JPH06938A - Metal mask production thereof - Google Patents

Metal mask production thereof

Info

Publication number
JPH06938A
JPH06938A JP4184698A JP18469892A JPH06938A JP H06938 A JPH06938 A JP H06938A JP 4184698 A JP4184698 A JP 4184698A JP 18469892 A JP18469892 A JP 18469892A JP H06938 A JPH06938 A JP H06938A
Authority
JP
Japan
Prior art keywords
mask
mesh
metal mask
pattern
pattern portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4184698A
Other languages
Japanese (ja)
Inventor
Kazuo Fujita
和男 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ODENSHA KK
OUDENSHIYA KK
Shinwa Co Ltd
Original Assignee
ODENSHA KK
OUDENSHIYA KK
Shinwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ODENSHA KK, OUDENSHIYA KK, Shinwa Co Ltd filed Critical ODENSHA KK
Priority to JP4184698A priority Critical patent/JPH06938A/en
Publication of JPH06938A publication Critical patent/JPH06938A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a metal mask enhanced in dimensional accuracy and excellent in fine line reproducibility at the time of printing by forming meshes by an electroforming method so as to integrate the same with a mask part also formed by an electroforming method. CONSTITUTION:A metal mask 1 is constituted of a mask part 2 and pattern parts 3 and the pattern parts 3 are constituted in a mesh like state integrally formed from a metal along with the mask part 2 and the specifications of meshes are made different corresponding to the width of the pattern parts 3. That is, by providing small meshes 4b to the wide pattern part 3 and large meshes 4a to the narrow pattern part, the passing amount of ink at the time of printing is made constant and meshes are not provided when the width of the pattern part 3 is fine.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は各種電子部品の製造に
おいてエッチングレジストインキ、ソルダーレジスト、
導電性ペースト類等(以下、単に「インキ」と称する)
を印刷する際に用いるメタルマスク及びその製造方法に
関する。
BACKGROUND OF THE INVENTION The present invention relates to an etching resist ink, a solder resist,
Conductive pastes, etc. (hereinafter simply referred to as "ink")
TECHNICAL FIELD The present invention relates to a metal mask used when printing a sheet and a manufacturing method thereof.

【0002】[0002]

【従来の技術】従来、マスクとしては合成樹脂や金属製
の紗に感光乳剤を塗布した後、インキが通過すべきパタ
ーン部とインキの通過を阻止するマスク部を形成したス
クリーン版が使用されていた。
2. Description of the Related Art Conventionally, as a mask, a screen plate has been used in which a photosensitive emulsion is applied to a synthetic resin or metal gauze, and then a pattern portion through which ink should pass and a mask portion for blocking the passage of ink are formed. It was

【0003】しかしながら、上記従来技術においてはマ
スク部を支持している基体が弾性復帰能力に難がある紗
であることより寸法精度、耐久性に問題があった。
However, in the above-mentioned prior art, since the base body supporting the mask portion is a gauze having a difficulty in elastic restoring ability, there are problems in dimensional accuracy and durability.

【0004】そこで、上記問題点を解消するためにマス
ク部を金属板により構成し、金属製の紗にこのマスク部
を積層したメタルマスクが近年では使用されつつあっ
た。
Therefore, in order to solve the above problems, a metal mask in which the mask portion is made of a metal plate and the mask portion is laminated on a metal gauze has been used recently.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記従
来技術においても金属製のマスク部を使用しているとは
いえ本体は依然として紗であることには変わりないので
寸法精度は依然劣り、又紗にマスク部を積層するという
構造上表裏の平滑性に難があり、使用時にパターンのエ
ッジ部分が正確に印刷されない問題点があった。
However, even in the above-mentioned prior art, although the mask portion made of metal is used, the main body is still a gauze, so the dimensional accuracy is still inferior. Due to the structure in which the mask portions are laminated, the smoothness of the front and back surfaces is difficult, and there is a problem that the edge portion of the pattern is not printed accurately during use.

【0006】更に、紗にマスク部を積層するという構造
上当然のことながらパターン部には一律に紗が位置する
こととなり、印刷時に次の現象が生じた。即ち、パター
ン部の広狭にかかわらずそこに位置する紗は同一なの
で、例えば幅広のパターン部を想定して紗のメッシュを
小さく設定すると、幅狭のパターン部においてはインキ
の通過量が少なすぎ被印刷物のその部分の印刷厚が薄く
なり、逆に幅狭のパターン部を想定して紗のメッシュを
大きく設定すると、幅広のパターン部においてはインキ
の通過量が多すぎ被印刷物のその部分の印刷厚が厚くな
りすぎる問題が生じた。
Further, the gauze is naturally positioned uniformly in the pattern part due to the structure in which the mask part is laminated on the gauze, and the following phenomenon occurs during printing. That is, regardless of whether the pattern portion is wide or narrow, the gauze positioned there is the same. Therefore, for example, if the mesh of the gauze is set to be small assuming a wide pattern portion, the ink passing amount is too small in the narrow pattern portion. If the mesh thickness of the printed material becomes smaller on the assumption of a narrow pattern part on the contrary, and the mesh size of the gauze is set to a large value, the amount of ink passing through the wide pattern part is too large to print on that part of the substrate. There was a problem that the thickness became too thick.

【0007】この発明は以上の如き従来技術の問題点を
解消した全く新たなメタルマスク及びその製造方法を提
供することを目的として創作されたものである。
The present invention was created for the purpose of providing a completely new metal mask and a method for manufacturing the same, which solves the above-mentioned problems of the prior art.

【0008】[0008]

【課題を解決するための手段】即ち、この発明のメタル
マスクはメッシュ状に構成したパターン部とマスク部と
を電鋳法により形成されるべき一体の金属により構成し
たことを特徴とする。
That is, the metal mask of the present invention is characterized in that the pattern portion and the mask portion, which are formed in a mesh shape, are made of an integral metal to be formed by electroforming.

【0009】又、この発明のメタルマスクの製造方法
は、電鋳基板上にパターン部のメッシュの透かし孔に対
応するレジスト皮膜を形成する第1工程と、第1工程の
レジスト皮膜に覆われていない箇所にパターン部を構成
すべきメッシュ状の一次電着層を形成する第2工程と、
第2工程により得られたメッシュ状の電着層上にそれを
覆うレジスト皮膜を形成する第3工程と、第3工程のレ
ジスト皮膜に覆われていない箇所にマスク部を構成すべ
き二次電着層を形成する第4工程と、一体に結合した一
次電着層と二次電着層を電鋳基板より剥離する第5工程
からなることを特徴とする。
Further, in the method for producing a metal mask of the present invention, the first step of forming a resist film corresponding to the watermark holes of the mesh of the pattern portion on the electroformed substrate, and the resist film of the first step are covered. A second step of forming a mesh-shaped primary electrodeposition layer to form a pattern portion in a non-existing portion,
A third step of forming a resist film covering the mesh-shaped electrodeposition layer obtained in the second step, and a secondary electrode for forming a mask portion at a portion not covered by the resist film of the third step. It is characterized by comprising a fourth step of forming an electrodeposition layer and a fifth step of peeling the integrally bonded primary electrodeposition layer and secondary electrodeposition layer from the electroformed substrate.

【0010】[0010]

【作用】よって、この発明のメタルマスクによればマス
ク部によりインキの通過を阻止し、パターン部により被
印刷物にインキを転写するという公知のメタルマスクの
作用を生じる他、メッシュ状に構成したパターン部とマ
スク部とを電鋳法により形成されるべき一体の金属によ
り構成したことより、表裏が平滑なメタルマスクを得ら
れる作用を生じると共に、パターン部の幅に応じてメッ
シュの仕様を異ならせることを可能とする作用を生じ
る。
Therefore, according to the metal mask of the present invention, the mask portion prevents the ink from passing therethrough, and the pattern portion causes the ink to be transferred to the printing object, thereby producing the function of a known metal mask, and the mesh-shaped pattern. Since the mask portion and the mask portion are made of an integral metal which should be formed by electroforming, the metal mask having smooth front and back surfaces is obtained, and the specifications of the mesh are changed according to the width of the pattern portion. It produces an action that makes it possible.

【0011】又、この発明のメタルマスクの製造方法に
よれば先ずパターン部を構成すべきメッシュ状の一次電
着層を形成し、次いでマスク部を構成すべき二次電着層
を形成することにより、両者が一体に結合されて一つの
メタルマスクが形成される作用を生じると共に、マスク
部とパターン部の境目が非常に正確に形成される作用を
生じる。
Further, according to the method for manufacturing a metal mask of the present invention, first, a mesh-shaped primary electrodeposition layer to form a pattern portion is formed, and then a secondary electrodeposition layer to form a mask portion is formed. As a result, the two are integrally combined to form one metal mask, and the boundary between the mask portion and the pattern portion is formed very accurately.

【0012】[0012]

【実施例】以下、この発明の具体的実施例を添付図面に
基づいて説明する。図1はこの発明のメタルマスクの一
例を示す図である。このメタルマスク1はマスク部2と
パターン部3より構成される。そして、パターン部3は
電鋳法によりマスク部2と一体の金属により形成された
メッシュ状に構成されるが、ここではパターン部3の幅
に応じてメッシュの仕様を異ならせている。即ち、幅広
のパターン部には目の小さいメッシュ4bを、幅狭のパ
ターン部には目の大きいメッシュ4aを設けることによ
り印刷時におけるインキの通過量の一定化を図ってい
る。又、この実施例では図面に示すようにパターン部3
の幅が微細な場合にはメッシュを設けていない。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing an example of the metal mask of the present invention. The metal mask 1 is composed of a mask portion 2 and a pattern portion 3. The pattern portion 3 is formed by electroforming into a mesh formed of metal that is integral with the mask portion 2. Here, the specifications of the mesh are changed according to the width of the pattern portion 3. That is, by providing a mesh 4b with small eyes in the wide pattern portion and a mesh 4a with large eyes in the narrow pattern portion, the amount of ink passing during printing is made constant. Further, in this embodiment, as shown in the drawing, the pattern portion 3
No mesh is provided when the width is small.

【0013】図2乃至図9はこの発明のメタルマスクの
製造方法の工程を示す図である。 (第1工程)先ず、電鋳基板10上にメタルマスクのパ
ターン部のメッシュの透かし孔に対応するレジスト皮膜
を形成する。このレジスト皮膜は印刷法、写真法、転写
法などにより形成されるが、この実施例では電鋳基板1
0上にドライフィルム11fを積層すると共に、これに
メッシュの透かし孔に対応するメッシュパターン12a
を有するマスクフィルム12を積層し(図2参照)、露
光、現像を経てメッシュの透かし孔に対応する透かし孔
部11aを有するレジスト皮膜11を形成している(図
3参照)。
2 to 9 are views showing steps of the method for manufacturing a metal mask of the present invention. (First Step) First, on the electroformed substrate 10, a resist film corresponding to the watermark holes of the mesh of the pattern portion of the metal mask is formed. This resist film is formed by a printing method, a photographic method, a transfer method or the like. In this embodiment, the electroformed substrate 1 is used.
A dry film 11f is laminated on the surface of the film 0 and mesh pattern 12a corresponding to the open holes of the mesh is formed.
2 is laminated (see FIG. 2), and after exposure and development, a resist film 11 having a watermark hole portion 11a corresponding to the watermark hole of the mesh is formed (see FIG. 3).

【0014】(第2工程)そして、第1工程を経た電鋳
基板10を電着槽(この実施例ではニッケル又はニッケ
ル合金を電着する。)に移し、メタルマスクのパターン
部を構成するメッシュとなるべき一次電着層4eを得、
更にレジスト皮膜11を除去する(図4参照)。
(Second Step) Then, the electroformed substrate 10 after the first step is transferred to an electrodeposition tank (nickel or nickel alloy is electrodeposited in this embodiment), and a mesh forming a pattern portion of the metal mask is transferred. To obtain the primary electrodeposition layer 4e,
Further, the resist film 11 is removed (see FIG. 4).

【0015】(第3工程)次に、電鋳基板10及びそこ
に形成された一次電着層4e上にドライフィルム13f
を積層すると共に、これにパターン部に対応する透過パ
ターン14aを有するマスクフィルム14を積層し(図
5参照)、露光、現像を経て一次電着層4e上にレジス
ト皮膜13を形成する(図6参照)。
(Third Step) Next, a dry film 13f is formed on the electroformed substrate 10 and the primary electrodeposition layer 4e formed thereon.
And a mask film 14 having a transmissive pattern 14a corresponding to the pattern portion (see FIG. 5) and exposed and developed to form a resist film 13 on the primary electrodeposition layer 4e (FIG. 6). reference).

【0016】(第4工程)そして、第2工程を経た電鋳
基板10を電着槽に移し、メタルマスクのマスク部を構
成する二次電着層2eを得(図7参照)、更にレジスト
皮膜13を除去する(図8参照)。この段階で一次電着
層4eと二次電着層2eは一体に結合されている。
(Fourth step) Then, the electroformed substrate 10 which has undergone the second step is transferred to an electrodeposition tank to obtain a secondary electrodeposition layer 2e which constitutes a mask portion of the metal mask (see FIG. 7) and further resists The film 13 is removed (see FIG. 8). At this stage, the primary electrodeposition layer 4e and the secondary electrodeposition layer 2e are integrally bonded.

【0017】(第5工程)最後に、一体に結合された一
次電着層4eと二次電着層2eを電鋳基板10より剥離
することにより、メッシュ4a(一次電着層4eが対
応)を有するパターン部3とマスク部2(二次電着層2
eが対応)からなるメタルマスク2を得る(図9参
照)。
(Fifth Step) Finally, the primary electrodeposited layer 4e and the secondary electrodeposited layer 2e which are integrally combined are peeled off from the electroformed substrate 10 to form a mesh 4a (corresponding to the primary electrodeposited layer 4e). Pattern portion 3 having masks and mask portion 2 (secondary electrodeposition layer 2
A metal mask 2 made of (e corresponds) is obtained (see FIG. 9).

【0018】[0018]

【発明の効果】以上の構成よりなるこの発明は、紗を基
体としてこれにマスク部を構成するという従来技術のス
クリーン版やメタルマスクとは根本的に構造が異なるも
のであり、次の特有の効果を奏する。
According to the present invention having the above-described structure, the structure is fundamentally different from the screen plate and the metal mask of the prior art in which the gauze is used as the substrate and the mask portion is formed on the gauze. Produce an effect.

【0019】弾性復帰能力に難がある紗を使用せずに
電鋳法によりメッシュを形成し、しかもこのメッシュは
やはり電鋳法により形成されるマスク部と一体に形成さ
れるので寸法精度が高く印刷時の細線再現性が優れたメ
タルマスクを得ることができる。
A mesh is formed by an electroforming method without using a gauze, which has a difficulty in elastic recovery, and since this mesh is formed integrally with a mask portion which is also formed by an electroforming method, the dimensional accuracy is high. It is possible to obtain a metal mask having excellent fine line reproducibility during printing.

【0020】電鋳法によりメッシュを形成し、しかも
このメッシュはやはり電鋳法により形成されるマスク部
と一体に形成されるので、表裏の平滑性が優れ、しかも
マスク部とパターン部の境目が非常に正確に形成される
ので、スクリーン版に比べては勿論のこと、従来技術の
金属性の紗とマスク部からなるメタルマスクに比べても
エッジ部分におけるインキの滲みがない正確な印刷を実
現することができる。
Since the mesh is formed by the electroforming method and this mesh is formed integrally with the mask portion which is also formed by the electroforming method, the front and back surfaces are excellent in smoothness and the boundary between the mask portion and the pattern portion is excellent. Since it is formed very accurately, not only the screen plate, but also accurate printing without ink bleeding at the edge part compared to the conventional metal mask made of metallic gauze and mask part is realized. can do.

【0021】従来技術のようにメッシュ(従来技術の
紗に対応)に基体としての作用を持たせないので、それ
がメタルマスク全体に渡って一体不可分のものである必
要がなく、パターン部の寸法や形状に応じてメッシュの
仕様を変えることにより従来技術では実現不可能であっ
た印刷時におけるインキの通過量の一定化を容易に実現
することができる。
Since the mesh (corresponding to the gauze of the prior art) does not have a function as a base as in the prior art, it does not need to be an integral element over the entire metal mask, and the size of the pattern portion is not required. By changing the specifications of the mesh according to the shape and shape, it is possible to easily realize the constant amount of ink passing during printing, which cannot be realized by the conventional technology.

【0022】メッシュとマスク部が金属により一体に
形成されるので溶剤等に侵されるおそれがない。
Since the mesh and the mask portion are integrally formed of metal, there is no risk of being invaded by a solvent or the like.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明のメタルマスクの一例を示す要部の一
部切り欠き斜視図。
FIG. 1 is a partially cutaway perspective view of an essential part showing an example of a metal mask of the present invention.

【図2】この発明のメタルマスクの製造方法の第1工程
を示す断面図。
FIG. 2 is a sectional view showing a first step of the method for manufacturing a metal mask of the present invention.

【図3】同上、第1工程を示す断面図。FIG. 3 is a sectional view showing the first step of the above.

【図4】同上、第2工程を示す断面図。FIG. 4 is a sectional view showing a second step of the same.

【図5】同上、第3工程を示す断面図。FIG. 5 is a sectional view showing a third step of the same.

【図6】同上、第3工程を示す断面図。FIG. 6 is a sectional view showing a third step of the same.

【図7】同上、第4工程を示す断面図。FIG. 7 is a sectional view showing a fourth step of the same as above.

【図8】同上、第4工程を示す断面図。FIG. 8 is a sectional view showing a fourth step of the same as above.

【図9】同上、第5工程を示す断面図。FIG. 9 is a sectional view showing a fifth step of the same.

【符号の説明】[Explanation of symbols]

1 メタルマスク 2 マスク部 2e 二次電着層 3 パターン部 4a メッシュ 4b メッシュ 4e 一次電着層 10 電鋳基板 11 レジスト皮膜 11a 透かし孔部 13 レジスト皮膜 DESCRIPTION OF SYMBOLS 1 metal mask 2 mask part 2e secondary electrodeposition layer 3 pattern part 4a mesh 4b mesh 4e primary electrodeposition layer 10 electroformed substrate 11 resist film 11a watermark hole part 13 resist film

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 インキが通過すべきパターン部とインキ
の通過を阻止するマスク部からなるメタルマスクにおい
て、メッシュ状に構成したパターン部とマスク部とを電
鋳法により形成されるべき一体の金属により構成したこ
とを特徴とするメタルマスク。
1. A metal mask comprising a pattern portion through which ink should pass and a mask portion which prevents the ink from passing, wherein the mesh-shaped pattern portion and the mask portion are an integral metal to be formed by electroforming. A metal mask characterized by being composed of.
【請求項2】 一つのメタルマスク中において、パター
ン部の幅に応じて仕様を異ならせた複数種のメッシュが
混在する請求項1記載のメタルマスク。
2. The metal mask according to claim 1, wherein a plurality of kinds of meshes having different specifications according to the width of the pattern portion are mixed in one metal mask.
【請求項3】 一つのメタルマスク中において、メッシ
ュを有するパターン部とメッシュを有しないパターン部
が混在する請求項1又は2記載のメタルマスク。
3. The metal mask according to claim 1, wherein a pattern portion having a mesh and a pattern portion having no mesh are mixed in one metal mask.
【請求項4】 電鋳基板上にパターン部のメッシュの透
かし孔に対応するレジスト皮膜を形成する第1工程と、
第1工程のレジスト皮膜に覆われていない箇所にパター
ン部を構成すべきメッシュ状の一次電着層を形成する第
2工程と、第2工程により得られたメッシュ状の電着層
上にそれを覆うレジスト皮膜を形成する第3工程と、第
3工程のレジスト皮膜に覆われていない箇所にマスク部
を構成すべき二次電着層を形成する第4工程と、一体に
結合した一次電着層と二次電着層を電鋳基板より剥離す
る第5工程からなることを特徴とするメタルマスクの製
造方法。
4. A first step of forming a resist film on the electroformed substrate corresponding to the watermark holes of the mesh of the pattern portion,
A second step of forming a mesh-shaped primary electrodeposition layer for forming a pattern portion in a portion not covered with the resist film in the first step, and the second step of forming the mesh-shaped electrodeposition layer obtained by the second step And a fourth step of forming a secondary electrodeposition layer for forming a mask portion in a portion not covered with the resist film in the third step, and a primary electrode integrally combined. A method for producing a metal mask, comprising a fifth step of peeling the deposition layer and the secondary electrodeposition layer from the electroformed substrate.
JP4184698A 1992-06-19 1992-06-19 Metal mask production thereof Pending JPH06938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4184698A JPH06938A (en) 1992-06-19 1992-06-19 Metal mask production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4184698A JPH06938A (en) 1992-06-19 1992-06-19 Metal mask production thereof

Publications (1)

Publication Number Publication Date
JPH06938A true JPH06938A (en) 1994-01-11

Family

ID=16157820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4184698A Pending JPH06938A (en) 1992-06-19 1992-06-19 Metal mask production thereof

Country Status (1)

Country Link
JP (1) JPH06938A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729115A (en) * 1996-06-11 1998-03-17 Ericsson Inc. Apparatus and method for identifying and charging batteries of different types
WO1998027797A1 (en) * 1996-12-18 1998-06-25 Micro Metallic Limited Improved stencil and method of producing such
WO2002027073A1 (en) * 2000-09-26 2002-04-04 Eastman Kodak Company Method for producing metal mask and metal mask
US6962111B2 (en) 2000-06-15 2005-11-08 Murata Manufacturing Co., Ltd. Screen-printing plate, manufacturing method of laminated-ceramic electronic devices, and laminated-ceramic electronic device manufactured by the method
JP2007118537A (en) * 2005-10-31 2007-05-17 Murata Mfg Co Ltd Screen printing plate and screen printing apparatus
CN100416752C (en) * 2003-05-28 2008-09-03 精工爱普生株式会社 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729115A (en) * 1996-06-11 1998-03-17 Ericsson Inc. Apparatus and method for identifying and charging batteries of different types
WO1998027797A1 (en) * 1996-12-18 1998-06-25 Micro Metallic Limited Improved stencil and method of producing such
GB2320462B (en) * 1996-12-18 1999-03-03 Micro Metallic Ltd Improved stencil and method of producing such
US6962111B2 (en) 2000-06-15 2005-11-08 Murata Manufacturing Co., Ltd. Screen-printing plate, manufacturing method of laminated-ceramic electronic devices, and laminated-ceramic electronic device manufactured by the method
WO2002027073A1 (en) * 2000-09-26 2002-04-04 Eastman Kodak Company Method for producing metal mask and metal mask
KR100803455B1 (en) * 2000-09-26 2008-02-14 이스트맨 코닥 캄파니 Method for producing metal mask and metal mask
CN100416752C (en) * 2003-05-28 2008-09-03 精工爱普生株式会社 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
JP2007118537A (en) * 2005-10-31 2007-05-17 Murata Mfg Co Ltd Screen printing plate and screen printing apparatus

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