JPS59165494A - Method of producing circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a method of manufacturing a printed circuit board.

[Background technology]

FIG. 1 is a diagram illustrating an outline of a conventional printed circuit board manufacturing process.

FIG. 2 is a diagram illustrating an outline of a conventional method for manufacturing a screen used in manufacturing a printed circuit board.

A photomask 3 is brought into contact with the surface of the screen 1 on which the emulsion 2 is applied and exposed as shown in 4.

A required pattern is drawn on the photomask 3 as a light-transmitting portion 3a1 and a light-shielding portion 3b. After that, the film was developed using Shinshin technology and dried to obtain a screen bag for printing.

Recently, pattern design and artwork work has been done using automatic design (hereinafter abbreviated as CAD) using computers.
And photo blocks using data created by CAD speed up and save labor.

However, as shown in FIG. 1, manufacturing the screen requires many steps, and the development period for the printed circuit board is long. In addition, due to the large number of processes required, many materials and equipment are required, such as emulsions, photomask films, screen meshes, screen frames, phenomenon chemicals, dark rooms, exposure equipment, etc., and the development costs are high. It is said that As described above, the conventional method for manufacturing printed circuit boards has a problem in that it is not sufficient from the viewpoint of economy and speed in fields where technological changes are rapid, such as the electronics industry.

[Purpose of the invention]

In order to solve the conventional problems, the present invention has developed an automatic control device using an XY plotter or an (hereinafter abbreviated as controller)
The present invention is characterized in that a required pattern is drawn on an etching resist using a pen using, for example, a microcomputer, and its purpose is to provide an efficient method of manufacturing a circuit board that shortens the fabrication period.

[Disclosure of the invention]

FIG. 3 is a diagram illustrating an outline of the process of manufacturing a circuit board according to the present invention.

FIG. 4 is a diagram illustrating the outline of a system configuration for manufacturing a circuit board according to the present invention.

Pattern design is done using CAD, and the resulting data is created in the form of magnetic tape, magnetic disk, etc. (Hereinafter, the data obtained in this way will simply be referred to as CAD.
I) abbreviated as data).

The CAD data (5) is sent to a drawing device 8, such as an xy plotter, via a controller (6), and a pattern 11 is drawn on the board using a pen 9. In addition to commercially available etching resist inks, etching resist pastes used in screen printing can be used as the ink. FIG. 5a schematically shows the state of drawing.

The circuit board 10 is made of an insulating material 12 and a conductive material 13, and it is desirable that the conductive material is formed almost uniformly on the board surface, including the portion where a circuit pattern is required.

Ink 14 is ejected through the pen tip 15 and applied onto the conductor 13. After the drawing is completed, the substrate 10 is subjected to an etching process, so that it has a shape as shown in FIG. Only the portion of the conductor 16 that requires a conductor remains on the insulating substrate 12, and a desired circuit board can be obtained. After the etching has been completed, the etched circuit board is further subjected to mounting after the etching film 14 is removed with a solvent.

Circuit boards are not limited to single-layer structures; double-sided boards,
It can also be applied to multilayer boards, etc. In addition, as an insulating material,
Substrate materials mainly made of synthetic resins such as paper phenol, paper epoxy, glass epoxy, and polyimide, and ceramic substrate materials such as alumina are applicable.

On the other hand, as the conductive material 13, copper foil, aluminum foil, or alloy foil thereof, a conductive material formed by applying and curing a metal-containing paste on the entire surface, and furthermore, copper, nickel, solder, etc. Conductive materials plated with such materials are applicable.

When using CAD data for drawing, it is necessary to convert the pattern data into data indicating pen movement.

This is because when drawing, it is necessary to move the pen according to the thickness of the pen tip, the presence or absence of overpainting, etc. The work of converting pattern data into data indicating pen movement can be performed by using a CAD converter, by using another converter, or by using the controller itself.

In addition, pattern design can be performed via the controller and monitor (
7) Perform CAD on screen and directly in controller
It is also possible to generate data.

Alternatively, it is also possible to directly generate CAD data in the controller using a monitor and digitizer.

[Embodiments of the invention]

Using a pen pre-filled with resist ink, X
It was drawn using a Y plotter.

Change the thickness of the pen tip as needed, from 0.1m wide to 1.0m wide.
I drew a pattern of chuujou. At the same time, move the pen back and forth 4 times while creating overlapping parts of lines with a width of 0.2 wan to fill in the lines.
I drew a line.

All of these operations could be executed by converting the CAD data using the controller.

After the drawing was completed, an aqueous mixed solution of ferric chloride and hydrochloric acid was sprayed on the substrate to remove unnecessary portions of the copper foil by etching. Subsequently, after washing with water and drying, the resist was removed using methyl ethyl ketone to obtain a circuit board on which the desired pattern was drawn.

The most detailed part of the pattern was 0.1 cylinder. The time required for etching after drawing was 15 minutes per sheet, including water washing and resist removal.

〔effect〕

As described above, the manufacturing method of the present invention eliminates the need for manufacturing conventional printing screens, shortens the manufacturing period of circuit boards, and is efficient and effective when applied to the circuit board manufacturing method. .

[Brief explanation of drawings]

FIG. 1 is a diagram showing a conventional printed circuit board manufacturing process, FIG. 2 is a diagram showing a conventional screen manufacturing method, and FIG. 3 is a diagram showing a circuit board manufacturing process of the present invention. FIG. 4 is a diagram for explaining the system configuration for manufacturing the circuit board of the present invention, and FIG. 5(a) is a diagram schematically showing the state of drawing of the present invention. And Figure 5 (
b) is a diagram showing the shape after finishing drawing. 1... Screen 8... XY plotter 2... Emulsion 9... Hen 3... Photomask 10... basis
Plate 3a... Transparent part 11 ・
...Pattern 3b...Light shielding part 12...Insulating substrate 4...Exposure 13.16...Conductor 5...・・De −
14...in 6...
Controller 15...Pen tip 7...
...monitor 1 fig. 2 fig. 5 fig. (0) 71' 3 fig. 4 fig. 5 fig. (b) 4.

Claims (1)

[Claims] (1) An etching resist is applied to the conductive material surface of a circuit board material made of an insulating material and a conductive material. 1. A method of manufacturing a circuit board, characterized in that the circuit board is manufactured by drawing and etching under control via a control device.