HK191795A - In situ monitoring technique and apparatus for chemical/ mechanical planarization endpoint detection - Google Patents

In situ monitoring technique and apparatus for chemical/ mechanical planarization endpoint detection

Info

Publication number
HK191795A
HK191795A HK191795A HK191795A HK191795A HK 191795 A HK191795 A HK 191795A HK 191795 A HK191795 A HK 191795A HK 191795 A HK191795 A HK 191795A HK 191795 A HK191795 A HK 191795A
Authority
HK
Hong Kong
Prior art keywords
chemical
mechanical planarization
endpoint detection
situ monitoring
monitoring technique
Prior art date
Application number
HK191795A
Other languages
English (en)
Inventor
Miller Gabriel Lorimer
Richard Wagner Eric
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Publication of HK191795A publication Critical patent/HK191795A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
    • G01B7/085—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means for measuring thickness of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/34—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
    • G01B7/345—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces for measuring evenness
HK191795A 1990-05-01 1995-12-21 In situ monitoring technique and apparatus for chemical/ mechanical planarization endpoint detection HK191795A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/517,106 US5081421A (en) 1990-05-01 1990-05-01 In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
SG154694A SG154694G (en) 1990-05-01 1994-10-21 In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection

Publications (1)

Publication Number Publication Date
HK191795A true HK191795A (en) 1995-12-29

Family

ID=26664456

Family Applications (1)

Application Number Title Priority Date Filing Date
HK191795A HK191795A (en) 1990-05-01 1995-12-21 In situ monitoring technique and apparatus for chemical/ mechanical planarization endpoint detection

Country Status (11)

Country Link
US (1) US5081421A (xx)
EP (1) EP0455455B1 (xx)
JP (1) JPH0738404B2 (xx)
KR (1) KR100196590B1 (xx)
CN (2) CN1028670C (xx)
CA (1) CA2036102C (xx)
DE (1) DE69103809T2 (xx)
DK (1) DK0455455T3 (xx)
ES (1) ES2059054T3 (xx)
HK (1) HK191795A (xx)
SG (1) SG154694G (xx)

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EP0455455A3 (en) 1992-04-15
DK0455455T3 (da) 1994-10-10
CN1028670C (zh) 1995-05-31
DE69103809D1 (de) 1994-10-13
ES2059054T3 (es) 1994-11-01
EP0455455A2 (en) 1991-11-06
DE69103809T2 (de) 1995-02-09
CN1056162A (zh) 1991-11-13
KR100196590B1 (ko) 1999-06-15
KR910020834A (ko) 1991-12-20
JPH0738404B2 (ja) 1995-04-26
CN1119339A (zh) 1996-03-27
SG154694G (en) 1995-03-17
CA2036102C (en) 1995-04-04
US5081421A (en) 1992-01-14
EP0455455B1 (en) 1994-09-07
JPH04357851A (ja) 1992-12-10

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