JPS58155791A - Device for forming pattern of circuit board - Google Patents
Device for forming pattern of circuit boardInfo
- Publication number
- JPS58155791A JPS58155791A JP3854482A JP3854482A JPS58155791A JP S58155791 A JPS58155791 A JP S58155791A JP 3854482 A JP3854482 A JP 3854482A JP 3854482 A JP3854482 A JP 3854482A JP S58155791 A JPS58155791 A JP S58155791A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- ink
- circuit board
- pattern
- forming pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は配線板のパターン形成装置に関し、特に液状の
絶縁体をジェット噴出発生させる機構による印刷配線板
のパターン形成装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern forming apparatus for a printed wiring board, and more particularly to a pattern forming apparatus for a printed wiring board using a mechanism for generating a jet of liquid insulator.
従来、印刷配線板などの配線板のパターン形成を数値制
御による自動作画で行なう場合、デザイン・オートメー
シロンやデジタイザー等によって作成さｎた磁気テープ
や、紙テープ尋の媒体上の配線パターンデータを数値制
御（ＮＣ）自動作画機に入力し、作画ヘッドをＸ軸、Ｙ
軸方向に移動させてフォトマスク材に無光させた後、現
偉処理を行なって、フォトマスク材上に所望の配線パタ
ーン介形成している。Conventionally, when forming patterns on wiring boards such as printed wiring boards by automatic drawing using numerical control, wiring pattern data on media such as magnetic tape or paper tape created by design automation or digitizer was numerically controlled. (NC) Input to the automatic drawing machine and move the drawing head to the X axis and Y axis.
After the photomask material is moved in the axial direction to make the photomask material opaque, a wiring process is performed to form a desired wiring pattern on the photomask material.
しかし、従来のＮＣ自動作画機による配線パターンの形
成では、フォトマスク材上に配置パターンを形成した後
、銅張積層板の銅箔上に配線パターンを形成させる壕で
の工程に、ドライフィルムなどのレジスト皮膜の塗布、
フォト印刷法による無光、覗倫処理および銅箔のエツチ
ング等に多大の工数と犬掻りな設備を必要とした。また
、フィルム材や化学溶剤攻との多くの消耗資材をも必要
とし、多品種少量生産に適さないという欠点があった。However, in the formation of wiring patterns using conventional NC automatic drawing machines, after forming the arrangement pattern on the photomask material, the wiring pattern is formed on the copper foil of the copper-clad laminate. application of resist film,
A large amount of man-hours and expensive equipment were required for the photo printing method, including the process of removing light, the etching of the copper foil, etc. In addition, it requires many consumable materials such as film materials and chemical solvents, and has the disadvantage that it is not suitable for high-mix, low-volume production.
本発明の目的はかかる従来欠点を除去した配線板のパタ
ーン形成装置を提供することＫＴｏる。SUMMARY OF THE INVENTION An object of the present invention is to provide a wiring board pattern forming apparatus that eliminates such conventional drawbacks.
本発明によｎは配線板のＮＣデータ化さｆたパターン情
報を電気的信号に変換する機構と、耐薬品性を有する液
状の絶縁体をジェット噴射発生させる機構とを有するこ
とを特徴とする配線板のパターン形成装置が得らｎる。According to the present invention, the device is characterized by having a mechanism for converting pattern information converted into NC data of a wiring board into an electrical signal, and a mechanism for generating a jet jet of a liquid insulator having chemical resistance. A wiring board pattern forming apparatus is obtained.
以下、本発明の実施例を図面を参照して説明する。第１
図は、本発明による配線板のパターン形成装置の構成を
示す斜視図である０図中、Ｘ方向移動桁１は、本体２の
幅に沿って平行に固定設置さｎたＸ方向レール３上を導
電ケーブル４よりの電気的信号によって水平移動する移
動桁支持台５と接続さｎており、公知のインクジ、ット
発生機構を有するＹ方向移動子６は、Ｘ方向移動桁１に
固定設置さ１．たＹ方向レール７上を導電クープル４よ
シの電気的信号によってＹ方向に移動する。Embodiments of the present invention will be described below with reference to the drawings. 1st
The figure is a perspective view showing the structure of the wiring board pattern forming apparatus according to the present invention. is connected to a movable girder support 5 which is horizontally moved by an electrical signal from a conductive cable 4, and a Y-direction mover 6 having a known ink jet generation mechanism is fixedly installed on the X-direction movable girder 1. Sa1. It moves in the Y direction on the Y direction rail 7 in response to an electrical signal from the conductive couple 4.
インクジェット発生機構のヘッド部８は、基材固定テー
ブル９に固定さｎた銅張積層板などの基材ｌＯの上面に
液状にした絶縁体のインク１２をインクジェット機構内
部の制御部（図示省略）よりの信号により噴射して、所
望の位置に配線パターンを形成するように構成さハてい
る。The head unit 8 of the inkjet generation mechanism is configured to control a control unit (not shown) inside the inkjet mechanism to apply liquid insulating ink 12 onto the upper surface of a base material 10 such as a copper-clad laminate fixed to a base material fixing table 9. The structure is such that a wiring pattern is formed at a desired position by being ejected in response to a signal from the center.
第２図は、インクジェット発生機構の主要構成部の拡大
図であり、導電ケーブル４と空気配管１１は本体２内部
に取シ付けらｎている制御部、圧縮ポンプ等（図示省略
）に接続さｎており、インク１２を貯溜するインクタン
ク１３とインク１２を噴射させるノズル１４から榊成さ
ｎている。FIG. 2 is an enlarged view of the main components of the inkjet generation mechanism, and the conductive cable 4 and air pipe 11 are connected to the control unit, compression pump, etc. (not shown) installed inside the main body 2. The ink tank 13 stores the ink 12 and the nozzle 14 ejects the ink 12.
本実施例のインクジェット発生機構では、静電ｄ引方式
を採用したもので、ノズル１４とアースさｒまた基材ｌ
Ｏの間に高電圧を印加して静電界を発生させ、イオン化
し几インク１２の粒子上ノズル１４から基材１０の銅箔
表面に向って噴出し、付着を行なっている。The inkjet generation mechanism of this embodiment employs an electrostatic d-pulling method, and the nozzle 14 is connected to the ground r and the base material l.
An electrostatic field is generated by applying a high voltage between the inks 12 and 12, and the ionized ink 12 is ejected from the nozzle 14 onto the surface of the copper foil of the base material 10 to adhere thereto.
本装置は、配線板のパターン情報を電気的イぎ号に変換
する機構を有しているので、導電ケーブル４から伝達さ
ｔ″した信号によって機構を作動させ、移動子のＸ、Ｙ
軸方向への移動制御、インクジェット発生の０Ｎ−ＯＦ
Ｆの制御およびインク噴出量の制御を行ない、銅張積層
板の表面上に直接配線パターンを形成することができる
。なお、本発明のインクは、鋼箔層をエツチングする溶
液に対して閉業品性を有し、かつ加熱乾燥によって硬化
固層する材料のものであｎばよい。Since this device has a mechanism that converts the pattern information of the wiring board into an electrical key code, the mechanism is activated by the signal t'' transmitted from the conductive cable 4, and the X, Y
Axial movement control, inkjet generation 0N-OF
By controlling F and the amount of ink ejected, a wiring pattern can be formed directly on the surface of a copper-clad laminate. The ink of the present invention only needs to be a material that is resistant to a solution for etching the steel foil layer and hardens and solidifies when heated and dried.
以上、本発明によｎば、簡単な装置ですみ、配線パター
ンの形成工数を削減できる。また、従来必要としたフィ
ルム材や化学溶剤、などの消耗資材が不要になり、低コ
スト化できる実用価値の大なるものである。As described above, according to the present invention, a simple device is required and the number of man-hours for forming wiring patterns can be reduced. In addition, it eliminates the need for consumable materials such as film materials and chemical solvents, which were required in the past, and has great practical value as it can reduce costs.
第１図は本発明の配線板パターン形成装置のインクジ、
ット発生磯構の一実施例の斜視図。第２図は第１図主要
部の拡大側断面図。
１・・・・・・Ｘ方向移動桁、２・旧・・本体、３・・
・・・・Ｘ方向レール、４・・・・・・導電ケーブル、
５・・・・・・移動桁支持台、６・・・・・・Ｙ方向移
動子、７・・・・・・Ｙ方向レール、８・・・・・・（
インクジェット機構の）ヘッド部、９・・・・・・基材
固定テーブル、ｌＯ・・・・・・基材、ｌｌ・・・・・
・空気配管、１２・・・・・・°インク、１３・・・・
・・インクタンク、１４・・・・・・ノズル、１５・・
・・・・アース。FIG. 1 shows an ink cartridge of a wiring board pattern forming apparatus of the present invention;
FIG. 2 is a perspective view of an embodiment of a rock formation. FIG. 2 is an enlarged side sectional view of the main part of FIG. 1. 1...X-direction moving digit, 2...old...main body, 3...
...X direction rail, 4... Conductive cable,
5...Moving girder support base, 6...Y direction mover, 7...Y direction rail, 8......(
(of the inkjet mechanism) head section, 9...substrate fixing table, lO...substrate, ll...
・Air piping, 12...°Ink, 13...
...Ink tank, 14... Nozzle, 15...
...Earth.
Claims (1)
信号に変換する機構と耐薬品性を有する液状の絶縁体を
ジェット噴射発生させる機構とを有することを特徴とす
る配線板のパターン形成装置。1. A pattern forming apparatus for a wiring board, comprising a mechanism for converting pattern information converted into numerical control data of the wiring board into an electrical signal, and a mechanism for jetting a liquid insulator having chemical resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3854482A JPS58155791A (en) | 1982-03-11 | 1982-03-11 | Device for forming pattern of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3854482A JPS58155791A (en) | 1982-03-11 | 1982-03-11 | Device for forming pattern of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58155791A true JPS58155791A (en) | 1983-09-16 |
Family
ID=12528223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3854482A Pending JPS58155791A (en) | 1982-03-11 | 1982-03-11 | Device for forming pattern of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58155791A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63194388A (en) * | 1987-02-06 | 1988-08-11 | 株式会社豊田自動織機製作所 | Method of forming printed board by ink-jet system |
| JP2006344961A (en) * | 2005-06-06 | 2006-12-21 | Fujifilm Electronic Imaging Ltd | Method of forming conductive pattern on substrate |
-
1982
- 1982-03-11 JP JP3854482A patent/JPS58155791A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63194388A (en) * | 1987-02-06 | 1988-08-11 | 株式会社豊田自動織機製作所 | Method of forming printed board by ink-jet system |
| JP2006344961A (en) * | 2005-06-06 | 2006-12-21 | Fujifilm Electronic Imaging Ltd | Method of forming conductive pattern on substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU631595B2 (en) | Improved method for making printed circuits | |
| US5250758A (en) | Methods and systems of preparing extended length flexible harnesses | |
| US4706167A (en) | Circuit wiring disposed on solder mask coating | |
| US6872321B2 (en) | Direct positive image photo-resist transfer of substrate design | |
| JPH11163499A (en) | Printed wiring board and manufacture thereof | |
| US7271099B2 (en) | Forming a conductive pattern on a substrate | |
| CN109413881B (en) | Manufacturing method of carbon oil circuit board and solder-mask windowing | |
| CN102272375A (en) | Apparatus and method for making fiducials on a substrate | |
| JPS58155791A (en) | Device for forming pattern of circuit board | |
| KR100481955B1 (en) | Roll to Roll Manufacturing Method for Double side Flexible Printed Circuit Board | |
| US20050272249A1 (en) | Method and system for producing conductive patterns on a substrate | |
| DE3728337C2 (en) | ||
| WO1989005566A1 (en) | Apparatus and method for the manufacture of printed circuit board prototypes | |
| WO1992020489A1 (en) | Methods and systems of preparing extended length flexible harnesses | |
| JP4505191B2 (en) | Electronic circuit board manufacturing equipment | |
| CN115707187A (en) | Circuit board, manufacturing method thereof and lens module | |
| CN206461842U (en) | Panel construction for making double-sided PCB board | |
| JPH03239552A (en) | Printing method of printed-wiring board | |
| US5196286A (en) | Method for patterning a substrate | |
| JP2001298253A (en) | Base film for printing, method of printing using the same, and wiring board manufactured thereby | |
| JPS59165494A (en) | Method of producing circuit board | |
| JPH09312463A (en) | Method of forming pattern | |
| JPS59202690A (en) | Multilayer printed circuit board | |
| JPS5850794A (en) | Method of forming electronic circuit | |
| JPS6118880B2 (en) |