JPS6348890A - Apparatus for manufacturing printed wiring board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for manufacturing printed wiring boards used in various electronic devices and the like.

2. Description of the Related Art Conventionally, this type of printed wiring board manufacturing equipment has been a screen printing equipment line as shown in FIG. 2, and a photographic equipment line using a dry film as shown in FIG. 3. In FIG. 2, 8 is a feeder that sequentially supplies laminates with circuits formed with metal foil, 9 is a leveling machine for polishing and smoothing the metal circuit surface of the laminates fed by the feeder 8, and 1o 11 is a screen printing machine that prints the entire desired solder resist pattern on the surface of the laminated board on which circuits are formed using metal foils that have been sequentially supplied; 11 is an ultraviolet curing machine for curing the printing in = P printed by the screen printing machine 10; This is a manufacturing device consisting of two units; furthermore, in FIG. 3, 12 is a feeder that sequentially supplies laminated plates having circuits formed with metal foil; 13 is a feeder 12;
14 is a laminator for applying a dry film to the laminate on which circuits are formed using metal foil, and 15 is a laminator for applying a dry film to this board. A manufacturing device 16 consisted of a vacuum exposure machine for forming a pattern and a developing machine for forming a pattern on the exposed dry film.

Problems to be solved by the invention In conventional printed wiring board manufacturing equipment such as these,
It has become impossible to cope with the solder resist formation of recent high-density printed wiring boards.

It is about making consumer electronic devices smaller, lighter, and more highly functional.
With the personalization of office automation equipment, there is a demand for low-cost, high-density, high-precision printed wiring boards, and these demands are becoming more sophisticated year by year. However, as printed wiring boards become more dense and precise, and as the need for mass production and continuous line production increases, problems that cannot be solved by conventional methods have surfaced.

In conventional screen printing printed wiring board manufacturing equipment, the metal surface of a laminate with circuits formed using metal foil is polished and leveled using a leveling machine 9, and then 100 to 300 meshes are coated with ultraviolet curing solder resist ink. This is a method of screen printing using a screen plate, and then curing with ultraviolet rays in an ultraviolet irradiation device unit 11 to form a solder resist film, but in this method, since it is a screen printing method, the mesh of the plate stretches, 500X500ffl
It was very difficult to achieve dimensional accuracy within ±60 μm for the 11 patterns, and it was impossible to mass-produce high-precision, high-density printed wiring boards. Additionally, there were dimensional problems such as the screen mesh stretching while the plate was in use, resulting in dimensional problems. Furthermore, as printed wiring boards become denser, the spacing between circuits becomes narrower, causing ink smearing and
There were also printing problems such as blurring and edge cutting.

On the other hand, with conventional printed wiring board manufacturing equipment using the photographic method that uses dry film, although the dimensional accuracy 9 image accuracy is good, the cost of the dry film is high, the productivity is poor due to the batch method, or the dry Due to the thickness of the metal foil circuit, there was a step between the film and the resin surface of the base material, leaving a gap where it did not fully adhere, and during soldering, there were sometimes gaps such as the solder resist floating.

On the other hand, it is possible to use offset printing, which is capable of printing with high precision and high density.
μm), edge breakage, and the physical properties of the ink film (heat resistance, solvent resistance, etc.), making it impossible to adopt it.

The present invention solves these problems by fully applying the offset printing method, and has excellent dimensional accuracy and good pattern resolution.In other words, it is capable of mass production and continuous production without bleeding, blurring, or edge cutting. The purpose of the present invention is to provide a printed wiring board manufacturing device suitable for production lines.

Between two points? Means for Solving In order to solve these problems, the present invention provides a solder resist forming process in the printed wiring board manufacturing process.
Coat with an ultraviolet curable paint for forming solder resist, pre-cure until dry to the touch, and then block out ultraviolet rays to form an image equivalent to an artwork film in photography using dry film to form the desired pattern. Print with opaque printing ink using a high-precision offset printing machine, completely cure the solder resist coating other than this printed area with ultraviolet rays, and then dry to the touch the pattern printed with the offset printing machine and the area underneath. The present invention is a printed wiring board manufacturing apparatus which melts or peels off a pre-cured solder resist coating to form a photographically desired solder resist coating.

Effect: This configuration allows the paint to flow between the metal circuits and completely cover the circuits even if the circuit spacing is narrow.Moreover, the desired pattern can be printed using offset printing, which is capable of printing at high speed and with the highest precision among printing methods. Because it is formed, it has excellent dimensional accuracy and image accuracy, making it a very good mass production facility from the standpoint of productivity.

Embodiment FIG. 1 is a layout diagram of a printed wiring board solder resist forming equipment line according to an embodiment of the present invention. 1st
In the figure, 1 is a feeder that sequentially supplies laminates with circuits formed with metal foil, 2 is a leveling machine for polishing and smoothing the metal circuit surface of the laminates fed by the feeder 1, and 3 is a leveling machine A coater inks a full coat of ultraviolet curable solder resist paint on the surface of a laminate board with a circuit formed using metal foils supplied successively, and 4 pre-cures the ultraviolet curable solder resist paint until it is dry to the touch. The ultraviolet irradiation device unit 5 is an offset printing machine (for example, offset printing using a lithographic plate,
The same effect was obtained with dry offset printing using a resin letterpress), and 6 is an ultraviolet irradiation device consisting of a high-pressure mercury lamp, etc., for completely curing the solder resist coating other than the areas printed by the offset printing machine 5. Uni 7)
, 7 consists of a ninth developing device that dissolves or peels off the printed area printed by the offset printing machine S and the pre-cured solder resist coating underneath to form the entire desired solder resist coating. .

Effects of the Invention As described above, according to the present invention, since the offset printing method is adopted, it is possible to achieve dimensional accuracy within ±50 μm for a pattern of 600 x 500 ffff, and moreover, it can print at higher speeds than the conventional photographic method that uses dry film all around. Because it is possible, it also has high productivity. Moreover, because it uses the same development method as photography, the ink bleeds and fades like screen printing.

Printing problems such as edge breakage were also resolved. In addition, the solder resist paint has a low viscosity and a film thickness of 10 μm.
Because of the above coating, even when printed wiring boards become denser and the circuit spacing becomes narrower, it can adhere completely to the resin surface of the base material, and its properties (soldering heat resistance, The effect is that it can satisfy the requirements (solvent resistance, etc.).

[Brief explanation of drawings]

FIG. 1 is a layout diagram showing a printed wiring board manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a layout diagram of a printed wiring board manufacturing apparatus using a conventional screen printing method,
FIG. 3 is also a layout diagram of an apparatus for manufacturing printed wiring boards by the conventional photographic method using dry film. 1...Feeder, 2...Surfacing 4L 3
...Coater, 4...Ultraviolet irradiation device unit, 5...Offset printing machine, 6...-
. . . Ultraviolet irradiation device unit, 7 . . . Development device. Name of agent: Patent attorney Toshio Nakao and one other person
Mysterious Figure 1/-11 Figu-? -Vertical solidification machine 3- Cor 7- 4-11 Sori Tomon! ,,9J device, unit γ-f 1p device unit

Claims (1)

[Claims] A feeder that sequentially supplies laminates with circuits formed with metal foil, a leveling machine that polishes and smoothes the metal circuit surface of the laminates fed by this feeder, and a circuit with the metal foils that are sequentially supplied. A coater that coats the surface of the formed laminate with an ultraviolet curing solder resist paint, an ultraviolet irradiation device unit that pre-cures this paint until it is dry to the touch, and a UV irradiation unit that applies ultraviolet rays to a predetermined pattern on this paint film. An offset printing machine that prints with a blocking opaque printing ink, an ultraviolet irradiation device unit that completely cures the solder resist coating other than the printed area, the printing area, and the pre-cured solder resist coating underneath. A printed wiring board manufacturing apparatus comprising a developing device for dissolving or peeling off a film to form a desired solder resist film.