HK1220807A1 - 發光裝置 - Google Patents

發光裝置

Info

Publication number
HK1220807A1
HK1220807A1 HK16108747.1A HK16108747A HK1220807A1 HK 1220807 A1 HK1220807 A1 HK 1220807A1 HK 16108747 A HK16108747 A HK 16108747A HK 1220807 A1 HK1220807 A1 HK 1220807A1
Authority
HK
Hong Kong
Prior art keywords
light emitting
emitting device
light
emitting
Prior art date
Application number
HK16108747.1A
Other languages
English (en)
Inventor
細川昌治宮本公博岩倉大典
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of HK1220807A1 publication Critical patent/HK1220807A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
HK16108747.1A 2014-10-31 2016-07-21 發光裝置 HK1220807A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223519 2014-10-31
JP2015166277A JP6477361B2 (ja) 2014-10-31 2015-08-25 発光装置

Publications (1)

Publication Number Publication Date
HK1220807A1 true HK1220807A1 (zh) 2017-05-12

Family

ID=56019024

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16108747.1A HK1220807A1 (zh) 2014-10-31 2016-07-21 發光裝置

Country Status (2)

Country Link
JP (1) JP6477361B2 (zh)
HK (1) HK1220807A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6866580B2 (ja) * 2016-06-29 2021-04-28 日亜化学工業株式会社 発光装置及び光源
JP6418208B2 (ja) 2016-08-24 2018-11-07 日亜化学工業株式会社 窒化物蛍光体及び発光装置
JP6669147B2 (ja) * 2016-10-31 2020-03-18 日亜化学工業株式会社 発光装置
JP2020109850A (ja) * 2016-10-31 2020-07-16 日亜化学工業株式会社 発光装置の製造方法
JP7107307B2 (ja) 2017-05-11 2022-07-27 三菱ケミカル株式会社 発光装置、および蛍光体
JP7048873B2 (ja) * 2017-07-25 2022-04-06 日亜化学工業株式会社 発光装置及び発光装置の製造方法
KR102452484B1 (ko) 2017-08-11 2022-10-11 삼성전자주식회사 발광소자 패키지 및 발광소자 패키지 모듈
KR102469363B1 (ko) * 2017-09-25 2022-11-23 엘지이노텍 주식회사 조명 모듈 및 이를 구비한 조명 장치
US10957825B2 (en) 2017-09-25 2021-03-23 Lg Innotek Co., Ltd. Lighting module and lighting apparatus having thereof
JP6665872B2 (ja) * 2018-01-15 2020-03-13 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP6835000B2 (ja) * 2018-01-31 2021-02-24 日亜化学工業株式会社 発光装置及び光源
JP7185126B2 (ja) * 2018-03-14 2022-12-07 日亜化学工業株式会社 照明装置及び植物栽培方法
DE102020001999A1 (de) 2019-03-29 2020-10-01 Nichia Corporation Lichtemittierende Vorrichtung
JP7060816B2 (ja) * 2019-03-29 2022-04-27 日亜化学工業株式会社 発光装置
CN111826157A (zh) 2019-04-19 2020-10-27 日亚化学工业株式会社 氟化物荧光体、发光装置和氟化物荧光体的制造方法
JP7100269B2 (ja) * 2019-06-26 2022-07-13 日亜化学工業株式会社 発光装置およびその製造方法
US20200407634A1 (en) 2019-06-26 2020-12-31 Nichia Corporation Light emitting device and method of manufacturing light emitting device
US10971660B2 (en) * 2019-08-09 2021-04-06 Eyesafe Inc. White LED light source and method of making same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07199501A (ja) * 1993-12-28 1995-08-04 Ricoh Co Ltd 正帯電積層型電子写真感光体
JP3419280B2 (ja) * 1996-11-05 2003-06-23 日亜化学工業株式会社 発光装置
JP3809760B2 (ja) * 2000-02-18 2006-08-16 日亜化学工業株式会社 発光ダイオード
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
DE102007021867A1 (de) * 2007-05-10 2008-11-20 Clariant International Limited Pigmentpräparationen auf Wasserbasis
JP5230171B2 (ja) * 2007-06-05 2013-07-10 シャープ株式会社 発光装置、発光装置の製造方法、電子機器および携帯電話機
JP5079487B2 (ja) * 2007-12-21 2012-11-21 凸版印刷株式会社 液晶表示装置およびそれに用いるカラーフィルタ
JP5289126B2 (ja) * 2008-03-24 2013-09-11 シチズンホールディングス株式会社 Ｌｅｄ光源及びｌｅｄ光源の色度調整方法
JP2011066314A (ja) * 2009-09-18 2011-03-31 Seiwa Electric Mfg Co Ltd 発光装置
JP5645487B2 (ja) * 2010-02-01 2014-12-24 日本カーバイド工業株式会社 光拡散シート、光拡散シートを用いた照明装置、及び表示装置
JP2011222712A (ja) * 2010-04-08 2011-11-04 Seiwa Electric Mfg Co Ltd 光源装置

Also Published As

Publication number Publication date
JP6477361B2 (ja) 2019-03-06
JP2016092401A (ja) 2016-05-23

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