BR112012017759A2 - método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde. - Google Patents
método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde.Info
- Publication number
- BR112012017759A2 BR112012017759A2 BR112012017759A BR112012017759A BR112012017759A2 BR 112012017759 A2 BR112012017759 A2 BR 112012017759A2 BR 112012017759 A BR112012017759 A BR 112012017759A BR 112012017759 A BR112012017759 A BR 112012017759A BR 112012017759 A2 BR112012017759 A2 BR 112012017759A2
- Authority
- BR
- Brazil
- Prior art keywords
- mold
- ejector pin
- sensor
- pressure
- machining
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
- B29C45/401—Ejector pin constructions or mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76006—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/7624—Ejection unit
- B29C2945/76244—Ejection unit ejectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/76287—Moulding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
patente de invenção: método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde. um aparelho de moldagem inclui uma cavidade de molde (26), um pino ejetor (30) e um sensor (42). o pino ejetor tem uma primeira superfície (48) exposta para a cavidade e uma segunda superfície (40) não exposta para a cavidade. o sensor (42) está em contato comunicativo com a segunda superfície de pino ejetor (40)l. o sensor (42) é capaz de detectar pressão em uma cavidade de molde (26) por meio do pino ejetor (30). o aparelho de moldagem pode incluir um pino ejetor oco (108) com uma primeira extremidade (120) confrontando a cavidade de molde (26). um sensor (104) embutido na primeira extremidade de pino ejetor oco (120) detecta um parâmetro de cavidade de molde. uma linha de sinal (112) do sensor (104) é encaminhada através do pino ejetor oco (108). .
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/655,165 US8425217B2 (en) | 2009-12-23 | 2009-12-23 | Method for installing indirect and direct mold pressure, temperature and flow front detection sensors without machining the mold |
PCT/US2010/003194 WO2011087482A2 (en) | 2009-12-23 | 2010-12-17 | A new method for installing indirect and direct mold pressure, temperature, and flow front detection sensors without machining the mold |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112012017759A2 true BR112012017759A2 (pt) | 2019-09-24 |
Family
ID=44151465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012017759A BR112012017759A2 (pt) | 2009-12-23 | 2010-12-17 | método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde. |
Country Status (9)
Country | Link |
---|---|
US (1) | US8425217B2 (pt) |
EP (1) | EP2516129B1 (pt) |
JP (4) | JP5830031B2 (pt) |
BR (1) | BR112012017759A2 (pt) |
CA (2) | CA2785325C (pt) |
HU (1) | HUE039398T2 (pt) |
MX (1) | MX2012007500A (pt) |
SG (1) | SG181876A1 (pt) |
WO (1) | WO2011087482A2 (pt) |
Families Citing this family (22)
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US8257075B2 (en) * | 2008-11-10 | 2012-09-04 | Apple Inc. | Carbon composite mold design |
JP6117080B2 (ja) * | 2012-12-25 | 2017-04-19 | 住友重機械工業株式会社 | 射出成形機 |
JP5636145B2 (ja) * | 2012-12-27 | 2014-12-03 | 双葉電子工業株式会社 | 射出成形金型用導光体付ピン |
CN104219885B (zh) | 2013-05-31 | 2017-05-10 | 国际商业机器公司 | 用于锁销焊接型部件的温度触发顶出系统和返修方法 |
JP6032150B2 (ja) * | 2013-07-29 | 2016-11-24 | トヨタ自動車株式会社 | 離型性評価方法 |
US10087707B2 (en) * | 2013-09-12 | 2018-10-02 | Weatherford Technology Holdings, Llc | Molded composite slip of sheet molded compound for downhole tool |
US10335986B2 (en) * | 2016-03-07 | 2019-07-02 | Panasonic Intellectual Property Management Co., Ltd. | Reflective display device, injection mold, and method for manufacturing reflective display device |
CN106915028A (zh) * | 2017-03-13 | 2017-07-04 | 福建冠良汽车配件工业有限公司 | 离合器面片多工位自动顶出方法 |
US20190176383A1 (en) * | 2017-12-07 | 2019-06-13 | Rjg, Inc. | Predictive simulation system and method for injection molding |
WO2019158339A1 (de) * | 2018-02-13 | 2019-08-22 | Kistler Holding Ag | Drucksensor |
TWI674959B (zh) * | 2018-11-30 | 2019-10-21 | 財團法人金屬工業研究發展中心 | 模具內之壓力與溫度的感測裝置 |
TWI689711B (zh) | 2018-12-26 | 2020-04-01 | 財團法人工業技術研究院 | 感測模組 |
DE102019204835B4 (de) * | 2019-04-04 | 2023-06-29 | Erlenbach Gmbh | Formteilmaschine, Maschinensystem, Verwendung eines Kontaktelements und Verfahren zum Betreiben eines Maschinensystems |
JP6872824B2 (ja) * | 2019-10-11 | 2021-05-19 | 株式会社Jhe | 酸化マグネシウムの製造方法および装置 |
JP7071955B2 (ja) * | 2019-11-19 | 2022-05-19 | 双葉電子工業株式会社 | 射出成形用金型 |
JP7434890B2 (ja) * | 2019-12-26 | 2024-02-21 | セイコーエプソン株式会社 | 射出成形機、および、射出成形機の制御方法 |
TWI753713B (zh) * | 2020-12-21 | 2022-01-21 | 財團法人工業技術研究院 | 具校正功能之壓力感測器及其校正方法 |
KR102542412B1 (ko) * | 2021-07-08 | 2023-06-13 | 한국생산기술연구원 | 온도센싱 기능을 구비한 이젝터 모듈 |
WO2023282527A1 (ko) * | 2021-07-08 | 2023-01-12 | 한국생산기술연구원 | 이젝터 모듈 |
TWI798058B (zh) * | 2022-04-18 | 2023-04-01 | 中原大學 | 包含模具感測器冷卻結構的模具設備 |
TW202342268A (zh) * | 2022-04-18 | 2023-11-01 | 中原大學 | 以同軸方式埋設感測器的模具設備 |
WO2024176461A1 (ja) * | 2023-02-24 | 2024-08-29 | 株式会社ジェイテクト | 射出成形機 |
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JPS58101720U (ja) * | 1981-12-29 | 1983-07-11 | 松下電工株式会社 | 金型 |
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-
2009
- 2009-12-23 US US12/655,165 patent/US8425217B2/en active Active
-
2010
- 2010-12-17 WO PCT/US2010/003194 patent/WO2011087482A2/en active Application Filing
- 2010-12-17 EP EP10843358.2A patent/EP2516129B1/en not_active Not-in-force
- 2010-12-17 CA CA2785325A patent/CA2785325C/en not_active Expired - Fee Related
- 2010-12-17 CA CA2968945A patent/CA2968945C/en not_active Expired - Fee Related
- 2010-12-17 JP JP2012545926A patent/JP5830031B2/ja not_active Expired - Fee Related
- 2010-12-17 SG SG2012046280A patent/SG181876A1/en unknown
- 2010-12-17 MX MX2012007500A patent/MX2012007500A/es active IP Right Grant
- 2010-12-17 HU HUE10843358A patent/HUE039398T2/hu unknown
- 2010-12-17 BR BR112012017759A patent/BR112012017759A2/pt not_active IP Right Cessation
-
2015
- 2015-03-06 JP JP2015044982A patent/JP2015163470A/ja active Pending
-
2016
- 2016-07-06 JP JP2016134544A patent/JP6090730B2/ja not_active Expired - Fee Related
-
2017
- 2017-01-24 JP JP2017010768A patent/JP6317482B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP6090730B2 (ja) | 2017-03-08 |
CA2968945C (en) | 2018-10-16 |
JP6317482B2 (ja) | 2018-04-25 |
HUE039398T2 (hu) | 2018-12-28 |
SG181876A1 (en) | 2012-08-30 |
WO2011087482A2 (en) | 2011-07-21 |
JP2013515630A (ja) | 2013-05-09 |
MX2012007500A (es) | 2012-10-01 |
US20110151041A1 (en) | 2011-06-23 |
JP2015163470A (ja) | 2015-09-10 |
US8425217B2 (en) | 2013-04-23 |
JP2017100454A (ja) | 2017-06-08 |
JP2017019275A (ja) | 2017-01-26 |
CA2785325A1 (en) | 2011-07-21 |
EP2516129A2 (en) | 2012-10-31 |
CA2968945A1 (en) | 2011-07-21 |
EP2516129B1 (en) | 2018-03-07 |
EP2516129A4 (en) | 2015-11-04 |
CA2785325C (en) | 2018-12-11 |
JP5830031B2 (ja) | 2015-12-09 |
WO2011087482A3 (en) | 2012-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |