HK1213090A1 - 附有帶框的晶片用的托盤 - Google Patents

附有帶框的晶片用的托盤

Info

Publication number
HK1213090A1
HK1213090A1 HK16101041.9A HK16101041A HK1213090A1 HK 1213090 A1 HK1213090 A1 HK 1213090A1 HK 16101041 A HK16101041 A HK 16101041A HK 1213090 A1 HK1213090 A1 HK 1213090A1
Authority
HK
Hong Kong
Prior art keywords
tray
tape
frame
wafer
fitted
Prior art date
Application number
HK16101041.9A
Other languages
English (en)
Inventor
正敬 西島
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Publication of HK1213090A1 publication Critical patent/HK1213090A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
HK16101041.9A 2013-02-11 2016-01-29 附有帶框的晶片用的托盤 HK1213090A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013023926 2013-02-11
PCT/JP2014/052878 WO2014123216A1 (ja) 2013-02-11 2014-02-07 テープフレーム付きウエハ用トレイ

Publications (1)

Publication Number Publication Date
HK1213090A1 true HK1213090A1 (zh) 2016-06-24

Family

ID=51299806

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101041.9A HK1213090A1 (zh) 2013-02-11 2016-01-29 附有帶框的晶片用的托盤

Country Status (7)

Country Link
US (1) US9666468B2 (zh)
JP (1) JP6282603B2 (zh)
CN (1) CN104995728B (zh)
HK (1) HK1213090A1 (zh)
SG (1) SG11201505757VA (zh)
TW (1) TWI622117B (zh)
WO (1) WO2014123216A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6433206B2 (ja) * 2014-09-03 2018-12-05 アキレス株式会社 テープフレーム付きウエハ用トレイ
TWI664130B (zh) * 2016-01-29 2019-07-01 旺矽科技股份有限公司 晶圓匣
JP6772498B2 (ja) * 2016-03-18 2020-10-21 株式会社Sumco 基板収納容器
JP6990873B2 (ja) * 2017-03-31 2022-02-03 アキレス株式会社 半導体ウェハ容器
JP7330081B2 (ja) * 2019-12-03 2023-08-21 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
CN115472539A (zh) * 2022-09-07 2022-12-13 苏州东昊塑胶五金有限公司 一种托盘结构及托盘结构的包胶工艺
CN117174629B (zh) * 2023-11-02 2024-04-19 南昌中微半导体设备有限公司 托盘载具和smif盒装载设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158437U (ja) * 1982-04-16 1983-10-22 昭和電工株式会社 ウエハ−容器
JP2910684B2 (ja) 1996-07-31 1999-06-23 日本電気株式会社 ウエハー容器
JP2000077512A (ja) * 1998-08-27 2000-03-14 Super Silicon Kenkyusho:Kk ウエーハ収容ケース
JP4562930B2 (ja) 2001-02-16 2010-10-13 アキレス株式会社 ダイシングウェーハ収納容器
JP2003168731A (ja) 2001-12-03 2003-06-13 M B K Micro Tec:Kk 基板トレー、基板トレー敷設用シート及び基板収納方法
US7578392B2 (en) * 2003-06-06 2009-08-25 Convey Incorporated Integrated circuit wafer packaging system and method
US6915906B2 (en) * 2003-07-14 2005-07-12 Peak Plastic & Metal Products (International) Limited Wafer storage container with wafer positioning posts
US7131248B2 (en) * 2003-07-14 2006-11-07 Peak Plastic & Metal Products (Int'l) Limited Wafer shipper with orientation control
US20050011056A1 (en) * 2003-07-14 2005-01-20 Pylant James D. Bare die tray clip
WO2005044694A1 (ja) 2003-11-06 2005-05-19 Sharp Kabushiki Kaisha 基板搬送用トレイ
JP2005150177A (ja) * 2003-11-12 2005-06-09 Nitto Denko Corp 半導体ウエハ裏面への粘着テープ貼付方法及び粘着テープ貼付装置
JP2005332868A (ja) * 2004-05-18 2005-12-02 Tokyo Seimitsu Co Ltd ワーク収納カセット
US7431162B2 (en) * 2005-07-15 2008-10-07 Illinois Tool Works Inc. Shock absorbing horizontal transport wafer box
JP4903429B2 (ja) * 2005-12-05 2012-03-28 ミライアル株式会社 載置トレイ及び薄板保持容器
US20070187286A1 (en) * 2006-02-16 2007-08-16 Pylant James D Wafer storage container and apparatus
JP4728840B2 (ja) * 2006-03-02 2011-07-20 ミライアル株式会社 薄板保持容器
JP4947631B2 (ja) * 2006-07-19 2012-06-06 ミライアル株式会社 クッションシート付ウエハ収納容器
JP4744603B2 (ja) * 2006-07-25 2011-08-10 ミライアル株式会社 クッションシート付ウエハ収納容器
JP4883627B2 (ja) * 2007-01-24 2012-02-22 ミライアル株式会社 クッションシート付ウエハ収納容器
JP2011001106A (ja) * 2009-06-19 2011-01-06 Panasonic Corp 半導体ウエハ収納容器

Also Published As

Publication number Publication date
US20150380293A1 (en) 2015-12-31
JPWO2014123216A1 (ja) 2017-02-02
CN104995728A (zh) 2015-10-21
US9666468B2 (en) 2017-05-30
WO2014123216A1 (ja) 2014-08-14
SG11201505757VA (en) 2015-09-29
TW201440167A (zh) 2014-10-16
CN104995728B (zh) 2018-09-14
TWI622117B (zh) 2018-04-21
JP6282603B2 (ja) 2018-02-21

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