HUE039398T2 - Formázó berendezés, amely tartalmaz formázó nyomásérzékelõket - Google Patents
Formázó berendezés, amely tartalmaz formázó nyomásérzékelõketInfo
- Publication number
- HUE039398T2 HUE039398T2 HUE10843358A HUE10843358A HUE039398T2 HU E039398 T2 HUE039398 T2 HU E039398T2 HU E10843358 A HUE10843358 A HU E10843358A HU E10843358 A HUE10843358 A HU E10843358A HU E039398 T2 HUE039398 T2 HU E039398T2
- Authority
- HU
- Hungary
- Prior art keywords
- pressure sensors
- molding apparatus
- mold pressure
- mold
- molding
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
- B29C45/401—Ejector pin constructions or mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76006—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/7624—Ejection unit
- B29C2945/76244—Ejection unit ejectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/76287—Moulding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/655,165 US8425217B2 (en) | 2009-12-23 | 2009-12-23 | Method for installing indirect and direct mold pressure, temperature and flow front detection sensors without machining the mold |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE039398T2 true HUE039398T2 (hu) | 2018-12-28 |
Family
ID=44151465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE10843358A HUE039398T2 (hu) | 2009-12-23 | 2010-12-17 | Formázó berendezés, amely tartalmaz formázó nyomásérzékelõket |
Country Status (9)
Country | Link |
---|---|
US (1) | US8425217B2 (hu) |
EP (1) | EP2516129B1 (hu) |
JP (4) | JP5830031B2 (hu) |
BR (1) | BR112012017759A2 (hu) |
CA (2) | CA2785325C (hu) |
HU (1) | HUE039398T2 (hu) |
MX (1) | MX2012007500A (hu) |
SG (1) | SG181876A1 (hu) |
WO (1) | WO2011087482A2 (hu) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8257075B2 (en) * | 2008-11-10 | 2012-09-04 | Apple Inc. | Carbon composite mold design |
JP6117080B2 (ja) * | 2012-12-25 | 2017-04-19 | 住友重機械工業株式会社 | 射出成形機 |
JP5636145B2 (ja) * | 2012-12-27 | 2014-12-03 | 双葉電子工業株式会社 | 射出成形金型用導光体付ピン |
CN104219885B (zh) | 2013-05-31 | 2017-05-10 | 国际商业机器公司 | 用于锁销焊接型部件的温度触发顶出系统和返修方法 |
JP6032150B2 (ja) * | 2013-07-29 | 2016-11-24 | トヨタ自動車株式会社 | 離型性評価方法 |
US10087707B2 (en) * | 2013-09-12 | 2018-10-02 | Weatherford Technology Holdings, Llc | Molded composite slip of sheet molded compound for downhole tool |
US10335986B2 (en) * | 2016-03-07 | 2019-07-02 | Panasonic Intellectual Property Management Co., Ltd. | Reflective display device, injection mold, and method for manufacturing reflective display device |
CN106915028A (zh) * | 2017-03-13 | 2017-07-04 | 福建冠良汽车配件工业有限公司 | 离合器面片多工位自动顶出方法 |
US20190176383A1 (en) * | 2017-12-07 | 2019-06-13 | Rjg, Inc. | Predictive simulation system and method for injection molding |
US20210031425A1 (en) * | 2018-02-13 | 2021-02-04 | Kistler Holding Ag | Pressure sensor |
TWI674959B (zh) * | 2018-11-30 | 2019-10-21 | 財團法人金屬工業研究發展中心 | 模具內之壓力與溫度的感測裝置 |
TWI689711B (zh) | 2018-12-26 | 2020-04-01 | 財團法人工業技術研究院 | 感測模組 |
DE102019204835B4 (de) * | 2019-04-04 | 2023-06-29 | Erlenbach Gmbh | Formteilmaschine, Maschinensystem, Verwendung eines Kontaktelements und Verfahren zum Betreiben eines Maschinensystems |
JP6872824B2 (ja) * | 2019-10-11 | 2021-05-19 | 株式会社Jhe | 酸化マグネシウムの製造方法および装置 |
JP7071955B2 (ja) * | 2019-11-19 | 2022-05-19 | 双葉電子工業株式会社 | 射出成形用金型 |
JP7434890B2 (ja) * | 2019-12-26 | 2024-02-21 | セイコーエプソン株式会社 | 射出成形機、および、射出成形機の制御方法 |
TWI753713B (zh) * | 2020-12-21 | 2022-01-21 | 財團法人工業技術研究院 | 具校正功能之壓力感測器及其校正方法 |
WO2023282527A1 (ko) * | 2021-07-08 | 2023-01-12 | 한국생산기술연구원 | 이젝터 모듈 |
KR102542412B1 (ko) * | 2021-07-08 | 2023-06-13 | 한국생산기술연구원 | 온도센싱 기능을 구비한 이젝터 모듈 |
TW202342268A (zh) * | 2022-04-18 | 2023-11-01 | 中原大學 | 以同軸方式埋設感測器的模具設備 |
TWI798058B (zh) * | 2022-04-18 | 2023-04-01 | 中原大學 | 包含模具感測器冷卻結構的模具設備 |
WO2024176461A1 (ja) * | 2023-02-24 | 2024-08-29 | 株式会社ジェイテクト | 射出成形機 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58101720U (ja) * | 1981-12-29 | 1983-07-11 | 松下電工株式会社 | 金型 |
JPS58197031A (ja) * | 1982-05-11 | 1983-11-16 | Daiwa Kasei Kogyo Kk | 射出成形品の欠肉不良検出装置 |
JPS62204915A (ja) * | 1986-03-06 | 1987-09-09 | Daiwa Kogyo Kk | 射出成形機用金型における樹脂温度検出方法 |
US4874032A (en) * | 1986-09-13 | 1989-10-17 | Yotaro Hatamura | Die casting controlling method |
JPH0431022A (ja) * | 1990-05-29 | 1992-02-03 | Sumitomo Heavy Ind Ltd | 金型内圧測定装置 |
CH682001A5 (hu) | 1990-05-31 | 1993-06-30 | Kk Holding Ag | |
JP2756077B2 (ja) | 1993-12-27 | 1998-05-25 | 東芝機械株式会社 | 射出成形機の射出成形速度条件自動設定方法 |
US5566743A (en) * | 1994-05-02 | 1996-10-22 | Guergov; Milko G. | Method of injecting molten metal into a mold cavity |
US5846573A (en) * | 1994-12-09 | 1998-12-08 | Rjg Technologies, Inc. | Mold core-pin deflection transducer |
JP3212237B2 (ja) | 1995-06-27 | 2001-09-25 | 東芝機械株式会社 | 射出成形機の射出成形速度条件自動設定方法 |
JPH1022314A (ja) * | 1996-07-08 | 1998-01-23 | Hitachi Ltd | 半導体樹脂封止用金型 |
JP3045078B2 (ja) * | 1996-09-04 | 2000-05-22 | 双葉電子工業株式会社 | 圧力センサ付エジェクタピン |
JP3937525B2 (ja) * | 1997-09-10 | 2007-06-27 | 双葉電子工業株式会社 | 圧力センサ付エジェクタピン |
JP2000071302A (ja) * | 1998-08-28 | 2000-03-07 | Futaba Corp | 金型異常検出装置 |
JP4042223B2 (ja) | 1998-09-28 | 2008-02-06 | 双葉電子工業株式会社 | 成形型用材料流動センサ |
US6537053B1 (en) * | 2000-01-28 | 2003-03-25 | Plastic Moldings Company, Llc | Modular molding system, and modules for use therewith |
US6872069B2 (en) * | 2000-06-19 | 2005-03-29 | Glenn Starkey | Ejector sleeve for molding a raised aperture in a molded article |
AU2002235156A1 (en) | 2000-11-06 | 2002-05-15 | Frederick J. Buja | Method and apparatus for controlling a mold melt-flow process using temperature sensors |
DE10112126B4 (de) | 2001-03-14 | 2004-03-25 | Priamus System Technologies Ag | Verfahren zum automatischen Balancieren der volumetrischen Füllung von Kavitäten |
DE10112125A1 (de) | 2001-03-14 | 2002-10-10 | Frey Juergen | Verfahren zum Regeln von Prozessparametern zur Erzielung konstanter Prozessbedingungen |
DE10114228A1 (de) | 2001-03-22 | 2002-10-02 | Frey Juergen | Verfahren zum Regeln der Schwindung von Spritzteilen |
DE10117001A1 (de) | 2001-04-05 | 2002-11-07 | Frey Juergen | Verfahren zum Herstellen eines Formteiles in einem Formwerkzeug |
JP4278986B2 (ja) | 2001-04-05 | 2009-06-17 | プリーアムス ジステーム テヒノロギース アーゲー | 成形金型のキャビティーを充填させるための方法 |
DE10117000A1 (de) | 2001-04-05 | 2002-11-21 | Frey Juergen | Verfahren zum automatischen Erkennen der Empfindlichkeit von Sensoren |
DE10121160A1 (de) | 2001-04-30 | 2002-10-31 | Sig Corpoplast Gmbh & Co Kg | Verfahren und Vorrichtung zur Temperierung von Vorformlingen |
JP3932938B2 (ja) * | 2002-03-20 | 2007-06-20 | 双葉電子工業株式会社 | 射出成形金型及び射出成形金型用ピン |
US6837700B2 (en) * | 2002-10-11 | 2005-01-04 | Tung-Jung Chen | Mold article ejecting device used for an injection molding apparatus |
DE10258100B4 (de) | 2002-12-11 | 2005-12-01 | Priamus System Technologies Ag | Verfahren zum Herstellen einer Vorrichtung zum Messen, Überwachen und/oder Regeln einer Temperatur |
DE10261498B4 (de) | 2002-12-23 | 2008-04-30 | Priamus System Technologies Ag | Verfahren zum Regeln der Herstellung von Spritzteilen |
JP4273401B2 (ja) * | 2003-08-06 | 2009-06-03 | 住友電装株式会社 | 射出成形用金型 |
US7124037B2 (en) | 2003-10-31 | 2006-10-17 | Mpi Incorporated | Devices, systems, and methods for monitoring the operation of an injection molding machine |
DE10359975A1 (de) | 2003-12-18 | 2005-07-14 | Priamus System Technologies Ag | Verfahren zum Betreiben einer Arbeitsgerätschaft |
DE102004003278A1 (de) | 2004-01-21 | 2005-08-25 | Priamus System Technologies Ag | Sensor |
US7108424B2 (en) | 2004-03-11 | 2006-09-19 | Agilent Technologies, Inc. | Method and apparatus for calibration of indirect measurement systems |
DE102005006806A1 (de) | 2004-09-01 | 2006-03-30 | Priamus System Technologies Ag | Verfahren und Vorrichtung zum Messen von physikalischer Grössen mit piezoelektrischen Sensoren |
DE102004043443B3 (de) * | 2004-09-06 | 2006-02-02 | Priamus System Technologies Ag | Vorrichtung zum Formen von Gegenständen |
DE102005029705A1 (de) | 2005-06-10 | 2006-12-14 | Priamus System Technologies Ag | Verfahren zum Regeln des Spritzgiesprozesses einer Spritzgiessmaschine |
JP4830391B2 (ja) | 2005-07-29 | 2011-12-07 | 株式会社デンソー | センサ装置の製造方法及びセンサ装置 |
US20080085334A1 (en) * | 2006-10-10 | 2008-04-10 | Husky Injection Molding Systems Ltd. | Hot Runner System Sensor |
US20080277822A1 (en) * | 2007-05-09 | 2008-11-13 | Chih-Yu Chen | Apparatus and method for periodically cooling injection mold |
JP5369107B2 (ja) * | 2007-10-22 | 2013-12-18 | キストラー ホールディング アクチエンゲゼルシャフト | 射出成形システムの測定装置 |
-
2009
- 2009-12-23 US US12/655,165 patent/US8425217B2/en active Active
-
2010
- 2010-12-17 WO PCT/US2010/003194 patent/WO2011087482A2/en active Application Filing
- 2010-12-17 CA CA2785325A patent/CA2785325C/en not_active Expired - Fee Related
- 2010-12-17 CA CA2968945A patent/CA2968945C/en not_active Expired - Fee Related
- 2010-12-17 EP EP10843358.2A patent/EP2516129B1/en not_active Not-in-force
- 2010-12-17 BR BR112012017759A patent/BR112012017759A2/pt not_active IP Right Cessation
- 2010-12-17 SG SG2012046280A patent/SG181876A1/en unknown
- 2010-12-17 JP JP2012545926A patent/JP5830031B2/ja not_active Expired - Fee Related
- 2010-12-17 MX MX2012007500A patent/MX2012007500A/es active IP Right Grant
- 2010-12-17 HU HUE10843358A patent/HUE039398T2/hu unknown
-
2015
- 2015-03-06 JP JP2015044982A patent/JP2015163470A/ja active Pending
-
2016
- 2016-07-06 JP JP2016134544A patent/JP6090730B2/ja not_active Expired - Fee Related
-
2017
- 2017-01-24 JP JP2017010768A patent/JP6317482B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20110151041A1 (en) | 2011-06-23 |
JP2015163470A (ja) | 2015-09-10 |
CA2968945C (en) | 2018-10-16 |
JP6090730B2 (ja) | 2017-03-08 |
CA2785325C (en) | 2018-12-11 |
US8425217B2 (en) | 2013-04-23 |
JP5830031B2 (ja) | 2015-12-09 |
CA2968945A1 (en) | 2011-07-21 |
JP2017019275A (ja) | 2017-01-26 |
WO2011087482A3 (en) | 2012-02-02 |
JP2017100454A (ja) | 2017-06-08 |
EP2516129B1 (en) | 2018-03-07 |
EP2516129A4 (en) | 2015-11-04 |
JP6317482B2 (ja) | 2018-04-25 |
SG181876A1 (en) | 2012-08-30 |
JP2013515630A (ja) | 2013-05-09 |
WO2011087482A2 (en) | 2011-07-21 |
MX2012007500A (es) | 2012-10-01 |
BR112012017759A2 (pt) | 2019-09-24 |
EP2516129A2 (en) | 2012-10-31 |
CA2785325A1 (en) | 2011-07-21 |
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