HUP0300366A2 - Monolithically integrated semiconductor component - Google Patents

Monolithically integrated semiconductor component

Info

Publication number
HUP0300366A2
HUP0300366A2 HU0300366A HUP0300366A HUP0300366A2 HU P0300366 A2 HUP0300366 A2 HU P0300366A2 HU 0300366 A HU0300366 A HU 0300366A HU P0300366 A HUP0300366 A HU P0300366A HU P0300366 A2 HUP0300366 A2 HU P0300366A2
Authority
HU
Hungary
Prior art keywords
charge
area
carrying
charge carrier
areas
Prior art date
Application number
HU0300366A
Other languages
English (en)
Inventor
Robert Plikat
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of HUP0300366A2 publication Critical patent/HUP0300366A2/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7806—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a Schottky barrier diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692—Surface layout
    • H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

A találmány tárgya monolitikusan integrált félvezető eszköz, melyrendelkezik első töltéshordozó-típussal szennyezett első töltéshordozóterülettel (12), legalább két, az első töltéshordozó területen (12)belül egymástól elkülönítve kiképzett, az első töltéshordozóterülettel ellentétes töltéshordozó típussal szennyezett másodiktöltéshordozó területtel (14) és a második töltéshordozó területeken(14) belül kiképzett, szintén első töltéshordozó típussal szennyezettharmadik töltéshordozó területtel (16), ahol a második töltéshordozóterületek (14) és a harmadik töltéshordózó területek (16) közötti PN-átmenetek (22) érintkezővel (20) rövidre vannak zárva (source-csatlakozó), az első töltéshordozó terület (12) érintkezővel (18) vanellátva (drain-csatlakozó) és a második töltéshordozó területek (14)az első töltéshordozó terület (12) és a harmadik töltéshordozóterületek (16) közötti tartományban érintkező (26) segítségévelinvertálhatók, továbbá csatlakoztatva van legalább egy, az elsőtöltéshordozó területtel (12) és a harmadik töltéshordozó területtel(16) párhuzamosan kapcsolt Schottky-dióda (30). A találmány szerintielső töltéshordozó területen (12) további érintkező (28) vankiképezve, és ezen az érintkezőn az első töltéshordozó terület (12)felszínhez közeli töltéshordozó koncentrációjától függően továbbifelszínhez közeli, magasabb töltéshordozó koncentrációjú töltéshordozóterület (32) van kialakítva, így ohmos kapcsolat jön létre és ez alegalább egy Schottky-dióda (30) anódcsatlakozójával össze van kötve. Ó
HU0300366A 2000-02-24 2001-02-23 Monolithically integrated semiconductor component HUP0300366A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10008545A DE10008545A1 (de) 2000-02-24 2000-02-24 Monolithisch integriertes Halbleiterbauelement
PCT/DE2001/000708 WO2001067515A1 (de) 2000-02-24 2001-02-23 Monolithisch integriertes halbleiterbauelement

Publications (1)

Publication Number Publication Date
HUP0300366A2 true HUP0300366A2 (en) 2003-09-29

Family

ID=7632172

Family Applications (1)

Application Number Title Priority Date Filing Date
HU0300366A HUP0300366A2 (en) 2000-02-24 2001-02-23 Monolithically integrated semiconductor component

Country Status (9)

Country Link
US (1) US6784487B2 (hu)
EP (1) EP1259989B1 (hu)
JP (1) JP2003526923A (hu)
KR (1) KR100712165B1 (hu)
CZ (1) CZ20022847A3 (hu)
DE (2) DE10008545A1 (hu)
HU (1) HUP0300366A2 (hu)
TW (1) TW499761B (hu)
WO (1) WO2001067515A1 (hu)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20022700A1 (it) * 2002-12-20 2004-06-21 St Microelectronics Srl Dispositivo integrato con diodo schottky e transitor mos
US7528459B2 (en) * 2003-05-27 2009-05-05 Nxp B.V. Punch-through diode and method of processing the same
US7072495B2 (en) * 2003-07-30 2006-07-04 Xerox Corporation System and method for measuring and quantizing document quality
US6917082B1 (en) * 2004-01-26 2005-07-12 Altera Corporation Gate-body cross-link circuitry for metal-oxide-semiconductor transistor circuits
US7821097B2 (en) * 2006-06-05 2010-10-26 International Business Machines Corporation Lateral passive device having dual annular electrodes
KR100780967B1 (ko) * 2006-12-07 2007-12-03 삼성전자주식회사 고전압용 쇼트키 다이오드 구조체

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3507181A1 (de) * 1985-03-01 1986-09-04 IC - Haus GmbH, 6501 Bodenheim Schaltungsanordnung zur vermeidung parasitaerer substrat-effekte in integrierten schaltkreisen
US4811065A (en) 1987-06-11 1989-03-07 Siliconix Incorporated Power DMOS transistor with high speed body diode
JPH03110867A (ja) * 1989-09-26 1991-05-10 Nippon Inter Electronics Corp 縦型電界効果トランジスタ
JPH05291507A (ja) * 1992-04-07 1993-11-05 Fujitsu Ltd 拡散抵抗
US5973367A (en) * 1995-10-13 1999-10-26 Siliconix Incorporated Multiple gated MOSFET for use in DC-DC converter
US5744991A (en) * 1995-10-16 1998-04-28 Altera Corporation System for distributing clocks using a delay lock loop in a programmable logic circuit
US5744994A (en) 1996-05-15 1998-04-28 Siliconix Incorporated Three-terminal power mosfet switch for use as synchronous rectifier or voltage clamp
JP3291441B2 (ja) * 1996-10-31 2002-06-10 三洋電機株式会社 Ｄｃ−ｄｃコンバータ装置
US6519457B1 (en) * 1997-04-09 2003-02-11 Nortel Networks Limited Methods and systems for standardizing interbase station communications
JPH11274490A (ja) * 1998-03-18 1999-10-08 Soc Kk Ｍｏｓｆｅｔ
US6580699B1 (en) * 1999-03-29 2003-06-17 Nortel Networks Limited Method for updating an R-P connection for a roaming mobile station
KR100395496B1 (ko) * 2001-09-14 2003-08-25 한국전자통신연구원 패킷 데이터 서비스 노드 내에서 기지국 제어기간 통신을통한 고속 소프트 핸드오프 수행 방법

Also Published As

Publication number Publication date
TW499761B (en) 2002-08-21
EP1259989A1 (de) 2002-11-27
KR100712165B1 (ko) 2007-04-27
CZ20022847A3 (cs) 2003-03-12
US6784487B2 (en) 2004-08-31
KR20020092369A (ko) 2002-12-11
DE10008545A1 (de) 2001-08-30
DE50115196D1 (de) 2009-12-10
JP2003526923A (ja) 2003-09-09
US20040075135A1 (en) 2004-04-22
WO2001067515A1 (de) 2001-09-13
EP1259989B1 (de) 2009-10-28

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Legal Events

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FA9A Lapse of provisional patent protection due to relinquishment or protection considered relinquished