GB2203290B - Manufacture of printed circuit boards - Google Patents
Manufacture of printed circuit boardsInfo
- Publication number
- GB2203290B GB2203290B GB8802538A GB8802538A GB2203290B GB 2203290 B GB2203290 B GB 2203290B GB 8802538 A GB8802538 A GB 8802538A GB 8802538 A GB8802538 A GB 8802538A GB 2203290 B GB2203290 B GB 2203290B
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacture
- printed circuit
- circuit boards
- boards
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB878707929A GB8707929D0 (en) | 1987-04-02 | 1987-04-02 | Printed circuit boards |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8802538D0 GB8802538D0 (en) | 1988-03-02 |
GB2203290A GB2203290A (en) | 1988-10-12 |
GB2203290B true GB2203290B (en) | 1990-11-07 |
Family
ID=10615140
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB878707929A Pending GB8707929D0 (en) | 1987-04-02 | 1987-04-02 | Printed circuit boards |
GB8802538A Expired - Fee Related GB2203290B (en) | 1987-04-02 | 1988-02-04 | Manufacture of printed circuit boards |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB878707929A Pending GB8707929D0 (en) | 1987-04-02 | 1987-04-02 | Printed circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB8707929D0 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03196691A (en) * | 1989-12-26 | 1991-08-28 | Cmk Corp | Formation of insulating layer of printed wiring board |
JP3290041B2 (en) * | 1995-02-17 | 2002-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Multilayer printed circuit board, method for manufacturing multilayer printed circuit board |
JP3624967B2 (en) * | 1995-06-01 | 2005-03-02 | 日立化成工業株式会社 | Manufacturing method of multilayer printed wiring board |
ID19337A (en) * | 1996-12-26 | 1998-07-02 | Ajinomoto Kk | INTER-PLATIN ADHESIVE FILM FOR MANUFACTURING BOARDS OF MOLD PLATED CABLES AND MANY MOLD PLATE CABLES USING THIS FILM |
US6931723B1 (en) * | 2000-09-19 | 2005-08-23 | International Business Machines Corporation | Organic dielectric electronic interconnect structures and method for making |
JP2003031952A (en) * | 2001-07-12 | 2003-01-31 | Meiko:Kk | Core substrate and multilayer circuit board using the same |
CN103188862B (en) * | 2011-12-30 | 2015-11-04 | 深圳振华富电子有限公司 | A kind of pcb board and preparation method thereof and electronic devices and components |
-
1987
- 1987-04-02 GB GB878707929A patent/GB8707929D0/en active Pending
-
1988
- 1988-02-04 GB GB8802538A patent/GB2203290B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB8802538D0 (en) | 1988-03-02 |
GB8707929D0 (en) | 1987-05-07 |
GB2203290A (en) | 1988-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20040204 |