HK1140721A1 - Liquid material discharge device and liquid material discharge method - Google Patents

Liquid material discharge device and liquid material discharge method

Info

Publication number
HK1140721A1
HK1140721A1 HK10107194.7A HK10107194A HK1140721A1 HK 1140721 A1 HK1140721 A1 HK 1140721A1 HK 10107194 A HK10107194 A HK 10107194A HK 1140721 A1 HK1140721 A1 HK 1140721A1
Authority
HK
Hong Kong
Prior art keywords
liquid material
material discharge
discharge device
discharge method
liquid
Prior art date
Application number
HK10107194.7A
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1140721A1 publication Critical patent/HK1140721A1/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/26Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B05C5/0237Fluid actuated valves
HK10107194.7A 2007-03-30 2010-07-27 Liquid material discharge device and liquid material discharge method HK1140721A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007094672A JP2010022881A (ja) 2007-03-30 2007-03-30 液材吐出装置および液材吐出方法
PCT/JP2008/000787 WO2008126373A1 (ja) 2007-03-30 2008-03-28 液材吐出装置および液材吐出方法

Publications (1)

Publication Number Publication Date
HK1140721A1 true HK1140721A1 (en) 2010-10-22

Family

ID=39863533

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10107194.7A HK1140721A1 (en) 2007-03-30 2010-07-27 Liquid material discharge device and liquid material discharge method

Country Status (8)

Country Link
US (2) US8448818B2 (xx)
EP (1) EP2143503B1 (xx)
JP (2) JP2010022881A (xx)
KR (1) KR101445585B1 (xx)
CN (1) CN101674892B (xx)
HK (1) HK1140721A1 (xx)
TW (1) TWI428187B (xx)
WO (1) WO2008126373A1 (xx)

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JP2010022881A (ja) * 2007-03-30 2010-02-04 Musashi Eng Co Ltd 液材吐出装置および液材吐出方法
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JP6842152B2 (ja) 2016-05-31 2021-03-17 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
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CN106345638B (zh) * 2016-08-29 2018-10-09 浙江厚达智能科技股份有限公司 自动升降式电机端盖上油机构
JP6778426B2 (ja) 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
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JP2018103139A (ja) * 2016-12-28 2018-07-05 セイコーエプソン株式会社 流体吐出装置
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CN110833969A (zh) * 2018-08-18 2020-02-25 罗天珍 逆止阀隔断撞针式喷射点胶阀
DE102018007776B3 (de) * 2018-10-01 2020-01-30 Semen LERNER Vorrichtung zum hochfrequenten Dosieren und Verteilen von Kleinstmengen von Fluiden nach dem berührungslosen Verfahren
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Also Published As

Publication number Publication date
CN101674892B (zh) 2012-05-30
US8807400B2 (en) 2014-08-19
US20100294810A1 (en) 2010-11-25
JPWO2008126373A1 (ja) 2010-07-22
US8448818B2 (en) 2013-05-28
TW200848166A (en) 2008-12-16
EP2143503A4 (en) 2017-04-12
TWI428187B (zh) 2014-03-01
JP2010022881A (ja) 2010-02-04
WO2008126373A1 (ja) 2008-10-23
US20130233891A1 (en) 2013-09-12
EP2143503B1 (en) 2020-01-08
CN101674892A (zh) 2010-03-17
EP2143503A1 (en) 2010-01-13
JP5528800B2 (ja) 2014-06-25
KR101445585B1 (ko) 2014-09-29
KR20090125162A (ko) 2009-12-03

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