GB2203290B - Manufacture of printed circuit boards - Google Patents

Manufacture of printed circuit boards

Info

Publication number
GB2203290B
GB2203290B GB8802538A GB8802538A GB2203290B GB 2203290 B GB2203290 B GB 2203290B GB 8802538 A GB8802538 A GB 8802538A GB 8802538 A GB8802538 A GB 8802538A GB 2203290 B GB2203290 B GB 2203290B
Authority
GB
United Kingdom
Prior art keywords
manufacture
printed circuit
circuit boards
boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8802538A
Other versions
GB8802538D0 (en
GB2203290A (en
Inventor
Phillip George Breret Hamilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of GB8802538D0 publication Critical patent/GB8802538D0/en
Publication of GB2203290A publication Critical patent/GB2203290A/en
Application granted granted Critical
Publication of GB2203290B publication Critical patent/GB2203290B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/002Etching of the substrate by chemical or physical means by liquid chemical etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0358Resin coated copper [RCC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/0554Metal used as mask for etching vias, e.g. by laser ablation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB8802538A 1987-04-02 1988-02-04 Manufacture of printed circuit boards Expired - Fee Related GB2203290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878707929A GB8707929D0 (en) 1987-04-02 1987-04-02 Printed circuit boards

Publications (3)

Publication Number Publication Date
GB8802538D0 GB8802538D0 (en) 1988-03-02
GB2203290A GB2203290A (en) 1988-10-12
GB2203290B true GB2203290B (en) 1990-11-07

Family

ID=10615140

Family Applications (2)

Application Number Title Priority Date Filing Date
GB878707929A Pending GB8707929D0 (en) 1987-04-02 1987-04-02 Printed circuit boards
GB8802538A Expired - Fee Related GB2203290B (en) 1987-04-02 1988-02-04 Manufacture of printed circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB878707929A Pending GB8707929D0 (en) 1987-04-02 1987-04-02 Printed circuit boards

Country Status (1)

Country Link
GB (2) GB8707929D0 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board
JP3290041B2 (en) * 1995-02-17 2002-06-10 インターナショナル・ビジネス・マシーンズ・コーポレーション Multilayer printed circuit board, method for manufacturing multilayer printed circuit board
JP3624967B2 (en) * 1995-06-01 2005-03-02 日立化成工業株式会社 Manufacturing method of multilayer printed wiring board
ID19337A (en) * 1996-12-26 1998-07-02 Ajinomoto Kk INTER-PLATIN ADHESIVE FILM FOR MANUFACTURING BOARDS OF MOLD PLATED CABLES AND MANY MOLD PLATE CABLES USING THIS FILM
US6931723B1 (en) * 2000-09-19 2005-08-23 International Business Machines Corporation Organic dielectric electronic interconnect structures and method for making
JP2003031952A (en) * 2001-07-12 2003-01-31 Meiko:Kk Core substrate and multilayer circuit board using the same
CN103188862B (en) * 2011-12-30 2015-11-04 深圳振华富电子有限公司 A kind of pcb board and preparation method thereof and electronic devices and components

Also Published As

Publication number Publication date
GB8802538D0 (en) 1988-03-02
GB8707929D0 (en) 1987-05-07
GB2203290A (en) 1988-10-12

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040204