JPS58164291A - Method of producing circuit board - Google Patents
Method of producing circuit boardInfo
- Publication number
- JPS58164291A JPS58164291A JP4571282A JP4571282A JPS58164291A JP S58164291 A JPS58164291 A JP S58164291A JP 4571282 A JP4571282 A JP 4571282A JP 4571282 A JP4571282 A JP 4571282A JP S58164291 A JPS58164291 A JP S58164291A
- Authority
- JP
- Japan
- Prior art keywords
- screen
- paste
- pattern
- circuit board
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野１
本発明は、−回の印刷で基板上に厚さの異なるペースト
のパターンを形成できる回路基板の製造か沫に関する・
又−
［発明の技術的背景とその問題点］
従来から、例えばアルミナセラミック基板上に導電ペー
ストや抵抗ペーストを印刷して導電パターンを形成させ
る場合には、遮蔽体により所望のパターンの形成された
スクリーンを基板上にあてがい、このスクリーン上にス
トックさせたペーストをスキージでしごいて前記基板上
に遮蔽体により形成されたパターンをスクリーン印刷す
る方法が行われている。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention 1] The present invention relates to a method for manufacturing a circuit board that can form paste patterns of different thicknesses on a board in one printing cycle.
[Technical background of the invention and its problems] Conventionally, when forming a conductive pattern by printing a conductive paste or a resistive paste on an alumina ceramic substrate, for example, it has been difficult to form a desired pattern using a shield. A method is used in which a screen is placed on a substrate and a paste stocked on the screen is squeezed with a squeegee to screen print a pattern formed by a shield on the substrate.
しかしτ、［記遮蔽体には、例えばスクリーン−Ｆにポ
リビニルアルコール等のパターン形成用樹脂を塗布し、
）鱈トエッチング法等により所望の印刷パ１ターンをエ
ツチングして印刷ペーストの透過部が形成されている。However, τ, [the shielding body is made by applying a pattern forming resin such as polyvinyl alcohol to the screen-F, for example,
) A desired printing pattern is etched using a cod etching method or the like to form a transparent portion of the printing paste.
このような従来の印刷用スクリーンでは、パターン形成
用樹脂の厚さが一定であり、従って抵抗噛や電流値を塗
布するペーストの厚さにより調整したい場合にはスクリ
ーン印刷を所定厚さまで数回行なう必要があって作業が
煩雑になるという難点があった。In such conventional printing screens, the thickness of the pattern-forming resin is constant, so if you want to adjust the resistance or current value by adjusting the thickness of the paste to be applied, screen printing must be performed several times to reach the specified thickness. The problem was that it was necessary and the work was complicated.
［発明の目的］
本発明は、このような点に対処し玉なされたもので、−
回のスクリーン印刷で基板上に厚さ、の異なるペースト
のパターンを形成できる方法を提供することを目的とす
る。[Object of the Invention] The present invention has been made to address these points, and has the following features:
The purpose of the present invention is to provide a method capable of forming paste patterns of different thicknesses on a substrate by multiple screen printing steps.
〔発明の概要］
すなわち本発明は、スクリーン上に形成する遮蔽体の厚
さを所望されるペーストの塗布厚さに対応させて部分的
に異ならせるようにしたことを特徴とする。[Summary of the Invention] That is, the present invention is characterized in that the thickness of the shield formed on the screen is partially varied depending on the desired thickness of paste application.
［発明の実施例］
以下図面を参照にして本発明方法の一実施例を説明する
。[Embodiment of the Invention] An embodiment of the method of the present invention will be described below with reference to the drawings.
まず第１図に示すように８０〜４００メツシユのステン
レス網からなるスクリーン１上に感光性樹脂からなるパ
ターン形成用樹脂２を塗布する。First, as shown in FIG. 1, a pattern forming resin 2 made of a photosensitive resin is applied onto a screen 1 made of a stainless steel mesh of 80 to 400 meshes.
このとき所望されるペーストの塗布厚さに対応させて、
このパターン形成用樹脂２のｔＪ！布厚さを異ならせる
ようにする。塗布厚さは通常的５〜２０μ−の範囲で調
整される。しかる後、所望のノ＼ターンの形成されたマ
スク３を介して露光処理を施し、上記樹脂をパターン対
応させて選択的に−（ヒさせて現像処理を施し、次いで
第２図に示すよって所定のパターン２１を形成させる。At this time, depending on the desired paste application thickness,
tJ of this pattern forming resin 2! Make the fabric thickness different. The coating thickness is usually adjusted within the range of 5 to 20 microns. Thereafter, an exposure process is performed through a mask 3 in which a desired number of turns has been formed, and the resin is selectively exposed to a pattern and developed. A pattern 21 is formed.
このように形成させたスクリーンを、第３図に示すよう
にパターン形成用樹脂２の塗布面を基板４にあてがい、
そのスクリーンの上にストックさせたモリブデンペース
ト等の導電性ペースト５をスキージ−６で矢印方向にし
ごくと、パターン形成用樹脂２で遮蔽させていないステ
ンレス網の目の藺をペーストが通ることによって第４図
に示すように基板４土に岸さのことなるペーストのパタ
ーン５′が形成される。As shown in FIG. 3, the screen thus formed is applied with the surface coated with the pattern forming resin 2 on the substrate 4.
When the conductive paste 5 such as molybdenum paste stocked on the screen is squeezed in the direction of the arrow with a squeegee 6, the paste passes through the mesh of the stainless steel mesh that is not shielded by the pattern forming resin 2. As shown in FIG. 4, paste patterns 5' of different sizes are formed on the substrate 4.
［発明・の効１］
このように本発明方法によれば、−回の印刷で基板上に
厚さの真なるペーストのパターンを形成することができ
、印刷スペースが制約される場合等に有効である。[Invention/Effect 1] As described above, according to the method of the present invention, it is possible to form a paste pattern with a true thickness on a substrate in - times of printing, which is effective when printing space is limited. It is.
第１図乃至第４図は本発明方法を説明するための実施ｍ
様例を示す断面図である。
１・・・・・・・・・・・・スクリーン２・・・・・・
・・・・・・パターン形成用樹脂４・・・・・・・・・
・・・基板
５・・・・・・・・・・・・ペースト
６・・・・・・・・・・・・スキージ−（７３１７）
代理人弁理士 則近憲佑（ほか１名）
第１図
第４図FIG. 1 to FIG. 4 are examples for explaining the method of the present invention.
It is a sectional view showing an example. 1...Screen 2...
・・・・・・Resin for pattern formation 4・・・・・・・・・
...Substrate 5...Paste 6...Squeegee (7317)
Representative Patent Attorney Kensuke Norichika (and 1 other person) Figure 1 Figure 4
Claims (2)
クリーンを用いて回路パターンをスクリーン印刷する際
、前記遮蔽体を部分的に厚さを異ならせてスクリーン上
に形成させて基板上に厚さの異なるパターンを形成させ
ることを特徴とする回路基板の製造方法。(1) When screen printing a circuit pattern using a screen on which a desired circuit pattern is formed by a shielding body, the shielding body is formed on the screen with partially different thicknesses, and the thickness is printed on the substrate. 1. A method of manufacturing a circuit board, the method comprising forming different patterns.
回路基板の製造方法。(2) The method for manufacturing a circuit board according to claim 1, wherein the shield is made of resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4571282A JPS58164291A (en) | 1982-03-24 | 1982-03-24 | Method of producing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4571282A JPS58164291A (en) | 1982-03-24 | 1982-03-24 | Method of producing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58164291A true JPS58164291A (en) | 1983-09-29 |
Family
ID=12726957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4571282A Pending JPS58164291A (en) | 1982-03-24 | 1982-03-24 | Method of producing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58164291A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019049640A (en) * | 2017-09-11 | 2019-03-28 | アルパイン株式会社 | Method for manufacturing cover plate for display device and method for manufacturing display device using the cover plate |
-
1982
- 1982-03-24 JP JP4571282A patent/JPS58164291A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019049640A (en) * | 2017-09-11 | 2019-03-28 | アルパイン株式会社 | Method for manufacturing cover plate for display device and method for manufacturing display device using the cover plate |
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