HK1147158A1 - Method and device for filling carrier tapes with electronic components - Google Patents

Method and device for filling carrier tapes with electronic components

Info

Publication number
HK1147158A1
HK1147158A1 HK11101083.3A HK11101083A HK1147158A1 HK 1147158 A1 HK1147158 A1 HK 1147158A1 HK 11101083 A HK11101083 A HK 11101083A HK 1147158 A1 HK1147158 A1 HK 1147158A1
Authority
HK
Hong Kong
Prior art keywords
carrier tape
electronic components
filling
electronic component
carrier tapes
Prior art date
Application number
HK11101083.3A
Other languages
English (en)
Inventor
Silvain Vienot
Franco Craveiro
Philippe Roy
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Publication of HK1147158A1 publication Critical patent/HK1147158A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container Filling Or Packaging Operations (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
HK11101083.3A 2009-02-03 2011-02-01 Method and device for filling carrier tapes with electronic components HK1147158A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09151921A EP2214467B1 (en) 2009-02-03 2009-02-03 Method and device for filling carrier tapes with electronic components

Publications (1)

Publication Number Publication Date
HK1147158A1 true HK1147158A1 (en) 2011-07-29

Family

ID=40822922

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11101083.3A HK1147158A1 (en) 2009-02-03 2011-02-01 Method and device for filling carrier tapes with electronic components

Country Status (11)

Country Link
US (1) US9521793B2 (ko)
EP (1) EP2214467B1 (ko)
JP (1) JP5456792B2 (ko)
KR (1) KR101587179B1 (ko)
CN (1) CN102301845B (ko)
AT (1) ATE540568T1 (ko)
HK (1) HK1147158A1 (ko)
MY (1) MY152648A (ko)
SG (1) SG172767A1 (ko)
TW (1) TWI467631B (ko)
WO (1) WO2010089275A1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012116528A (ja) * 2010-11-30 2012-06-21 Ueno Seiki Kk テーピングユニット及び電子部品検査装置
WO2013192222A2 (en) * 2012-06-18 2013-12-27 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
JP5219056B1 (ja) * 2012-09-06 2013-06-26 上野精機株式会社 テーピングユニット及び電子部品検査装置
CN103869711B (zh) * 2012-12-11 2016-04-06 成都先进功率半导体股份有限公司 编带齿轮自动下降的控制方法
US9894776B2 (en) * 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
CN104994965A (zh) 2013-01-08 2015-10-21 Hzo股份有限公司 用于施涂保护性涂层的掩蔽基底
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
CN104890923A (zh) * 2014-03-07 2015-09-09 深圳市三一联光智能设备股份有限公司 编带机自动取换料装置
JP6202033B2 (ja) * 2014-05-15 2017-09-27 株式会社村田製作所 テーピング電子部品連用リール及びその製造方法
JP6655355B2 (ja) * 2015-11-05 2020-02-26 Juki株式会社 実装装置及び部品返却方法
EP3403108B1 (en) * 2016-01-15 2022-06-15 Rasco GmbH Method and device for loading and unloading devices under test into a tester by flipping
EP3610500B1 (de) * 2017-04-11 2021-03-31 Mühlbauer GmbH & Co. KG. Bauteil-empfangseinrichtung mit optischem sensor
TWI627400B (zh) * 2017-04-11 2018-06-21 Defective rejection method for passive component batch detection and rejection system thereof
JP6366121B1 (ja) * 2017-07-06 2018-08-01 上野精機株式会社 テーピング装置
JP6966294B2 (ja) * 2017-11-15 2021-11-10 太陽誘電株式会社 テーピング装置およびテーピング方法
CN110481844A (zh) * 2018-05-14 2019-11-22 深圳市复德科技有限公司 盖带防折叠装置及具有该盖带防折叠装置的替换料设备
CN110515627A (zh) * 2019-07-24 2019-11-29 白锦添 一种快速安全自动烧录系统
TWI708536B (zh) 2019-11-25 2020-10-21 欣興電子股份有限公司 移除局部蓋體的裝置及移除局部蓋體的方法
CN113232947B (zh) * 2021-03-24 2023-06-16 湖北九邦现代农业有限公司 一种可实现自动更换和封装鸡蛋的检测设备及其检测方法
CN115043042B (zh) * 2022-06-07 2023-06-30 东莞广达智能科技有限公司 一种全自动多方位视觉检测和包装一体设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8513297D0 (en) * 1985-05-28 1985-07-03 Dynapert Precima Ltd Machines for handling electrical components
WO1999003733A1 (en) * 1997-07-16 1999-01-28 Systemation Engineered Products, Inc. Position sensing system for an inspection and handling system
US5974903A (en) 1998-01-08 1999-11-02 Intel Corporation Method and apparatus for in situ visual inspection of die products in tape and reel shipping medium
JP4050425B2 (ja) * 1999-07-08 2008-02-20 ローム株式会社 電子部品の連続式テーピング装置
EP1073325A3 (en) 1999-07-27 2002-04-03 Lucent Technologies Inc. Testing and transporting semiconductor chips
US6634159B1 (en) * 1999-09-20 2003-10-21 Sanyo Electric Co., Ltd. Taping apparatus for electronic components
JP3690257B2 (ja) * 2000-08-28 2005-08-31 株式会社村田製作所 チップ部品の搬送装置
US20020133940A1 (en) * 2001-03-26 2002-09-26 Fuji Machine Mfg. Co., Ltd Electric-component supplying method and device, and electric-component mounting method and system
JP4154652B2 (ja) * 2002-08-30 2008-09-24 澁谷工業株式会社 テーピング装置
WO2004052069A1 (fr) 2003-03-07 2004-06-17 Ismeca Semiconductor Holding Sa Methode et dispositif pour l'extraction de composants electroniques hors de tubes
KR100527211B1 (ko) * 2005-02-28 2005-11-08 윈텍 주식회사 전자부품 검사 시스템
DE102005041024A1 (de) 2005-08-23 2007-03-01 Bielomatik Leuze Gmbh + Co.Kg Vorrichtung und Verfahren zum kontinuierlichen Erzeugen einer fehlerfreien Trägerbahn

Also Published As

Publication number Publication date
CN102301845A (zh) 2011-12-28
US9521793B2 (en) 2016-12-13
WO2010089275A8 (en) 2011-06-16
SG172767A1 (en) 2011-08-29
TWI467631B (zh) 2015-01-01
US20110231002A1 (en) 2011-09-22
MY152648A (en) 2014-10-31
TW201036032A (en) 2010-10-01
KR20110127118A (ko) 2011-11-24
ATE540568T1 (de) 2012-01-15
JP2012516813A (ja) 2012-07-26
EP2214467B1 (en) 2012-01-04
WO2010089275A1 (en) 2010-08-12
KR101587179B1 (ko) 2016-02-02
JP5456792B2 (ja) 2014-04-02
EP2214467A1 (en) 2010-08-04
CN102301845B (zh) 2015-05-13

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160203