IL75284A0 - Process and compositions for producing base boards for printed circuits - Google Patents

Process and compositions for producing base boards for printed circuits

Info

Publication number
IL75284A0
IL75284A0 IL75284A IL7528485A IL75284A0 IL 75284 A0 IL75284 A0 IL 75284A0 IL 75284 A IL75284 A IL 75284A IL 7528485 A IL7528485 A IL 7528485A IL 75284 A0 IL75284 A0 IL 75284A0
Authority
IL
Israel
Prior art keywords
compositions
printed circuits
base boards
producing base
producing
Prior art date
Application number
IL75284A
Original Assignee
Rhone Poulenc Rech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Rech filed Critical Rhone Poulenc Rech
Publication of IL75284A0 publication Critical patent/IL75284A0/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
IL75284A 1984-06-25 1985-05-22 Process and compositions for producing base boards for printed circuits IL75284A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8410185A FR2566611A1 (en) 1984-06-25 1984-06-25 NEW INJECTED PRINTED CIRCUITS AND METHOD OF OBTAINING THE SAME

Publications (1)

Publication Number Publication Date
IL75284A0 true IL75284A0 (en) 1985-09-29

Family

ID=9305534

Family Applications (1)

Application Number Title Priority Date Filing Date
IL75284A IL75284A0 (en) 1984-06-25 1985-05-22 Process and compositions for producing base boards for printed circuits

Country Status (5)

Country Link
EP (1) EP0166665A3 (en)
JP (1) JPS6119318A (en)
KR (1) KR860000789A (en)
FR (1) FR2566611A1 (en)
IL (1) IL75284A0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
FR2812515B1 (en) * 2000-07-27 2003-08-01 Kermel METHOD FOR PRODUCING A CIRCUITRY COMPRISING CONDUCTIVE TRACKS, PELLETS AND MICROTRAVERSES AND USE OF THIS METHOD FOR PRODUCING HIGH INTEGRATED DENSITY MULTI-LAYER CIRCUITS

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1290088A (en) * 1960-05-31 1962-04-06 Photocircuits Corp Printed circuit manufacturing process
FR2498873A1 (en) * 1981-01-23 1982-07-30 Sev Alternateurs Printed circuit mfr. using thick film track - subsequently thickened by chemical-and electro-deposition
FR2516739A1 (en) * 1981-11-17 1983-05-20 Rhone Poulenc Spec Chim METHOD FOR MANUFACTURING HYBRID-LIKE ELECTRONIC CIRCUITS WITH THICK-COATED LAYERS, MEANS FOR CARRYING OUT SAID METHOD AND CIRCUITS OBTAINED BY SAID METHOD
FR2518126B1 (en) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim PROCESS FOR THE METALLIZATION OF ELECTRICALLY INSULATING ARTICLES OF PLASTIC MATERIAL AND THE INTERMEDIATE AND FINISHED ARTICLES OBTAINED ACCORDING TO THIS PROCESS
FR2544340A1 (en) * 1983-04-15 1984-10-19 Rhone Poulenc Rech PROCESS FOR METALLIZING ELECTRICALLY INSULATING FLEXIBLE FILMS OF THERMOSTABLE PLASTIC MATERIAL AND ARTICLES THEREFOR

Also Published As

Publication number Publication date
EP0166665A3 (en) 1986-07-23
FR2566611A1 (en) 1985-12-27
EP0166665A2 (en) 1986-01-02
KR860000789A (en) 1986-01-30
JPS6119318A (en) 1986-01-28

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