BR112012017759A2 - método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde. - Google Patents

método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde.

Info

Publication number
BR112012017759A2
BR112012017759A2 BR112012017759A BR112012017759A BR112012017759A2 BR 112012017759 A2 BR112012017759 A2 BR 112012017759A2 BR 112012017759 A BR112012017759 A BR 112012017759A BR 112012017759 A BR112012017759 A BR 112012017759A BR 112012017759 A2 BR112012017759 A2 BR 112012017759A2
Authority
BR
Brazil
Prior art keywords
mold
ejector pin
sensor
pressure
machining
Prior art date
Application number
BR112012017759A
Other languages
English (en)
Inventor
Groleau Rodney
Original Assignee
Rjg Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjg Inc filed Critical Rjg Inc
Publication of BR112012017759A2 publication Critical patent/BR112012017759A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76006—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7624—Ejection unit
    • B29C2945/76244—Ejection unit ejectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76287—Moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

patente de invenção: método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde. um aparelho de moldagem inclui uma cavidade de molde (26), um pino ejetor (30) e um sensor (42). o pino ejetor tem uma primeira superfície (48) exposta para a cavidade e uma segunda superfície (40) não exposta para a cavidade. o sensor (42) está em contato comunicativo com a segunda superfície de pino ejetor (40)l. o sensor (42) é capaz de detectar pressão em uma cavidade de molde (26) por meio do pino ejetor (30). o aparelho de moldagem pode incluir um pino ejetor oco (108) com uma primeira extremidade (120) confrontando a cavidade de molde (26). um sensor (104) embutido na primeira extremidade de pino ejetor oco (120) detecta um parâmetro de cavidade de molde. uma linha de sinal (112) do sensor (104) é encaminhada através do pino ejetor oco (108). .
BR112012017759A 2009-12-23 2010-12-17 método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde. BR112012017759A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/655,165 US8425217B2 (en) 2009-12-23 2009-12-23 Method for installing indirect and direct mold pressure, temperature and flow front detection sensors without machining the mold
PCT/US2010/003194 WO2011087482A2 (en) 2009-12-23 2010-12-17 A new method for installing indirect and direct mold pressure, temperature, and flow front detection sensors without machining the mold

Publications (1)

Publication Number Publication Date
BR112012017759A2 true BR112012017759A2 (pt) 2019-09-24

Family

ID=44151465

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012017759A BR112012017759A2 (pt) 2009-12-23 2010-12-17 método para instalar sensores de detecção direta e indireta de temperatura, pressão e frente de fluxo de molde sem usinar o molde.

Country Status (9)

Country Link
US (1) US8425217B2 (pt)
EP (1) EP2516129B1 (pt)
JP (4) JP5830031B2 (pt)
BR (1) BR112012017759A2 (pt)
CA (2) CA2785325C (pt)
HU (1) HUE039398T2 (pt)
MX (1) MX2012007500A (pt)
SG (1) SG181876A1 (pt)
WO (1) WO2011087482A2 (pt)

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KR102542412B1 (ko) * 2021-07-08 2023-06-13 한국생산기술연구원 온도센싱 기능을 구비한 이젝터 모듈
WO2023282527A1 (ko) * 2021-07-08 2023-01-12 한국생산기술연구원 이젝터 모듈
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TW202342268A (zh) * 2022-04-18 2023-11-01 中原大學 以同軸方式埋設感測器的模具設備
WO2024176461A1 (ja) * 2023-02-24 2024-08-29 株式会社ジェイテクト 射出成形機

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Also Published As

Publication number Publication date
JP6090730B2 (ja) 2017-03-08
CA2968945C (en) 2018-10-16
JP6317482B2 (ja) 2018-04-25
HUE039398T2 (hu) 2018-12-28
SG181876A1 (en) 2012-08-30
WO2011087482A2 (en) 2011-07-21
JP2013515630A (ja) 2013-05-09
MX2012007500A (es) 2012-10-01
US20110151041A1 (en) 2011-06-23
JP2015163470A (ja) 2015-09-10
US8425217B2 (en) 2013-04-23
JP2017100454A (ja) 2017-06-08
JP2017019275A (ja) 2017-01-26
CA2785325A1 (en) 2011-07-21
EP2516129A2 (en) 2012-10-31
CA2968945A1 (en) 2011-07-21
EP2516129B1 (en) 2018-03-07
EP2516129A4 (en) 2015-11-04
CA2785325C (en) 2018-12-11
JP5830031B2 (ja) 2015-12-09
WO2011087482A3 (en) 2012-02-02

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.