GB8728865D0 - Apparatus & method for manufacture of printed circuit board & prototypes - Google Patents

Apparatus & method for manufacture of printed circuit board & prototypes

Info

Publication number
GB8728865D0
GB8728865D0 GB878728865A GB8728865A GB8728865D0 GB 8728865 D0 GB8728865 D0 GB 8728865D0 GB 878728865 A GB878728865 A GB 878728865A GB 8728865 A GB8728865 A GB 8728865A GB 8728865 D0 GB8728865 D0 GB 8728865D0
Authority
GB
United Kingdom
Prior art keywords
prototypes
manufacture
circuit board
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB878728865A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VERSATRONICS Ltd
Original Assignee
VERSATRONICS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VERSATRONICS Ltd filed Critical VERSATRONICS Ltd
Priority to GB878728865A priority Critical patent/GB8728865D0/en
Publication of GB8728865D0 publication Critical patent/GB8728865D0/en
Priority to IL88634A priority patent/IL88634A0/en
Priority to CN88109246A priority patent/CN1035409A/en
Priority to AU29357/89A priority patent/AU2935789A/en
Priority to ZA889270A priority patent/ZA889270B/en
Priority to PCT/GB1988/001124 priority patent/WO1989005566A1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
GB878728865A 1987-12-10 1987-12-10 Apparatus & method for manufacture of printed circuit board & prototypes Pending GB8728865D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB878728865A GB8728865D0 (en) 1987-12-10 1987-12-10 Apparatus & method for manufacture of printed circuit board & prototypes
IL88634A IL88634A0 (en) 1987-12-10 1988-12-08 Apparatus and method for the manufacture of printed circuit prototypes
CN88109246A CN1035409A (en) 1987-12-10 1988-12-10 Make the equipment and the method for printed circuit prototypes
AU29357/89A AU2935789A (en) 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board prototypes
ZA889270A ZA889270B (en) 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board and prototypes
PCT/GB1988/001124 WO1989005566A1 (en) 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board prototypes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878728865A GB8728865D0 (en) 1987-12-10 1987-12-10 Apparatus & method for manufacture of printed circuit board & prototypes

Publications (1)

Publication Number Publication Date
GB8728865D0 true GB8728865D0 (en) 1988-01-27

Family

ID=10628294

Family Applications (1)

Application Number Title Priority Date Filing Date
GB878728865A Pending GB8728865D0 (en) 1987-12-10 1987-12-10 Apparatus & method for manufacture of printed circuit board & prototypes

Country Status (6)

Country Link
CN (1) CN1035409A (en)
AU (1) AU2935789A (en)
GB (1) GB8728865D0 (en)
IL (1) IL88634A0 (en)
WO (1) WO1989005566A1 (en)
ZA (1) ZA889270B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113301789A (en) * 2021-05-21 2021-08-24 长春思为科技有限公司 Circuit board production equipment for multi-station surface mounting

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055194C (en) * 1997-11-21 2000-08-02 厦门市科学技术委员会 Covered copper plate fast printing method
CN100544549C (en) * 2005-09-30 2009-09-23 鸿富锦精密工业(深圳)有限公司 Circuit board aided design system and method
CN101778538B (en) * 2006-06-02 2013-04-17 刘扬名 Device system for producing nano spraying circuit boards
CN102765136A (en) * 2012-07-12 2012-11-07 深圳市常兴金刚石磨具有限公司 Grinding machining method for small-sized drill bit
CN102975501B (en) * 2012-12-18 2015-07-15 武汉大学 Circuit board printing system and printing method
CN114599149B (en) * 2022-05-10 2022-07-15 四川英创力电子科技股份有限公司 Double-sided precise targeting device and method for HDI board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1140976A (en) * 1966-09-23 1969-01-22 Marconi Co Ltd Improvements in or relating to photographic picture or pattern apparatus
GB1367601A (en) * 1971-11-23 1974-09-18 Harris G P Circuit systems
US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
US4654956A (en) * 1985-04-16 1987-04-07 Protocad, Inc. Drill apparatus for use with computer controlled plotter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113301789A (en) * 2021-05-21 2021-08-24 长春思为科技有限公司 Circuit board production equipment for multi-station surface mounting

Also Published As

Publication number Publication date
WO1989005566A1 (en) 1989-06-15
ZA889270B (en) 1989-08-30
AU2935789A (en) 1989-07-05
CN1035409A (en) 1989-09-06
IL88634A0 (en) 1989-07-31

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