HU192688B - Method for producing metal coated basic material of circuit plates - Google Patents

Method for producing metal coated basic material of circuit plates Download PDF

Info

Publication number
HU192688B
HU192688B HU130585A HU130585A HU192688B HU 192688 B HU192688 B HU 192688B HU 130585 A HU130585 A HU 130585A HU 130585 A HU130585 A HU 130585A HU 192688 B HU192688 B HU 192688B
Authority
HU
Hungary
Prior art keywords
priority
april
metal foil
pressure
zone
Prior art date
Application number
HU130585A
Other languages
English (en)
Hungarian (hu)
Other versions
HUT37897A (en
Inventor
Lothar Schwerz
Rudolf Kuehne
Dieter Fischer
Friedel Ueberberg
Original Assignee
President Eng Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19843413434 external-priority patent/DE3413434A1/de
Application filed by President Eng Corp filed Critical President Eng Corp
Publication of HUT37897A publication Critical patent/HUT37897A/hu
Publication of HU192688B publication Critical patent/HU192688B/hu

Links

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Reinforced Plastic Materials (AREA)
HU130585A 1984-04-10 1985-04-09 Method for producing metal coated basic material of circuit plates HU192688B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843413434 DE3413434A1 (de) 1984-04-10 1984-04-10 Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten
EP85101282A EP0158027B2 (de) 1984-04-10 1985-02-07 Verfahren zum Herstellen von kupferkaschiertem Basismaterial für Leiterplatten

Publications (2)

Publication Number Publication Date
HUT37897A HUT37897A (en) 1986-03-28
HU192688B true HU192688B (en) 1987-06-29

Family

ID=25820258

Family Applications (1)

Application Number Title Priority Date Filing Date
HU130585A HU192688B (en) 1984-04-10 1985-04-09 Method for producing metal coated basic material of circuit plates

Country Status (20)

Country Link
AR (1) AR241096A1 (ro)
AT (1) ATE53537T1 (ro)
AU (1) AU579620B2 (ro)
BR (1) BR8501652A (ro)
CS (1) CS276234B6 (ro)
DK (1) DK164092C (ro)
EG (1) EG18033A (ro)
ES (2) ES8701049A1 (ro)
FI (1) FI851401L (ro)
GR (1) GR850874B (ro)
HU (1) HU192688B (ro)
IL (1) IL74564A (ro)
MX (1) MX158423A (ro)
NO (1) NO851405L (ro)
NZ (1) NZ211703A (ro)
PL (1) PL152229B1 (ro)
PT (1) PT80255B (ro)
RO (1) RO92976A (ro)
TR (1) TR22276A (ro)
YU (2) YU44997B (ro)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0133280A3 (en) * 1983-08-01 1986-03-19 American Cyanamid Company Thermoset interleafed resin matrix composites with improved compression properties
EP0133281A3 (en) * 1983-08-01 1988-11-30 American Cyanamid Company Curable fibre reinforced epoxy resin composition
EP0159482A3 (en) * 1984-03-28 1987-02-25 American Cyanamid Company Resin matrix composites with controlled flow and tack

Also Published As

Publication number Publication date
TR22276A (tr) 1986-12-10
AR241096A1 (es) 1991-10-31
YU41485A (en) 1988-06-30
DK159185A (da) 1985-10-11
AU579620B2 (en) 1988-12-01
DK164092B (da) 1992-05-11
ES556844A0 (es) 1987-08-01
NZ211703A (en) 1987-07-31
ES8701049A1 (es) 1986-11-16
DK159185D0 (da) 1985-04-09
PT80255A (de) 1985-05-01
MX158423A (es) 1989-01-30
CS8502621A2 (en) 1991-07-16
BR8501652A (pt) 1985-12-03
AU4092685A (en) 1985-10-17
AR241096A2 (es) 1991-10-31
PL152229B1 (en) 1990-11-30
PT80255B (pt) 1987-08-19
FI851401L (fi) 1985-10-11
IL74564A (en) 1989-10-31
YU173287A (en) 1989-10-31
GR850874B (ro) 1985-11-25
RO92976A (ro) 1987-11-30
YU44997B (en) 1991-06-30
EG18033A (en) 1991-12-30
NO851405L (no) 1985-10-11
PL252848A1 (en) 1985-12-17
ATE53537T1 (de) 1990-06-15
FI851401A0 (fi) 1985-04-09
ES542063A0 (es) 1986-11-16
ES8801773A1 (es) 1987-08-01
CS276234B6 (en) 1992-05-13
HUT37897A (en) 1986-03-28
IL74564A0 (en) 1985-06-30
YU45452B (en) 1992-05-28
DK164092C (da) 1992-10-12

Similar Documents

Publication Publication Date Title
US4670080A (en) Process and apparatus for producing metal-laminated base material for printed circuit boards
US5330595A (en) Process of making resin-impregnated material webs
JPS62142619A (ja) 回路板用金属積層基体物質、プレプレグの製造方法及び製造装置
US20050028925A1 (en) Method for making a prepreg
HU192688B (en) Method for producing metal coated basic material of circuit plates
JPH01221244A (ja) 銅張積層板の製造法
CN1004987B (zh) 作印刷电路板用的覆金属叠层板的生产方法
JPH0382510A (ja) 積層板の連続製造方法
JPH08118540A (ja) 銅張積層板の製造方法
JPH04323034A (ja) 積層板の製造方法
JPH03110158A (ja) 積層板の製造方法
JP2520706B2 (ja) プリント配線板の製造方法
JPH03110157A (ja) 積層板の製造方法
JPH03153318A (ja) 積層板の製法
DE102004007592A1 (de) OXYFLEX ein flexibles Basismaterial aus lösungsmittelfreien Epoxid und Polyimidharzen sowie Verfahren und Vorrichtung zu dessen Herstellung
DE19650310A1 (de) Verfahren und Vorrichtung zur kontinuierlichen Herstellung von Epoxidglaslaminaten insbesondere von Composite Epoxid Materials
JPH0448330B2 (ro)
JPH05335739A (ja) 多層プリント配線板の製造方法
DE8560011U1 (de) Vorrichtung zum Herstellen von metallkaschiertem Basismaterial für Leiterplatten
DE10206787A1 (de) Verfahren und Vorrichtung zur sequentiellen Herstellung von kupferkaschierten HDI-Multilayer-Laminaten
JPH03110156A (ja) 積層板の製造方法
JPH02226797A (ja) 極簿銅箔張積層板の製造法
JPH02235629A (ja) 積層板の製造方法
DE19539193A1 (de) Verfahren und Vorrichtung zur zweischichtigen Beschichtung von Kupferfolien mit Epoxidharzschmelzen
JPS62178325A (ja) 積層板の製造方法

Legal Events

Date Code Title Description
HU90 Patent valid on 900628
HMM4 Cancellation of final prot. due to non-payment of fee