KR100192728B1 - 무선 주파수 태그 제조 방법 - Google Patents
무선 주파수 태그 제조 방법 Download PDFInfo
- Publication number
- KR100192728B1 KR100192728B1 KR1019950036741A KR19950036741A KR100192728B1 KR 100192728 B1 KR100192728 B1 KR 100192728B1 KR 1019950036741 A KR1019950036741 A KR 1019950036741A KR 19950036741 A KR19950036741 A KR 19950036741A KR 100192728 B1 KR100192728 B1 KR 100192728B1
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- attaching
- substrate
- chip
- semiconductor
- Prior art date
Links
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- 239000004065 semiconductor Substances 0.000 claims abstract description 58
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- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 claims description 5
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- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 2
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- 229910052751 metal Inorganic materials 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
- G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
- G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L24/78—Apparatus for connecting with wire connectors
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- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33028894A | 1994-10-27 | 1994-10-27 | |
US8/330,288 | 1994-10-27 |
Publications (2)
Publication Number | Publication Date |
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KR960016656A KR960016656A (ko) | 1996-05-22 |
KR100192728B1 true KR100192728B1 (ko) | 1999-06-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019950036741A KR100192728B1 (ko) | 1994-10-27 | 1995-10-24 | 무선 주파수 태그 제조 방법 |
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JP (1) | JP2818392B2 (fr) |
KR (1) | KR100192728B1 (fr) |
HU (1) | HUT76992A (fr) |
TW (1) | TW280897B (fr) |
WO (1) | WO1996013793A1 (fr) |
ZA (1) | ZA957085B (fr) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
JP2000216188A (ja) | 1999-01-22 | 2000-08-04 | Seiko Epson Corp | ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置 |
US6472747B2 (en) * | 2001-03-02 | 2002-10-29 | Qualcomm Incorporated | Mixed analog and digital integrated circuits |
US6732923B2 (en) * | 2001-04-04 | 2004-05-11 | Ncr Corporation | Radio frequency identification system and method |
US7692545B2 (en) * | 2004-05-18 | 2010-04-06 | Hitachi, Ltd. | Wireless IC tag and process for manufacturing the same |
US7295161B2 (en) | 2004-08-06 | 2007-11-13 | International Business Machines Corporation | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
KR101038493B1 (ko) * | 2004-11-12 | 2011-06-01 | 삼성테크윈 주식회사 | 극초단파용 라디오 주파수 인식태그 제조방법 |
CN101147295B (zh) | 2005-03-25 | 2012-10-03 | 东丽株式会社 | 平面天线及其制造方法 |
US7586193B2 (en) | 2005-10-07 | 2009-09-08 | Nhew R&D Pty Ltd | Mm-wave antenna using conventional IC packaging |
JP4316607B2 (ja) | 2006-12-27 | 2009-08-19 | 株式会社東芝 | アンテナ装置及び無線通信装置 |
WO2011083502A1 (fr) | 2010-01-05 | 2011-07-14 | 株式会社 東芝 | Dispositif d'antenne et sans fil |
JP5172925B2 (ja) | 2010-09-24 | 2013-03-27 | 株式会社東芝 | 無線装置 |
JP5417389B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
JP5414749B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
TW201325842A (zh) * | 2011-12-16 | 2013-07-01 | hong-ren Li | 工具盒結構 |
JP6121705B2 (ja) | 2012-12-12 | 2017-04-26 | 株式会社東芝 | 無線装置 |
JP6823893B2 (ja) * | 2014-12-19 | 2021-02-03 | グロ アーベーGlo Ab | バックプレーン上に発光ダイオードアレイを生成する方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2519054C3 (de) * | 1974-04-30 | 1978-08-03 | Central Glass Co., Ltd., Ube, Yamaguchi (Japan) | Vorrichtung zum Aufbringen eines Drahtes auf eine Trägerfolie aus thermoplastischem Kunststoff nach einem vorgegebenen Muster |
NL9200396A (nl) * | 1992-03-03 | 1993-10-01 | Nedap Nv | Radiofrequente identificatielabel met relatief grote detectie-afstand en een minimum aantal electronische componenten. |
DE4345610B4 (de) * | 1992-06-17 | 2013-01-03 | Micron Technology Inc. | Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID) |
-
1995
- 1995-05-09 TW TW084104596A patent/TW280897B/zh active
- 1995-08-23 ZA ZA957085A patent/ZA957085B/xx unknown
- 1995-09-20 HU HU9701699A patent/HUT76992A/hu unknown
- 1995-09-20 WO PCT/EP1995/003703 patent/WO1996013793A1/fr not_active Application Discontinuation
- 1995-10-18 JP JP7269856A patent/JP2818392B2/ja not_active Expired - Lifetime
- 1995-10-24 KR KR1019950036741A patent/KR100192728B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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ZA957085B (en) | 1996-03-11 |
WO1996013793A1 (fr) | 1996-05-09 |
TW280897B (fr) | 1996-07-11 |
HUT76992A (hu) | 1998-01-28 |
JP2818392B2 (ja) | 1998-10-30 |
JPH08213419A (ja) | 1996-08-20 |
KR960016656A (ko) | 1996-05-22 |
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