the substrate by a small drop of adhesive 169 placed below the cut end. (See also Figures 2D and 2G) .
  • the adhesive 169 is dispensed by nozzle 168.
  • the cut end can also be held in place by locally heating the substrate at the point where the cut end rests so that the substrate becomes sticky and adheres to the cut end. Localized heating of substrates is well known and includes spot application of heat with tools or a laser beam focused 236 at the point of heating.
  • Adhesives are also well know. They include epoxies, silicones, and phenolic-butyral. Note that the wire can be attached (130, 160) prior to or after the cutting (140, 170). If the wire is attached after the cutting, the cut wire end can be temporarily held in place by pressure before attaching it to the substrate.
  • a further way of attaching the cut end to the substrate involves heating (Figure 2E) the wire (131, 132) so that the cut end heats up the substrate at the point of contact and causes the cut end to be attached to the substrate.
  • the wire can be heated 231 by inductive heating 237, resistive heating 235, laser heating 236, or any other method used for this purpose.
  • a portion of the substrate under the wire can be heated (235-237) so that part or all of the wire becomes embedded in the substrate. This effect can also be accomplished by heating (235-237) the wire and applying pressure 246 to part (or all) of the wire so that part (or all) of the wire (131, 132) becomes embedded in the substrate.
  • more than one wire can be attached to an individual contact (208 or 207), spooled out, attached to the substrate, and cut. These wires can be placed at different angles with respect to one another.
  • the chip is covered with a protective encapsulant layer, shown in Figure 2H.
  • a dispensing nozzle 281 places a drop of encapsulant 282 on the surface of the chip 205 to form a protective coating 283.
  • the encapsulant may be an epoxy, silicone, or other polymeric material. In a preferred embodiment the encapsulant is opaque to protect light-sensitive circuits on the chip.
  • step 190 the completed chip and antenna structure is sealed (Figure 21) between organic covers 293 (bottom) and 294 (top) through the use of a roll laminator which presses the sandwich between heated rollers 295 and 296.
  • the organic covers consist of a single layer of polyester, polyethylene, or other organic film that may be softened by heating.
  • the film consists of two layers, an inner layer 297 of the copolymer EVA (ethyl vinyl acetate) and an outer layer 298 of polyester.
  • EVA ethyl vinyl acetate
  • the top layer 294 only one layer, e.g., the top layer 294, need be applied.
  • Figure 3 shows the details for the placement (Figure 3A) of the wire 331, bonding ( Figures 3B and 3C) of the wire, unspooling ( Figure 3D) of the wire, and cutting (Figure 3E) of the wire.
  • the wire 331 is placed on contact pad 307 on semiconductor chip 305 which has been attached to substrate 310.
  • the wire 331 is bonded to the pad 307 using ultrasonic energy 334.
  • the wedge bond 333 has been completed and the bonding head 332 is withdrawn from the surface as wire is spooled out as shown in Figure 3D.
  • the wire is terminated at the specified length and cut by knife edge 340.
  • Figure 4 shows an embodiment 400 of the method in which the wires 431 and 432 are terminated at metal pad termination sites 445 and 446.
  • the top view Figure 4A shows the semiconductor chip 405 on organic substrate 410 with the wires 431 and 432 connected to contacts 445 and 446 on the chip.
  • Figure 4B is a side view.
  • Contacts 445 serve to hold the cut ends of the antenna wires 432 (431) in place.
  • the contacts 445 and 446 can be made of gold, silver, aluminum, copper, nickel, or alloys thereof. These can be deposited as thin layers on the substrate or on another material (like silicon or another metal) that is attached to the surface of the substrate. In a preferred embodiment, no connection other than the antenna wire ends is made to the contacts 445 and 446.
  • Figure 5A shows a continuous strip 500 of semiconductor chips 505, 515, 525, on organic substrate 502 with wires bonded to first and second contacts 507 and 508 on semiconductor chips.
  • the wires 531, 532 are each one-half wavelength long.
  • the strip of tags 501 is cut into segments 541, 542, 543 etc. by knife blade 561 at the position shown by the dotted lines 551 and 552.
  • the knife blade cuts are made half-way between the chips to make the remaining wire segments 533, 534, 535, 536 etc. each one-quarter wavelength long.
  • Figure 5B shows a continuous strip array 501 of semiconductor chips 550, 560, 570, 580, 590 on organic substrate 502 with wires bonded to first and second contacts 551 and 553, 561 and 563, 571 and 573, 574 and 575, 577 and 578 as well as third and fourth contacts 552 and 554, 562 and 564, 594 and 595, 581 and 583, 591 and 593 on the semiconductor chips, respectively.
  • the wires 511, 512, 513, and 514 are each one-half wavelength long.
  • knife blade 561 at the positions shown by the dotted lines 522, 523, 524 etc.
  • the knife blade cuts are made half-way between the chips to make the remaining wire segments 556, 565, 566, 576, 567, 568, etc. each one-quarter wavelength long.
  • the cuts 522, 523, 524, etc. can be made simultaneously by a gang of knife blades 561.
  • the semiconductor chips (typically 590) will have one wire (typically 593A) that will not be connected to a contact on another semiconductor chip.
  • the end of the wire 593A will be terminated in any of the ways describe above.
  • the wire 593A will be terminated to a contact (typically 593B) located on the substrate as shown in Figure 4.
  • Figure 5B shows three rows of semiconductor chips forming an array on the substrate. (One row is shown in Figure 5A. ) However, the number of rows can vary from two to as many as will fit on the substrate.
  • Figure 6 shows a strip of RF tags 610 being cut 650 into individual segments 611, 612, 613 by an array of knife blades 641 and 642.
  • Figure 7 shows the manufacture 700 of a loop antenna through the use of a temporary post wire guide 720.
  • the post 720 is lowered 750 to the substrate 710.
  • the wire 730 is unspooled 130 by the bonding head 740.
  • the wire 730 is guided by the bonding head around the temporary post 720.
  • the process is mirrored at the other end of the substrate and the wire is bonded to contact pad 208 of Figure 2 to form the loop antenna.
  • the temporary post 720 is then raised 751 to complete the process.
  • the wire is attached to the substrate using methods described above.
  • Figure 8 shows the manufacture 800 of a loop antenna through the use of an embossed stud 820 wire guide.
  • the stud 820 is permanently embossed in the substrate 810.
  • the wire 830 is first bonded to contact pad 207 of Figure 2, the wire is unspooled by the bonding head 840. It is guided by the bonding head around the embossed stud 820.
  • the process is mirrored at the other end of the substrate and the wire is bonded to contact pad 208 of Figure 2 to form the loop antenna.
  • the stud 820 remains in place on the substrate.
  • Figure 9 shows the manufacture 900 of a loop antenna through the use of a raised flap wire guide 920.
  • the flap is pre-punched into the substrate 910 by a punching tool.
  • the flap 920 is then raised in the substrate 910 by mechanical methods such as an air jet 925 or pin 926.
  • the wire 930 is first bonded to contact pad 207 of Figure 2, the wire is unspooled by the bonding head 940. It is guided by the bonding head around the raised flap 920.
  • the process is mirrored at the other end of the substrate and the wire is bonded to contact pad 208 of Figure 2 to form the loop antenna.
  • the mechanical raising means 925 is removed, the flap 920 relaxes, and the flap 920 holds the wire 930 in place on the substrate.
  • the wire can be attached to the substrate by any of the methods described above, e.g., heat and/or pressure.
  • Figure 10 shows the completion of a tag 1000 by means of the application of heat 1064 and pressure 1065.
  • Multiple antennas 1020 (and 1030) have been created by the bonding of wire 1025 (and 1035) to contact pads 1006 and 1008 (1007 and 1009), on semiconductor chip 1010.
  • Encapsulant 1030 has been dispensed to cover the chip 1005 and contact pads (1006-1009).
  • the substrate 1040 is placed below organic cover 1045.
  • the organic cover consists of an outer layer of PET 1060 and an inner layer of EVA 1050. Heat 1064 and pressure 1065 are applied to seal the package.
  • a bottom cover 1046 is place below the tag and is laminated simultaneously with top cover 1045.
  • PET is also known as polyester.
  • a method for making a radio frequency tag comprising the steps of:
  • first and second wire form an antenna that receives a signal at the frequency, the signal being modulated by the semiconductor logic and the modulated signal being transmitted by the antenna.
  • first and second length are equal to one quarter wavelength of the frequency.
  • encapsulant is any encapsulant including epoxy, silicone, or polymeric material.
  • chip-attaching adhesive is any adhesive including acrylics, silicones, and urethanes.
  • wires are attached to the substrate by a wire-attaching adhesive.
  • wire-attaching adhesive is any adhesive including epoxies, silicones, and phenolic-butyral.
  • top organic cover is a single layer.
  • top organic cover is made of any organic film including polyester and polyethylene and is attached to the substrate, semiconductor and wires by heating.
  • top organic cover has an outer and inner layer, the outer layer being an organic film and the inner layer being a cover adhesive.
  • cover adhesive is sensitive and the cover is attached to the substrate, semiconductor and wires by heating.
  • cover adhesive is a copolymer including ethyl vinyl acetate (EVA).
  • cover adhesive is pressure sensitive and the cover is attached to the substrate, semiconductor and wires by pressure.
  • a method for making a radio frequency tag comprising the steps of:
  • a method for making a radio frequency tag comprising the steps of:
  • first and second wire form a antenna that receives a signal at the frequency, the signal being modulated by the semiconductor logic and the modulated signal being transmitted by the antenna.
  • a method for making a radio frequency tag comprising the steps of:
  • the wire forms a folded dipole antenna that receives a signal at the frequency, the signal being modulated by the semiconductor logic and the modulated signal being transmitted by the antenna.
  • one or more guides is a temporary post temporarily in contact with the substrate.
  • a method for making a plurality radio frequency tags comprising the steps of:
  • first, second, third, and fourth wires form two antennas that receive a signal at the frequency, the signal being modulated by the semiconductor logic and the modulated signal being transmitted by the antenna.
  • connection contact is a contact on a fifth semiconductor and the fourth wire is cut between the first and fifth semiconductor.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Details Of Aerials (AREA)

Abstract

Un identificateur H.F. et son système d'antenne sont fabriqués par microcâblage. Une puce à semi-conducteur est fixée sur un substrat pelliculaire organique. L'antenne, constituée d'un ou deux fils minces, est produite sur le substrat puis raccordée aux contacts de la puce au moyen d'un appareil de microcâblage. L'invention décrit également d'autres modes de réalisation qui mettent en ÷uvre une multitude de semi-conducteurs sur une bande de substrat. La puce peut être protégée par un agent d'enrobage et l'ensemble puce-antenne peut être scellé entre des couches de pellicule organique.
PCT/EP1995/003703 1994-10-27 1995-09-20 Procede de fabrication d'identificateurs h.f. WO1996013793A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33028894A 1994-10-27 1994-10-27
US08/330,288 1994-10-27

Publications (1)

Publication Number Publication Date
WO1996013793A1 true WO1996013793A1 (fr) 1996-05-09

Family

ID=23289095

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1995/003703 WO1996013793A1 (fr) 1994-10-27 1995-09-20 Procede de fabrication d'identificateurs h.f.

Country Status (6)

Country Link
JP (1) JP2818392B2 (fr)
KR (1) KR100192728B1 (fr)
HU (1) HUT76992A (fr)
TW (1) TW280897B (fr)
WO (1) WO1996013793A1 (fr)
ZA (1) ZA957085B (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000044040A1 (fr) * 1999-01-22 2000-07-27 Seiko Epson Corporation Technique de soudage de fils, dispositif semi-conducteur, carte de circuit imprime, dispositif electronique et poste de soudure
US6732923B2 (en) * 2001-04-04 2004-05-11 Ncr Corporation Radio frequency identification system and method
WO2006022836A1 (fr) 2004-08-06 2006-03-02 International Business Machines Corporation Appareils et procédes de construction d’antennes utilisant des soudures de fils comme éléments rayonnants
US7586193B2 (en) 2005-10-07 2009-09-08 Nhew R&D Pty Ltd Mm-wave antenna using conventional IC packaging
US7768456B2 (en) 2006-12-27 2010-08-03 Kabushiki Kaisha Toshiba Antenna device and radio communication device
US9160055B2 (en) 2012-12-12 2015-10-13 Kabushiki Kaisha Toshiba Wireless device
US9178269B2 (en) 2011-07-13 2015-11-03 Kabushiki Kaisha Toshiba Wireless apparatus
US9184492B2 (en) 2010-09-24 2015-11-10 Kabushiki Kaisha Toshiba Radio device
US9245866B2 (en) 2010-01-05 2016-01-26 Kabushiki Kaisha Toshiba Antenna device and wireless apparatus
US9543641B2 (en) 2011-07-13 2017-01-10 Kabushiki Kaisha Toshiba Wireless apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6472747B2 (en) * 2001-03-02 2002-10-29 Qualcomm Incorporated Mixed analog and digital integrated circuits
JP4347340B2 (ja) * 2004-05-18 2009-10-21 株式会社日立製作所 無線ｉｃタグ及びその製造方法
KR101038493B1 (ko) * 2004-11-12 2011-06-01 삼성테크윈 주식회사 극초단파용 라디오 주파수 인식태그 제조방법
CA2602260A1 (fr) 2005-03-25 2006-10-05 Toray Industries, Inc. Antenne plane et procede de fabrication correspondant
TW201325842A (zh) * 2011-12-16 2013-07-01 hong-ren Li 工具盒結構
CN107210293B (zh) * 2014-12-19 2019-12-17 Glo公司 背板上的发光二极管阵列及其制造方法

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Publication number Priority date Publication date Assignee Title
GB1461986A (en) * 1974-04-30 1977-01-19 Central Glass Co Ltd Strand pasting device
WO1993018493A1 (fr) * 1992-03-03 1993-09-16 N.V. Nederlandsche Apparatenfabriek Nedap Procede de fabrication d'une etiquette de detection a hautes frequences avec un minimum de composants electroniques
DE4319878A1 (de) * 1992-06-17 1993-12-23 Micron Technology Inc Hochfrequenz-Identifikationseinrichtung (HFID) und Verfahren zu ihrer Herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1461986A (en) * 1974-04-30 1977-01-19 Central Glass Co Ltd Strand pasting device
WO1993018493A1 (fr) * 1992-03-03 1993-09-16 N.V. Nederlandsche Apparatenfabriek Nedap Procede de fabrication d'une etiquette de detection a hautes frequences avec un minimum de composants electroniques
DE4319878A1 (de) * 1992-06-17 1993-12-23 Micron Technology Inc Hochfrequenz-Identifikationseinrichtung (HFID) und Verfahren zu ihrer Herstellung

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437453B1 (en) 1999-01-22 2002-08-20 Seiko Epson Corporation Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device
WO2000044040A1 (fr) * 1999-01-22 2000-07-27 Seiko Epson Corporation Technique de soudage de fils, dispositif semi-conducteur, carte de circuit imprime, dispositif electronique et poste de soudure
US6732923B2 (en) * 2001-04-04 2004-05-11 Ncr Corporation Radio frequency identification system and method
WO2006022836A1 (fr) 2004-08-06 2006-03-02 International Business Machines Corporation Appareils et procédes de construction d’antennes utilisant des soudures de fils comme éléments rayonnants
US7295161B2 (en) 2004-08-06 2007-11-13 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
US8087155B2 (en) 2005-10-07 2012-01-03 Nhew R&D Pty Ltd Method of forming an integrated circuit with MM-wave antennas using conventional IC packaging
US7586193B2 (en) 2005-10-07 2009-09-08 Nhew R&D Pty Ltd Mm-wave antenna using conventional IC packaging
US7768456B2 (en) 2006-12-27 2010-08-03 Kabushiki Kaisha Toshiba Antenna device and radio communication device
US9245866B2 (en) 2010-01-05 2016-01-26 Kabushiki Kaisha Toshiba Antenna device and wireless apparatus
US9184492B2 (en) 2010-09-24 2015-11-10 Kabushiki Kaisha Toshiba Radio device
US9178269B2 (en) 2011-07-13 2015-11-03 Kabushiki Kaisha Toshiba Wireless apparatus
US9543641B2 (en) 2011-07-13 2017-01-10 Kabushiki Kaisha Toshiba Wireless apparatus
US9160055B2 (en) 2012-12-12 2015-10-13 Kabushiki Kaisha Toshiba Wireless device

Also Published As

Publication number Publication date
JP2818392B2 (ja) 1998-10-30
KR960016656A (ko) 1996-05-22
HUT76992A (hu) 1998-01-28
KR100192728B1 (ko) 1999-06-15
TW280897B (fr) 1996-07-11
ZA957085B (en) 1996-03-11
JPH08213419A (ja) 1996-08-20

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