KR960016656A - 무선 주파수 태그 제조 방법 - Google Patents

무선 주파수 태그 제조 방법 Download PDF

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Publication number
KR960016656A
KR960016656A KR1019950036741A KR19950036741A KR960016656A KR 960016656 A KR960016656 A KR 960016656A KR 1019950036741 A KR1019950036741 A KR 1019950036741A KR 19950036741 A KR19950036741 A KR 19950036741A KR 960016656 A KR960016656 A KR 960016656A
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South Korea
Prior art keywords
wire
attaching
semiconductor
contact
substrate
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Application number
KR1019950036741A
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English (en)
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KR100192728B1 (ko
Inventor
존 브래디 마이클
안토니 코피노 토마스
켄트 하인리히 할리
월덴 존슨 글렌
앤드류 모스코위츠 폴
머피 필립
프레데릭 워커 조지
Original Assignee
윌리암 티. 엘리스
인터내셔널 비지네스 머신즈 코포레이션
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Publication of KR960016656A publication Critical patent/KR960016656A/ko
Application granted granted Critical
Publication of KR100192728B1 publication Critical patent/KR100192728B1/ko

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
    • G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
    • G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
    • G06K7/086—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive sensing passive circuit, e.g. resonant circuit transponders
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Abstract

와이어 결합(wire bonding)을 이용하여 무선 주파수 태그(radio frequency tag) 및 그 안테나 구조(antenna structure)가 제조된다. 반도체 칩은 유기체막 기판(organic film substrate)상에 위치되어 부착된다. 하나 이상의 얇은 와이어(one or more thin wires)로 구성되는 안테나는 기판 상에서 생성되고 와이어 결합 머쉰(a wire bonding machine)을 이용하여 칩 상의 접점에 접속된다. 기판의 조각(a stirp of substrate)상에서 다수의 반도체(a plurality of semiconductors)를 이용하는 다른 실시예가 또한 개시된다. 이 칩은 캡슐 재료(encapsulant)로 보호될 수도 있고, 칩 및 안테나 결합은 유기체막으로 된 층 사이에 밀봉(seal)될 수 있다.

Description

무선 주파수 태그 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 단계를 예시하는 흐름도.

Claims (36)

  1. a. 유기체 기판(an organic substrate)상에 반도체를 부착하는 단계로서, 상기 반도체는 제1 및 제2접점(a first and second contact), 메모리 (memory) 및, 무선 주파수 신호(a radio frequendy signal)를 소정의 주파수로 변조하는 로직(logic)을 갖는 상기 부착하는 단계와; b. 와이어 결합 머쉰(a wire bonding machine)을 이용하여 제1와이어(a first wire)의 결합된 단부(a bonded end)를 상기 제1접점에 부착하는 단계와; c. 상기 와이어 결합 머쉰으로 상기 제1와이어를 제1길이(a first length)로 스풀링(spooling)하는 단계와; d. 상기 제1와이어를 상기 유기체 기판에 부착하는 단계와; e. 제1절단 단부(a first cut end)에서 상기 제1와이어를 상기 제1길이로 절단(cutting)하는 단계와; f. 와이어 결합 머쉰을 이용하여 제2와이어(a second wire)의 결합된 단부를 상기 제2접점에 부착하는 단계와; g. 상기 와이어 결합 머쉰으로 상기 제2와이어를 제2길이(a second length)로 스풀링하는 단계와; h. 상기 제2와이어를 상기 유기체 기판에 부착하는 단계와; i. 제2절단단부(a second cut end)에서 상기 제2와이어를 상기 제2길이로 절단하는 단계를 포함하되, 상기 제1 및 제2와이어는 상기소정 주파수로 신호를 수신하는 안테나(an antenna)를 형성하고, 상기 신호는 상기 반도체 로직에 의해 변조되며, 상기 변조된 신호는 상기 안테나에 의해 전송되는 무선 주파수 태그 제조 방법.
  2. 제1항에 있어서, 상기 제1 및 제2길이는 상기 주파수의 4분의 1파장(one quarter length)인 무선 주파수 태그 제조 방법.
  3. 제1항에 있어서, 소정의 캐슐 재료(an encapsulant)로 상기 반도체와 상기 제1 및 제2접점을 캡슐로 싸는(encapsulating) 단계로 더 포함하는 무선 주파수 태그 제조 방법.
  4. 제3항에 있어서, 상기 캡슐 제료는 에폭기(epoxy), 실리콘(silicone), 또는 중합체(polymeric) 재료를 포함하는 소정의 캡슐 재료인 무선 주파수 태그 제조 방법.
  5. 제1항에 있어서, 상기 반도체는 칩-부착용 접착제(a chip-attachig adhesive)로 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  6. 제5항에 있어서, 상기 칩-부착 접착제는 아크릴(acrylics), 실리콘(silicone) 및 우레탄(urethanes)을 포함하는 소정의 접착제인 무선 주파수 태그 제조 방법.
  7. 제1항에 있어서, 상기 반도체는 상기 기판을 가열함으로써 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  8. 제1항에 있어서, 사기 반도체를 가열함으로써 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  9. 제1항에 있어서, 상기 와이어는 와이어-부착용 접착제(a wire-attaching adhesi ve)에 의해 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  10. 제9항에 있어서, 상기 와이어-부착용 접착제는 에폭시, 실리콘 및 페놀-부티럴(phenolic-butyral)을 포함하는 소정의 접착제인 무선 주파수 태그 제조 방법.
  11. 제1항에 있어서, 상기 와이어는 상기 반도체를 가열함으로써 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  12. 제1항에 있어서, 상기 와이어를 가열함으로써 상기 와이어가 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  13. 제1항에 있어서, 상기 기판, 반도체 및 상기 제1 및 제2와이어를 상부 유기체 커버(a top organic cover)로 밀봉(sealing)하는 단계를 더 포함하는 무선 주파수 태그 제조 방법.
  14. 제13항에 있어서, 상기 상부 유기체 커버는 단일 층(a single layer)인 무선 주파수 태그 제조 방법.
  15. 제14항에 있어서, 상기 상부 유기체 커버는 폴리에스테르(ployester)와 폴리에틸렌(polyethylene)을 포함하는 소정의 유기체 막으로 제조되어, 가열에 의해 상기 기판, 반도체 및 와이어에 부착되는 무선 주파수 태그 제조 방법.
  16. 제13항에 있어서, 상기 상부 유기체 커버는 외층 및 내층(an outer and inner layer)을 구비하고, 상기 외층은 유기체 막(organic film)이고, 상기 내층은 커버 접착제(a cover adhesive)인 무선 주파수 태그 제조 방법.
  17. 제16항에 있어서, 상기 커버 접착제는 열에 민감하고(heat sensitive), 상기 커버는 가열에 의해 상기기판, 반도체 및 와이어에 부착되는 무선 주파수 태그 제조 방법.
  18. 제17항에 있어서, 상기 커버 부착하기 위한 압력이 또한 부가되는 무선 주파스 태그 제조 방법.
  19. 제17항에 있어서, 상기 커버 접착제는 에틸 비닐 아세테이트(ethyl vinyl acetate;EVA)를 포함하는 공중합체(copolymer)인 무선 주파수 태그 제조 방법.
  20. 제16항에 있어서, 상기 커버 접착제는 압력에 민감하고(pressure sensitive), 상기 커버는 압력에 의해 상기 기판, 반도체, 와이어에 부착되는 무선 주파수 태그 제조 방법.
  21. 제20항에 있어서, 사기 커버 접착제는 아크릴, 실리콘 및 우레탄을 포함하는 접착제인 무선 주파수 태그 제조 방법.
  22. 제1항에 있어서, 상기 기판의 상부는 부착된 상부 커버(an attached top cover)에 의해 덮히고, 상기 기판의 하부는 부착된 하부 커버(an attached bottom cover)에 의해 덮이는 무선 주파수 태그 제조 방법.
  23. a. 유기체 기판상에 반도체를 부착하는 단계로서, 상기 반도체는 제1 및 제2접점 메모리 및, 무선 주파수 신호를 소정의 주파수로 변조하는 로직을 갖는 상기 부착하는 단계와; b. 와이어 결합 머쉰을 이용하여 제1와이어의 제1결합된 단부 (a first bonded end)를 상기 제1칩접점에 부착하는 단계와; c. 상기 와이어 결합 머쉰으로 상기 제1와이어를 제1길이로 스풀링하는 단계와; d. 상기 제1와이어를 제1절단 단부(a first cou end)를 상기 유기체 기판 상의 제1종결 지점(a first termination site)에 부착하는 단계와; e. 제1절단 단부에서 상기 제1와이어를 상기 제1길이로 절단하는 단계와; f. 와이어 결합 머쉰을 이용하여 제2와이어의 제2결합 단부(a econd bonded end)를 상기 제2접점에 부착하는 단계와; g. 상기 와이어 결합 머쉰으로 상기 제2와이어를 제2길이로 스폴링하는 단계와; h. 상기 제2와이어의 제2절단 단부(a second cut end)를 상기 유기체기판 상의 제2종결 지점(a second termination end)에 부착하는 단계와; i. 제2절단 단부에서 상기 제2와이어를 상기 제2길이로 절단하는 단계를 포함하되, 상기 제1 및 제2와이어는 상기소정 주파수로 신호를 수신하는 안테나를 형성하고, 상기 신호는 상기 반도체 로직에 의해 변조되며, 상기 변조된 신호는 상기 안테나에 의해 전송되는 무선 주파수 태그 제조 방법.
  24. 제23항에 있어서, 상기 제1 및 제2길이는 상기 주파수의 4분의 1파장(one quarter wavelength)인 무선 주파수 태그 제조 방법.
  25. a. 유기체 기판의 조각(a strip of organic substrate)상에 세개 이상의 반도체(three for more semiconductors)를 부착하는 단계로서, 상기 각 반도체는 제1 및 제2접점, 메모리 및, 무선 주파수 신호를 소정의 주파수로 변조하는 로직을 갖는 상기 부착하는 단계와; b, 와이어 결합 머쉰을 이용하여 제1와이어의 제1결합단부를 제1칩(a first chip)상의 상기 제1칩 접점에 부착하는 단계와; c. 상기 와이어 결합 머쉰으로 상기 제1와이어를 제1길이로 스풀링하는 단계와; d. 와이어 결합 머쉰을 이용하여 상기 제1와이어의 제1절단 단부를 상기 제2칩상의 제2칩 접점에 부착하는 단계와; e. 상기 제1절단 단부에서 상기 제1와이어를 상기 제1길이로 절단하는 단계와; f. 와이어 결합 머쉰을 이용하여 제2와이어의 제2결합단부를 상기 제1칩의 상기 제2접점에 부착하는 단계와; g. 상기 와이어 결합 머쉰으로 상기 제2와이어를 제2길이로 스풀링하는 단계와; h. 와이어 결합 머쉰을 사용하여 상기 제2와이어의 제2절단 단부를 제3칩(a third chip)상의 제1칩 접점에 부착하는 단계와; i. 제2절단 단부에서 상기 제2와이어를 상기 제2길이로 절단하는 단계와; j. 상기 제1 및 제2반도체사이의 상기 제1와이어를 절단하고 상기 제1 및 제3반도체 사이의 상기 제2와이어를 절단하는 단계를 포함하되, 상기 제1 및 제2와이어는 상기 주파수로 신호를 수신하는 안테나를 형성하고, 상기 신호는 상기 반도체 로직에 의해 변조되며, 상기 변조된 신호는 상기 안테나에 의해 전송되는 무선 주파수 태그 제조 방법.
  26. a. 유기체 기판상에 반도체를 부착하는 단계로서, 상기 반도체는 제1 및 제2접점 메모리 및, 무선 주파수 신호를 소정의 주파수로 변조하는 로직을 갖는 상기 부착하는 단계와; b. 와이어 결합 머쉰을 이용하여 와이어의 제1결합된 단부를 상기 제1접점에 부착하는 단계와; c. 상기 와이어 결합 머쉰으로 상기 제1와이어를 하나 이상의 와이어 가이드(one or more wire guides)둘레로 스풀링하는 단계와; d. 와이어 결합 머쉰을 이용하여 상기 와이어의 상기 절단단부를 상기 제2접점에 부착하는 단계와; e. 상기 제2접점에 위치된 절단 단부에서 상기 와이어를 소정의 길이로 절단하는 단계를 포함하되, 상기 와이어는 상기 주파수로 신호를 수신하는 접힌 쌍극자 안테나(folded dipole antenna)를 형성하고, 상기 신호는 상기 반도체 로직에 의해 변조되며, 상기 변조된 신호는 상기 안테나에 의해 전동되는 무선 주파수 태그 제조 방법.
  27. 제26항에 있어서, 상기 반도체는 두 쌍 이상의 제1 및 제2접점(two or more pairs of first and second contacts)을 갖고, 상기 단계 a 내지 e는 하나를 초과하는 접힌 다이폴 안테나(more than one folded dipole antenna)를 생성하도록 접점의 각 쌍에 대해 반복되는 무선 주파수 태그 제조 방법.
  28. 제26항에 있어서, 하나 이상의 가이드(one or more guides)는 기판에서 엠보스된 스터드(a stud embossed)인 무선 주파수 태그 제조 방법.
  29. 제26항에 있어서, 하나 이상의 가이드는 기판과 임시적으로 접촉하는 임시 포스트(a temporary post)인 무선 주파수 태그 제조 방법.
  30. 제29항에 있어서, 상기 와이어는 열에 의해 상기 기판에 부착되는 무선 주파수 태그 제조 방법.
  31. 제26항에 있어서, 하나 이상의 가이드는 기판에 펀치된 플랩(a flap punched)인 무선 주파수 태그 제조 방법.
  32. 제31항에 있어서, 상기 플랩은, 상기 결합 머쉰에 루프되어(looped)있는 와이어를 포착하기 위해 공기 분사(air jet)에 의해 상승되는 무선 주파수 태그 제조 방법.
  33. 제31항에 있어서, 상기 플랩은 핀(pin)에 의해 상승되는 무선 주파수 태그 제조 방법.
  34. a. 유기체 기판의 조각상에 넷 이상의 반도체(four or more semiconductors)를 소정의 어레이로 부착하는 단계로서, 상기 각 반도체는 제1, 제2, 제3 및 제4접점(a first, second, third and fourth chip contact), 메모리 및, 무선 주파수 신호를 소정의 주파수로 변조하는 로직을 갖는 상기 부착하는 단계와; b. 와이어 결합 머쉰을 이용하여 제1와이어의 제1결합단부를 제1칩상의 상기 제1칩 접점에 부착하는 단계와; c. 상기 와이어 결합 머쉰으로 상기 제1와이어를 제1길이로 스폴링하는 단계와; d. 와이어 결합 머쉰을 이용하여 상기 제1와이어의 제1절단 단부를 상기 제2칩 상의 상기 제2칩 접점에 부착하는 단계와; e. 제1절단 단부에서 상기 제1와이어를 상기 제1길이로 절단하는 단계와; f. 와이어 결합 머쉰을 이용하여 제2와이어의 제2결합단부를 상기 제1칩의 상기 제2접점에 부착하는 단계와; g. 상기 와이어 결합 머쉰으로 사이 제2와이어를 제2길이로 스풀링하는 단계와; h. 상기 와이어 결합 머쉰을 이용하여 상기 제2와이어의 제2절단 단부를 제3칩상의 제1칩 접점에 부착하는 단계와; i. 상기 제2절단 단부에서 상기 제2와이어를 상기 제2길이로 절단하는 단계와; j. 상기 와이어결합 머쉰을 이용하여 상기 제3와이어의 제3결합 단부를 상기 제1칩 상의 상기 제3칩 접점에 부착하는 단계와; k. 상기 와이어 결합 머쉰으로 상기 제3와이어를 제3길이로 스풀링하는 단계와; I. 상기 와이어 결합 머쉰을 이용여 상기 제3와이어의 제3절단 단부를 제4칩상의 제4칩 접점에 부착하는 단계와; m. 제3절단 단부에서 상기 제3와이어를 상기 제3길이로 절단하는 단계와; n. 상기 와이어 결합 머쉰을 이용하여 제4와이어의 제4결합 단부를 상기 제1칩 상의 상기 제4칩 접점에 부착하는 단계와; o. 사이 와이어 결합 머쉰으로 상기 제4와이어를 제4길이로 스풀링하는 단계와; p. 상기 제4와이어의 제4절단 단부를 상기 기판상의 접속 접점(a connection contact)에 부착하는 단계와, q. 제4절단 단부에서 상기 제4와이어를 상기 제4길이로 절단하는 단계와; r. 상기 제1 및 제2반도체 사이의 상기 제1와이어를 절단하고, 상기 제1 및 제3반도체 사이의 상기 제2와이어를 절단하여, 상기 제1 및 제4반도체 사이의 상기 제2와이어를 절단하는 단계를 포함하되, 상기 제1, 제2, 제3 및 제4와이어는 상기 주파수로 신호를 수신하는 두개의 안테나를 형성하고, 상기 신호는 상기 반도체 로직에 의해 변조되며, 상기 변조된 신호는 상기 안테나에 의해 전송되는 무선 주파수 태그 제조 방법.
  35. 제34항에 있어서, 상기 접속 접점은 제5반도체(a fifth semiconductor)상의 접점이고, 상기 제4와이어는 상기 제1 및 제5반도체 사이에서 절단되는 무선 주파수 태그 제조 방법.
  36. 제34항에 있어서, 상기 두개의 안테나 각각은 동일한 길이로된 두개의 와이어 요소를 갖는 무선 주파수 태그 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950036741A 1994-10-27 1995-10-24 무선 주파수 태그 제조 방법 KR100192728B1 (ko)

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WO1996013793A1 (en) 1996-05-09
HUT76992A (hu) 1998-01-28
TW280897B (ko) 1996-07-11
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KR100192728B1 (ko) 1999-06-15
JP2818392B2 (ja) 1998-10-30

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