IL74564A - Process for producing copper-laminated base material for printed circuit boards - Google Patents

Process for producing copper-laminated base material for printed circuit boards

Info

Publication number
IL74564A
IL74564A IL74564A IL7456485A IL74564A IL 74564 A IL74564 A IL 74564A IL 74564 A IL74564 A IL 74564A IL 7456485 A IL7456485 A IL 7456485A IL 74564 A IL74564 A IL 74564A
Authority
IL
Israel
Prior art keywords
base material
printed circuit
circuit boards
laminated base
producing copper
Prior art date
Application number
IL74564A
Other languages
English (en)
Other versions
IL74564A0 (en
Original Assignee
President Eng Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19843413434 external-priority patent/DE3413434A1/de
Application filed by President Eng Corp filed Critical President Eng Corp
Publication of IL74564A0 publication Critical patent/IL74564A0/xx
Publication of IL74564A publication Critical patent/IL74564A/xx

Links

IL74564A 1984-04-10 1985-03-11 Process for producing copper-laminated base material for printed circuit boards IL74564A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843413434 DE3413434A1 (de) 1984-04-10 1984-04-10 Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten
EP85101282A EP0158027B2 (de) 1984-04-10 1985-02-07 Verfahren zum Herstellen von kupferkaschiertem Basismaterial für Leiterplatten

Publications (2)

Publication Number Publication Date
IL74564A0 IL74564A0 (en) 1985-06-30
IL74564A true IL74564A (en) 1989-10-31

Family

ID=25820258

Family Applications (1)

Application Number Title Priority Date Filing Date
IL74564A IL74564A (en) 1984-04-10 1985-03-11 Process for producing copper-laminated base material for printed circuit boards

Country Status (20)

Country Link
AR (1) AR241096A1 (xx)
AT (1) ATE53537T1 (xx)
AU (1) AU579620B2 (xx)
BR (1) BR8501652A (xx)
CS (1) CS276234B6 (xx)
DK (1) DK164092C (xx)
EG (1) EG18033A (xx)
ES (2) ES8701049A1 (xx)
FI (1) FI851401L (xx)
GR (1) GR850874B (xx)
HU (1) HU192688B (xx)
IL (1) IL74564A (xx)
MX (1) MX158423A (xx)
NO (1) NO851405L (xx)
NZ (1) NZ211703A (xx)
PL (1) PL152229B1 (xx)
PT (1) PT80255B (xx)
RO (1) RO92976A (xx)
TR (1) TR22276A (xx)
YU (2) YU44997B (xx)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0133280A3 (en) * 1983-08-01 1986-03-19 American Cyanamid Company Thermoset interleafed resin matrix composites with improved compression properties
EP0133281A3 (en) * 1983-08-01 1988-11-30 American Cyanamid Company Curable fibre reinforced epoxy resin composition
EP0159482A3 (en) * 1984-03-28 1987-02-25 American Cyanamid Company Resin matrix composites with controlled flow and tack

Also Published As

Publication number Publication date
TR22276A (tr) 1986-12-10
AR241096A1 (es) 1991-10-31
YU41485A (en) 1988-06-30
DK159185A (da) 1985-10-11
AU579620B2 (en) 1988-12-01
DK164092B (da) 1992-05-11
ES556844A0 (es) 1987-08-01
NZ211703A (en) 1987-07-31
ES8701049A1 (es) 1986-11-16
DK159185D0 (da) 1985-04-09
PT80255A (de) 1985-05-01
MX158423A (es) 1989-01-30
CS8502621A2 (en) 1991-07-16
BR8501652A (pt) 1985-12-03
AU4092685A (en) 1985-10-17
AR241096A2 (es) 1991-10-31
PL152229B1 (en) 1990-11-30
PT80255B (pt) 1987-08-19
FI851401L (fi) 1985-10-11
YU173287A (en) 1989-10-31
GR850874B (xx) 1985-11-25
RO92976A (ro) 1987-11-30
YU44997B (en) 1991-06-30
EG18033A (en) 1991-12-30
NO851405L (no) 1985-10-11
PL252848A1 (en) 1985-12-17
HU192688B (en) 1987-06-29
ATE53537T1 (de) 1990-06-15
FI851401A0 (fi) 1985-04-09
ES542063A0 (es) 1986-11-16
ES8801773A1 (es) 1987-08-01
CS276234B6 (en) 1992-05-13
HUT37897A (en) 1986-03-28
IL74564A0 (en) 1985-06-30
YU45452B (en) 1992-05-28
DK164092C (da) 1992-10-12

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Legal Events

Date Code Title Description
KB Patent renewed
EXP Patent expired