GB8818477D0 - Method of manufacturing printed circuit boards - Google Patents

Method of manufacturing printed circuit boards

Info

Publication number
GB8818477D0
GB8818477D0 GB888818477A GB8818477A GB8818477D0 GB 8818477 D0 GB8818477 D0 GB 8818477D0 GB 888818477 A GB888818477 A GB 888818477A GB 8818477 A GB8818477 A GB 8818477A GB 8818477 D0 GB8818477 D0 GB 8818477D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
manufacturing printed
manufacturing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB888818477A
Other versions
GB2217918A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jung H Y
Original Assignee
Jung H Y
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jung H Y filed Critical Jung H Y
Publication of GB8818477D0 publication Critical patent/GB8818477D0/en
Publication of GB2217918A publication Critical patent/GB2217918A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8818477A 1988-04-27 1988-08-03 Method of manufacturing printed circuit boards Withdrawn GB2217918A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880004795A KR910000571B1 (en) 1988-04-27 1988-04-27 Making method for printed circuit board

Publications (2)

Publication Number Publication Date
GB8818477D0 true GB8818477D0 (en) 1988-09-07
GB2217918A GB2217918A (en) 1989-11-01

Family

ID=19273905

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8818477A Withdrawn GB2217918A (en) 1988-04-27 1988-08-03 Method of manufacturing printed circuit boards

Country Status (3)

Country Link
JP (1) JPH01278794A (en)
KR (1) KR910000571B1 (en)
GB (1) GB2217918A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442413B1 (en) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 Method for preparing a plastic substrate having a metal micropattern on the surface thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1116299A (en) * 1967-04-05 1968-06-06 United Carr Inc Method of preparing printed circuits
US4401521A (en) * 1980-11-28 1983-08-30 Asahi Kasei Kogyo Kabushiki Kaisha Method for manufacturing a fine-patterned thick film conductor structure
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
EP0185998A1 (en) * 1984-12-14 1986-07-02 Dynamics Research Corporation Interconnection circuits made from transfer electroforming

Also Published As

Publication number Publication date
GB2217918A (en) 1989-11-01
JPH01278794A (en) 1989-11-09
KR890016887A (en) 1989-11-30
KR910000571B1 (en) 1991-01-26

Similar Documents

Publication Publication Date Title
EP0361192A3 (en) Method of making circuit boards
GB2153595B (en) Printed circuit board and method of manufacturing such a board
KR890016886A (en) Manufacturing method of printed circuit board
KR940004052B1 (en) Method of manufacturing printed circuit board
GB2246243B (en) Printed wiring board and method of manufacturing same
EP0231795A3 (en) Method for making printed circuit boards
GB9207285D0 (en) Method of manufacturing printed wiring boards
ZA873846B (en) Method for manufacture of printed circuit boards
DE3663433D1 (en) Printed circuit board and method of manufacturing the same
GB2246480B (en) A method of manufacturing a printed circuit board
GB2247110B (en) A method of producing a printed circuit board
EP0413540A3 (en) Manufacture of printed circuit board assemblies
GB2141879B (en) Manufacture of printed circuit boards
ZA873844B (en) Method for manufacture of printed circuit boards
GB8630392D0 (en) Producing printed circuit boards
GB2203290B (en) Manufacture of printed circuit boards
GB8705543D0 (en) Printed circuit board
GB2193730B (en) Production of printed circuit boards
GB8815275D0 (en) Method of manufacturing printed circuit boards
GB9207722D0 (en) Method of manufacturing printed wiring boards
GB8818477D0 (en) Method of manufacturing printed circuit boards
ZA873845B (en) Method for manufacture of printed circuit boards
GB2247359B (en) Method of manufacturing printed circuit boards
GB2246667B (en) Method of manufacturing printed circuit boards
EP0349161A3 (en) Printed wiring board fabrication method

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)