HUE048415T2 - Gyantakészítmény tömítésre, eljárás jármûbe beépített elektronikus vezérlõegység elõállítására, és jármûbe beépített elektronikus vezérlõegység - Google Patents
Gyantakészítmény tömítésre, eljárás jármûbe beépített elektronikus vezérlõegység elõállítására, és jármûbe beépített elektronikus vezérlõegységInfo
- Publication number
- HUE048415T2 HUE048415T2 HUE16758681A HUE16758681A HUE048415T2 HU E048415 T2 HUE048415 T2 HU E048415T2 HU E16758681 A HUE16758681 A HU E16758681A HU E16758681 A HUE16758681 A HU E16758681A HU E048415 T2 HUE048415 T2 HU E048415T2
- Authority
- HU
- Hungary
- Prior art keywords
- control unit
- electronic control
- mounted electronic
- vehicle
- sealing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015043851 | 2015-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUE048415T2 true HUE048415T2 (hu) | 2020-07-28 |
Family
ID=56848817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HUE16758681A HUE048415T2 (hu) | 2015-03-05 | 2016-01-20 | Gyantakészítmény tömítésre, eljárás jármûbe beépített elektronikus vezérlõegység elõállítására, és jármûbe beépített elektronikus vezérlõegység |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10079188B2 (hu) |
| EP (1) | EP3267769B1 (hu) |
| JP (1) | JP5994961B1 (hu) |
| KR (1) | KR101831573B1 (hu) |
| CN (1) | CN107251665B (hu) |
| BR (1) | BR112017014323B1 (hu) |
| HU (1) | HUE048415T2 (hu) |
| WO (1) | WO2016139985A1 (hu) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7091618B2 (ja) * | 2016-09-27 | 2022-06-28 | 住友ベークライト株式会社 | 静電容量型センサ封止用樹脂組成物および静電容量型センサ |
| JP7205156B2 (ja) * | 2018-10-23 | 2023-01-17 | 住友ベークライト株式会社 | 封止用樹脂組成物およびそれを用いた車載用電子制御装置 |
| CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
| JP7302300B2 (ja) * | 2019-06-03 | 2023-07-04 | 住友ベークライト株式会社 | 封止樹脂組成物およびアルミニウム電解コンデンサ |
| DE102019213962A1 (de) * | 2019-09-13 | 2021-03-18 | Vitesco Technologies Germany Gmbh | Getriebesteuergerät, Kraftfahrzeug und Verfahren zur Umspritzung einer Leiterplatte eines Getriebesteuergeräts |
| US11974396B2 (en) * | 2020-02-18 | 2024-04-30 | Advanced American Technologies, LLC | Systems using composite materials |
| JP6989044B1 (ja) | 2021-03-31 | 2022-01-05 | 住友ベークライト株式会社 | 封止構造体の製造方法およびタブレット |
| WO2023063264A1 (ja) * | 2021-10-12 | 2023-04-20 | 住友ベークライト株式会社 | 樹脂組成物およびタブレットの製造方法 |
| JP7255767B1 (ja) * | 2021-10-12 | 2023-04-11 | 住友ベークライト株式会社 | 樹脂組成物のタブレットおよびタブレットの製造方法 |
| WO2023162975A1 (ja) | 2022-02-28 | 2023-08-31 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11323097A (ja) * | 1989-01-18 | 1999-11-26 | Mitsui Chem Inc | エポキシ樹脂組成物及びそれを用いた封止剤 |
| US5064881A (en) * | 1989-01-18 | 1991-11-12 | Mitsui Petrochemical Industries, Ltd. | Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica |
| JPH10175210A (ja) | 1996-12-19 | 1998-06-30 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物のタブレットの製造方法 |
| JPH11333834A (ja) | 1998-05-27 | 1999-12-07 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂成形材料の製造方法 |
| JP2001278948A (ja) | 2000-03-30 | 2001-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂成形材料 |
| KR20020063258A (ko) * | 2000-10-24 | 2002-08-01 | 미쓰이 가가쿠 가부시키가이샤 | 에폭시 수지 조성물 및 그 용도 |
| JP3655582B2 (ja) | 2000-12-08 | 2005-06-02 | 三井化学株式会社 | エポキシ樹脂組成物及びそれを用いた電磁波遮蔽・吸収材料 |
| JP4903987B2 (ja) * | 2004-03-19 | 2012-03-28 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法 |
| KR101250033B1 (ko) * | 2005-01-20 | 2013-04-02 | 스미토모 베이클리트 컴퍼니 리미티드 | 에폭시 수지 조성물, 그 잠복화 방법 및 반도체 장치 |
| JP2009147014A (ja) | 2007-12-12 | 2009-07-02 | Hitachi Ltd | 樹脂封止型電子制御装置及びその封止成形方法 |
| CN103295992A (zh) * | 2008-10-10 | 2013-09-11 | 住友电木株式会社 | 半导体装置 |
| EP2428578B1 (en) | 2009-05-08 | 2016-03-23 | Ezaki Glico Co., Ltd. | Glucuronic acid-containing glucan, process for production of same, and use of same |
| WO2010128611A1 (ja) * | 2009-05-08 | 2010-11-11 | 日立化成工業株式会社 | 半導体封止用フィルム状接着剤、半導体装置及びその製造方法 |
| US20130026660A1 (en) * | 2011-07-29 | 2013-01-31 | Namics Corporation | Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
| JP2013232580A (ja) * | 2012-05-01 | 2013-11-14 | Dow Corning Toray Co Ltd | 熱硬化性フィルム状シリコーン封止材 |
| JP6281178B2 (ja) * | 2013-01-31 | 2018-02-21 | 住友ベークライト株式会社 | 電子装置、自動車および電子装置の製造方法 |
| WO2015001667A1 (ja) | 2013-07-05 | 2015-01-08 | 日立オートモティブシステムズ株式会社 | 実装基板の製造方法および実装基板 |
-
2016
- 2016-01-20 JP JP2016532021A patent/JP5994961B1/ja active Active
- 2016-01-20 BR BR112017014323-2A patent/BR112017014323B1/pt active IP Right Grant
- 2016-01-20 WO PCT/JP2016/051593 patent/WO2016139985A1/ja active Application Filing
- 2016-01-20 KR KR1020177019625A patent/KR101831573B1/ko active IP Right Grant
- 2016-01-20 HU HUE16758681A patent/HUE048415T2/hu unknown
- 2016-01-20 US US15/537,088 patent/US10079188B2/en active Active
- 2016-01-20 EP EP16758681.7A patent/EP3267769B1/en active Active
- 2016-01-20 CN CN201680010330.6A patent/CN107251665B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107251665B (zh) | 2018-06-15 |
| US20170345730A1 (en) | 2017-11-30 |
| KR20170089012A (ko) | 2017-08-02 |
| KR101831573B1 (ko) | 2018-02-22 |
| BR112017014323B1 (pt) | 2022-11-01 |
| EP3267769A1 (en) | 2018-01-10 |
| CN107251665A (zh) | 2017-10-13 |
| WO2016139985A1 (ja) | 2016-09-09 |
| BR112017014323A2 (pt) | 2018-01-02 |
| JPWO2016139985A1 (ja) | 2017-04-27 |
| EP3267769A4 (en) | 2018-07-25 |
| EP3267769B1 (en) | 2019-12-18 |
| JP5994961B1 (ja) | 2016-09-21 |
| US10079188B2 (en) | 2018-09-18 |
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