WO1989005566A1 - Apparatus and method for the manufacture of printed circuit board prototypes - Google Patents

Apparatus and method for the manufacture of printed circuit board prototypes Download PDF

Info

Publication number
WO1989005566A1
WO1989005566A1 PCT/GB1988/001124 GB8801124W WO8905566A1 WO 1989005566 A1 WO1989005566 A1 WO 1989005566A1 GB 8801124 W GB8801124 W GB 8801124W WO 8905566 A1 WO8905566 A1 WO 8905566A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
marking instrument
printed circuit
mounting
circuit board
Prior art date
Application number
PCT/GB1988/001124
Other languages
French (fr)
Inventor
Paul Frederick Mills
Original Assignee
Versatronics Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versatronics Limited filed Critical Versatronics Limited
Publication of WO1989005566A1 publication Critical patent/WO1989005566A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Definitions

  • This invention relates to a method and apparatus especially for producing printed circuit board prototypes.
  • This invention provides an apparatus for use in producing prototype printed circuit boards comprising an X-Y table, means for positively locating a substrate on the carriage of the X-Y table, a mounting head or heads arranged over the carriage of X-Y table, mounting means carried by the mounting head or heads and at least two interchangeable means capable of being mounted in the mounting means and including a marking instrument and a drilling tool, drive means for moving the ounting head or heads relative to the substrate and/or for -. moving the substrate relative to the mounting head or heads in mutually perpendicular X and " directions and for raising and lowering at least the drilling tool when carried in the mounting means, in response to signals in accordance with a predetermined pattern and store means for storing said drive pattern signals and for passing the signals to the drive means.
  • the substrate is positively located on the X-Y table and the marking instrument and/or the substrate is positively driven in accordance with the signals passed to the drive .
  • the marking instrument and/or the substrate is positively driven in accordance with the signals passed to the drive .
  • the drive means may be means for moving a mounting means in both X and Y directions relative to a stationary substrate, means for moving the substrate in the X and Y directions relative to a stationary mounting means but preferably includes means for moving the mounting means in either the X or Y direction and means for moving the substrate in the other direction.
  • the marking instrument may be means such as a pen or the like for applying a line of ink or the like to the substrate when bought into contact with the substrate or means for applying ink or the like when spaced from the substrate, for example an ink jet printing means, or may be means for applying polymerising radiation, especially UV radiation.
  • the marking instrument operates in a raster mode, that is to say, it scans the substrate and at the places where marking is to be produced applies the marking in overlapping circular form.
  • the substrate may be a conductive coated dielectric sheet, in which case the markings are made in etch resistant masking ink so that after marking and drilling the unmasked surface of the sheet can be etched away.
  • the substrate may be covered with a poly erisable resist that can be polymerised by means of polymerising radiation from the marking instrument, whereafter the unpoly erised coating is removed and the resulting substrate is subjected to etching.
  • the marking instrument may be used to apply a conductive ink directly onto the surface of a dielectric substrate thereby avoiding the need for chemical etching or other developing of the printed circuit board.
  • the marking instrument may apply the markings to a drafting film which may then be applied to the dielectric sheet, exposed, and developed. The film and sheet are registered by aligning holes drilled in the sheet with pads on the film.
  • a single mounting head may be provided with mounting means for releasably receiving the marking instrument and drilling tool or two or more mounting heads may be provided, one with mounting means for the marking instrument and the other with mounting means for the drilling. In this latter case each mounting head must be moveable to a rest position in which it does not interfere with operation of the other mounting head.
  • the invention also provides a method of forming a prototype printed circuit board which comprises designing the circuit layout for a printed circuit board using a CAD system,storing the layout for example, in microcomputer means or on a recording medium for use with.microcomputer means, positioning , a substrate on the X-Y table of an apparatus according to the invention for forming the circuit pattern thereon, passing the stored signals to the drive means to cause a marking instrument mounted in the mounting means to move relative to a first surface of the substrate to reproduce the circuit layout on said first surface, substituting the marking instrument by a drilling tool and passing stored signals to the drive means to cause the drilling tool to move relative to the substrate and to drill holes through the substrate in the positions corresponding to positions of pads in the circuit pattern of the circuit and then, if necessary, developing the printed circuit board.
  • the substrate is turned over and the marking process is repeated on the other surface of the substrate so that the circuit- lines and pads are substantially in line on the two sides of the substrate.
  • Fig.1 is a schematic view of one form of X-Y table usable in the invention
  • Fig.2 is a block diagram illustrating the process of the invention.
  • the X-Y table comprises a carriage 1 with means, not shown, for positively locating a substrate on the carriage 1.
  • the substrate may be mounted on a frame, the frame having locating holes which register with mounting pegs on the carriage.
  • the carriage 1 is supported on slides 2 and is driveable by drive motor 3 via drive belt 4 to be movable in the X-direction.
  • a mounting head 5 Positioned above the carriage 1 is a mounting head 5 which is carried on slides 6 and is movable by drive belt 7 driven by drive motor 8, in the Y-direction of the X-Y table.
  • Mounting head 5 has means 9 for interchangeably mounting a marking instrument (not shown) and a drilling tool (not shown) the munting means 9 is arranged on the mounting head such that a tool carried on the mounting head can be moved to an operative position in which it carried out a desired operation on the substrate and to an inoperative position in which it is spaced from the substrate.
  • marking instrument not shown
  • drilling tool not shown
  • Such means are not shown in the drawing but the arrangement for such means will be readily apparent to the man skilled in the art.
  • Control of the drive means for the carriage 1 in the X-direction and for the mounting head 5 in the Y-direction and for raising and lowering the tool carried in mounting head 5 is in response to signals generated from memory store 11 (see Fig.2). Initially the signals output from the store control the marking instrument and the X and Y drive motors 3 and 8 to deposit the circuit layout in etch resistant ink directly onto the substrate surface of the sheet.
  • the output signals are then used to control the motors 3 and 8 while the drilling tool is in position, the signals also controlling raising and lowering of the drill bit as required.
  • the PCB layout may be designed on a display terminal 14. To speed up design, all software in the design package is stored in the system memory which requires that a comparatively large memory is required.
  • Library information may be stored, for example, on disc.
  • the PCB layout is designed using a combination of components stored in the system library and user defined components.
  • the need for a standard keyboard is dispensed with by using a mouse.
  • the centre mouse key provides a menu for user defined components the pad footprint is first defined and then a label attached to each pad text and a component outline is then added.
  • Positioning of the components on the screen is controlled by the mouse which may rotate, move or copy components. Tracks between pads may be removed and replaced withj logical temporary connection. Higher magnification of an area is possible to assist in making connections between pads.
  • Tracks may be drawn on the screen using the cursor, movement of which is controlled by the mouse. Tracks may be edited by positioning the cursor at the starting point and drawing the track. Via pads may be inserted to continue the track on the other conductive layer. Alternatively the logical connections may be made first. The cursor locks onto the pads being connected, causing the label attached to the pad to be displayed. This method enables error free connections to be made very quickly. The connections made can them be edited as tracks manually.
  • Tracks may be erased and redrawn and areas of the design may be moved and reproduced. Once the connections to be made have been selected, the system will automatically route the tracks on the screen until the complete layout has been drawn.
  • the multipass auto route system used provides tracks that can have 45° angles, and vias are only included when necessary. On complex circuits, more than one pass may be necessary to define all the connection paths. Subsequent passes learn from previous attempts until all paths have been connected.
  • the prototype PCB is then produced as previously described.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A printed circuit board layout is first designed on a screen (14) using a computer aided design system. The layout is then marked either onto a film or a PCB substrate. Holes are drilled in the substrate at positions corresponding to pads on the circuit layer and the board is then developed.

Description

APPARATUS AND METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT
BOARD PROTOTYPES
This invention relates to a method and apparatus especially for producing printed circuit board prototypes.
The manufacture of printed circuit board prototypes is a long and tedious process. Hitherto the designer of a printed circuit board has normally produced a design on paper or film, the design is traced onto a printed circuit board precursor or is used for making a mask which is applied to the printed circuit board precursor or is used for making a mask which is applied to the printed circuit board precursor and the board is then developed, for example by etching. Since the circuit has to be present on both sides of the printed circuit board transfer of the design to the two surfaces of the board has to be very accurately carried out to ensure that at least the pads are sufficiently in register to allow electrical components to be functionally connected to the board. Very large numbers of rejects are produced by the prior method mainly due to lack of registration on the two sides of the board which does not become apparent until after the board has been completed.
This invention provides an apparatus for use in producing prototype printed circuit boards comprising an X-Y table, means for positively locating a substrate on the carriage of the X-Y table, a mounting head or heads arranged over the carriage of X-Y table, mounting means carried by the mounting head or heads and at least two interchangeable means capable of being mounted in the mounting means and including a marking instrument and a drilling tool, drive means for moving the ounting head or heads relative to the substrate and/or for -. moving the substrate relative to the mounting head or heads in mutually perpendicular X and " directions and for raising and lowering at least the drilling tool when carried in the mounting means, in response to signals in accordance with a predetermined pattern and store means for storing said drive pattern signals and for passing the signals to the drive means.
Because the substrate is positively located on the X-Y table and the marking instrument and/or the substrate is positively driven in accordance with the signals passed to the drive . means accurate registration of the circuit layout on the two sides of the board is easily achieved.
The drive means may be means for moving a mounting means in both X and Y directions relative to a stationary substrate, means for moving the substrate in the X and Y directions relative to a stationary mounting means but preferably includes means for moving the mounting means in either the X or Y direction and means for moving the substrate in the other direction.
The marking instrument may be means such as a pen or the like for applying a line of ink or the like to the substrate when bought into contact with the substrate or means for applying ink or the like when spaced from the substrate, for example an ink jet printing means, or may be means for applying polymerising radiation, especially UV radiation. Preferably the marking instrument operates in a raster mode, that is to say, it scans the substrate and at the places where marking is to be produced applies the marking in overlapping circular form.
The substrate may be a conductive coated dielectric sheet, in which case the markings are made in etch resistant masking ink so that after marking and drilling the unmasked surface of the sheet can be etched away. As a first alternative the substrate may be covered with a poly erisable resist that can be polymerised by means of polymerising radiation from the marking instrument, whereafter the unpoly erised coating is removed and the resulting substrate is subjected to etching. As a further alternative the marking instrument may be used to apply a conductive ink directly onto the surface of a dielectric substrate thereby avoiding the need for chemical etching or other developing of the printed circuit board. As a still further alternative the marking instrument may apply the markings to a drafting film which may then be applied to the dielectric sheet, exposed, and developed. The film and sheet are registered by aligning holes drilled in the sheet with pads on the film.
A single mounting head may be provided with mounting means for releasably receiving the marking instrument and drilling tool or two or more mounting heads may be provided, one with mounting means for the marking instrument and the other with mounting means for the drilling. In this latter case each mounting head must be moveable to a rest position in which it does not interfere with operation of the other mounting head.
The invention also provides a method of forming a prototype printed circuit board which comprises designing the circuit layout for a printed circuit board using a CAD system,storing the layout for example, in microcomputer means or on a recording medium for use with.microcomputer means, positioning, a substrate on the X-Y table of an apparatus according to the invention for forming the circuit pattern thereon, passing the stored signals to the drive means to cause a marking instrument mounted in the mounting means to move relative to a first surface of the substrate to reproduce the circuit layout on said first surface, substituting the marking instrument by a drilling tool and passing stored signals to the drive means to cause the drilling tool to move relative to the substrate and to drill holes through the substrate in the positions corresponding to positions of pads in the circuit pattern of the circuit and then, if necessary, developing the printed circuit board.
Where the circuit is reproduced onto the substrate, the substrate is turned over and the marking process is repeated on the other surface of the substrate so that the circuit- lines and pads are substantially in line on the two sides of the substrate.
It will of course be appreciated that when the substrate is turned over the circuit layout must be reproduced in mirror image or in inverted mirror image depending on how the substrate is turned.
The invention will now be described in greater detail by way of example with reference to the drawings in which Fig.1 is a schematic view of one form of X-Y table usable in the invention and Fig.2 is a block diagram illustrating the process of the invention.
Referring first to Fig.1 the X-Y table comprises a carriage 1 with means, not shown, for positively locating a substrate on the carriage 1. The substrate may be mounted on a frame, the frame having locating holes which register with mounting pegs on the carriage. The carriage 1 is supported on slides 2 and is driveable by drive motor 3 via drive belt 4 to be movable in the X-direction.
Positioned above the carriage 1 is a mounting head 5 which is carried on slides 6 and is movable by drive belt 7 driven by drive motor 8, in the Y-direction of the X-Y table.
Mounting head 5 has means 9 for interchangeably mounting a marking instrument (not shown) and a drilling tool (not shown) the munting means 9 is arranged on the mounting head such that a tool carried on the mounting head can be moved to an operative position in which it carried out a desired operation on the substrate and to an inoperative position in which it is spaced from the substrate. Such means are not shown in the drawing but the arrangement for such means will be readily apparent to the man skilled in the art.
Control of the drive means for the carriage 1 in the X-direction and for the mounting head 5 in the Y-direction and for raising and lowering the tool carried in mounting head 5 is in response to signals generated from memory store 11 (see Fig.2). Initially the signals output from the store control the marking instrument and the X and Y drive motors 3 and 8 to deposit the circuit layout in etch resistant ink directly onto the substrate surface of the sheet.
The output signals are then used to control the motors 3 and 8 while the drilling tool is in position, the signals also controlling raising and lowering of the drill bit as required.
The PCB layout may be designed on a display terminal 14. To speed up design, all software in the design package is stored in the system memory which requires that a comparatively large memory is required.
1.2 M Bytes has proved satisfactory. Library information may be stored, for example, on disc.
The PCB layout is designed using a combination of components stored in the system library and user defined components. The need for a standard keyboard is dispensed with by using a mouse. The centre mouse key provides a menu for user defined components the pad footprint is first defined and then a label attached to each pad text and a component outline is then added.
Positioning of the components on the screen is controlled by the mouse which may rotate, move or copy components. Tracks between pads may be removed and replaced withj logical temporary connection. Higher magnification of an area is possible to assist in making connections between pads.
Tracks may be drawn on the screen using the cursor, movement of which is controlled by the mouse. Tracks may be edited by positioning the cursor at the starting point and drawing the track. Via pads may be inserted to continue the track on the other conductive layer. Alternatively the logical connections may be made first. The cursor locks onto the pads being connected, causing the label attached to the pad to be displayed. This method enables error free connections to be made very quickly. The connections made can them be edited as tracks manually.
Tracks may be erased and redrawn and areas of the design may be moved and reproduced. Once the connections to be made have been selected, the system will automatically route the tracks on the screen until the complete layout has been drawn.
The multipass auto route system used provides tracks that can have 45° angles, and vias are only included when necessary. On complex circuits, more than one pass may be necessary to define all the connection paths. Subsequent passes learn from previous attempts until all paths have been connected.
The prototype PCB is then produced as previously described.

Claims

C L A I M S
1. Apparatus for use in producing prototype printed circuit boards comprising an X-Y table, means for positively locating, a substrate on the carriage of the X-Y table, a mounting head or heads arranged over the carriage of X-Y table, mounting means carried by the mounting head or heads and at least two interchangeable means capable of being mounted in the mounting means and including a marking instrument and a drilling tool, drive means for moving the mounting head or heads relative to the substrate and/or for moving the substrate relative to the mounting head or heads in mutually perpendicular X and Y directions and for raising and lowering at least the drilling tool when carried in the mounting means, in response to signals in accordance with a predetermined pattern and store means for storing said drive pattern signals and for passing the signals to the drive means.
2. Apparatus according to claim 1 wherein the drive means includes means for moving the mounting means in either the X or Y direction and means for moving the substrate in the other direction.
3. Apparatus according to claim 1 or claim 2 wherein the marking instrument is a pen or the like for applying a line of ink or the like to the substrate when bought into contact with the substrate.
4. Apparatus according to claim 1 or claim 2 wherein the marking instrument is an ink jet printing means.
5. Apparatus according to claim 1 or claim 2 wherein the marking instrument operates in a raster mode.
6. A method of forming a prototype printed circuit board which comprises designing the circuit layout for a printed circuit board using a CAD system, storing the layout for example, in a microcomputer means or on a recording medium for use with microcomputer means, positioning a substrate on the X-Y table of an apparatus according to the invention for forming the circuit pattern thereon, passing the stored signals to the drive means to cause a marking instrument mounted in the mounting means to move relative to a first surface of the substrate to reproduce the circuit layout on said first surface, substituting the marking instrument by a drilling tool and passing stored signals to the drive means to cause the drilling tool to move relative to the substrate and to drill holes through the substrate in the positions corresponding to positions of pads in the circuit pattern of the circuit and then, if necessary, developing the printed circuit board.
7. A method according to claim 6, wherein the substrate is a conductive coated dielectric sheet and the markings are made in etch resistant marking ink.
8. A method according to claim 6, wherein the substrate is covered with a polymerisable resist that can be polymerised by means of polymerising radiation from the marking instrument.
9. A method according to claim 6, wherein a conductive ink is applied directly onto the surface of a dielectric substrate.
PCT/GB1988/001124 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board prototypes WO1989005566A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB878728865A GB8728865D0 (en) 1987-12-10 1987-12-10 Apparatus & method for manufacture of printed circuit board & prototypes
GB8728865 1987-12-10

Publications (1)

Publication Number Publication Date
WO1989005566A1 true WO1989005566A1 (en) 1989-06-15

Family

ID=10628294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1988/001124 WO1989005566A1 (en) 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board prototypes

Country Status (6)

Country Link
CN (1) CN1035409A (en)
AU (1) AU2935789A (en)
GB (1) GB8728865D0 (en)
IL (1) IL88634A0 (en)
WO (1) WO1989005566A1 (en)
ZA (1) ZA889270B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101778538B (en) * 2006-06-02 2013-04-17 刘扬名 Device system for producing nano spraying circuit boards
CN114599149A (en) * 2022-05-10 2022-06-07 四川英创力电子科技股份有限公司 Double-sided precise targeting device and method for HDI board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055194C (en) * 1997-11-21 2000-08-02 厦门市科学技术委员会 Covered copper plate fast printing method
CN100544549C (en) * 2005-09-30 2009-09-23 鸿富锦精密工业（深圳）有限公司 Circuit board aided design system and method
CN102765136A (en) * 2012-07-12 2012-11-07 深圳市常兴金刚石磨具有限公司 Grinding machining method for small-sized drill bit
CN102975501B (en) * 2012-12-18 2015-07-15 武汉大学 Circuit board printing system and printing method
CN113301789B (en) * 2021-05-21 2023-04-11 长春思为科技有限公司 Circuit board production equipment for multi-station surface mounting

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Publication number Priority date Publication date Assignee Title
GB1140976A (en) * 1966-09-23 1969-01-22 Marconi Co Ltd Improvements in or relating to photographic picture or pattern apparatus
GB1367601A (en) * 1971-11-23 1974-09-18 Harris G P Circuit systems
WO1984001825A1 (en) * 1982-10-26 1984-05-10 Microscience Systems Corp Inking system for producing circuit patterns
US4654956A (en) * 1985-04-16 1987-04-07 Protocad, Inc. Drill apparatus for use with computer controlled plotter

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
GB1140976A (en) * 1966-09-23 1969-01-22 Marconi Co Ltd Improvements in or relating to photographic picture or pattern apparatus
GB1367601A (en) * 1971-11-23 1974-09-18 Harris G P Circuit systems
WO1984001825A1 (en) * 1982-10-26 1984-05-10 Microscience Systems Corp Inking system for producing circuit patterns
US4654956A (en) * 1985-04-16 1987-04-07 Protocad, Inc. Drill apparatus for use with computer controlled plotter

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Elektronik, vol. 34, no. 11, May 1985 (M}nchen, DE) R. Kleberhoff: "Leiter-platten-Entflechtung im Rasterverfahren - eine kostensparende Variante" pages 151-154 *
IBM Technical Disclosure Bulletin, vol. 21, no. 4, September 1978 (New York, US) J.R. Booth et al.: "Ink jet flat-bed plotter", pages 1543-1544 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101778538B (en) * 2006-06-02 2013-04-17 刘扬名 Device system for producing nano spraying circuit boards
CN114599149A (en) * 2022-05-10 2022-06-07 四川英创力电子科技股份有限公司 Double-sided precise targeting device and method for HDI board

Also Published As

Publication number Publication date
ZA889270B (en) 1989-08-30
AU2935789A (en) 1989-07-05
CN1035409A (en) 1989-09-06
IL88634A0 (en) 1989-07-31
GB8728865D0 (en) 1988-01-27

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