HK57089A - Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers - Google Patents

Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers

Info

Publication number
HK57089A
HK57089A HK570/89A HK57089A HK57089A HK 57089 A HK57089 A HK 57089A HK 570/89 A HK570/89 A HK 570/89A HK 57089 A HK57089 A HK 57089A HK 57089 A HK57089 A HK 57089A
Authority
HK
Hong Kong
Prior art keywords
electrodeposition
tin
copper
alloy layers
alkaline cyanide
Prior art date
Application number
HK570/89A
Other languages
English (en)
Inventor
Gerd Hoffacher
Willi Mueller
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa filed Critical Degussa
Publication of HK57089A publication Critical patent/HK57089A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK570/89A 1983-11-02 1989-07-13 Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers HK57089A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3339541A DE3339541C2 (de) 1983-11-02 1983-11-02 Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen

Publications (1)

Publication Number Publication Date
HK57089A true HK57089A (en) 1989-07-21

Family

ID=6213210

Family Applications (1)

Application Number Title Priority Date Filing Date
HK570/89A HK57089A (en) 1983-11-02 1989-07-13 Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers

Country Status (6)

Country Link
US (2) US4565608A (ja)
EP (1) EP0143919B1 (ja)
JP (1) JPH06104914B2 (ja)
BR (1) BR8405398A (ja)
DE (2) DE3339541C2 (ja)
HK (1) HK57089A (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4336664A1 (de) * 1993-10-27 1995-05-04 Demetron Gmbh Werkstücke aus nichtkorrosionsbeständigen Metallen mit nach dem PVD-Verfahren aufgebrachten Überzügen
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
DE4426914C1 (de) * 1994-07-29 1995-08-17 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Kupfer-Zinn-Legierungen
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
US6652731B2 (en) 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
KR100906008B1 (ko) * 2004-09-24 2009-07-06 자덴 징크 프로덕츠, 인코포레이티드 은백색 외관을 갖는 전기도금된 금속 및 그 제조방법
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
CN105297091A (zh) * 2015-12-01 2016-02-03 张颖 一种用于手表壳体的电镀方法
CN105297093A (zh) * 2015-12-01 2016-02-03 张颖 一种用于手表壳体的电镀镀液
US20230203694A1 (en) * 2021-12-29 2023-06-29 Basf Se Alkaline composition for copper electroplating comprising a grain refiner

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2435967A (en) * 1945-02-27 1948-02-17 Westinghouse Electric Corp Bright alloy plating
US2436316A (en) * 1946-04-25 1948-02-17 Westinghouse Electric Corp Bright alloy plating
NL75841C (ja) * 1949-06-11
US2854388A (en) * 1955-03-14 1958-09-30 City Auto Stamping Co Electrodeposition of copper-tin alloys
US3440151A (en) * 1965-06-02 1969-04-22 Robert Duva Electrodeposition of copper-tin alloys
AU473877B2 (en) * 1971-12-20 1976-07-08 M And T Chemicals Inc. Tin-lead alloy plating
JPS5760092A (en) * 1980-09-29 1982-04-10 Seiko Instr & Electronics Ltd Copper-tin alloy plating bath
JPS5760435A (en) * 1980-09-30 1982-04-12 Toshiba Corp Data transfer controlling system
JPS5848689A (ja) * 1981-09-18 1983-03-22 Seiko Instr & Electronics Ltd 白色銅−スズ合金めつき浴
JPS5891181A (ja) * 1981-11-24 1983-05-31 Seiko Instr & Electronics Ltd 銅−スズ合金めつき浴

Also Published As

Publication number Publication date
DE3339541A1 (de) 1985-05-15
JPS60114589A (ja) 1985-06-21
US4605474A (en) 1986-08-12
DE3465114D1 (en) 1987-09-03
JPH06104914B2 (ja) 1994-12-21
US4565608A (en) 1986-01-21
BR8405398A (pt) 1985-09-03
EP0143919A1 (de) 1985-06-12
EP0143919B1 (de) 1987-07-29
DE3339541C2 (de) 1986-08-07

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Legal Events

Date Code Title Description
NR Patent deemed never to have been added to the register under section 13(7) of patents (transitional arrangements) rules