HK1128483A1 - Hardening resin composition - Google Patents

Hardening resin composition

Info

Publication number
HK1128483A1
HK1128483A1 HK09106173.7A HK09106173A HK1128483A1 HK 1128483 A1 HK1128483 A1 HK 1128483A1 HK 09106173 A HK09106173 A HK 09106173A HK 1128483 A1 HK1128483 A1 HK 1128483A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
hardening resin
hardening
composition
resin
Prior art date
Application number
HK09106173.7A
Other languages
English (en)
Inventor
Hiroshi Samukawa
Kouki Hatsuda
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1128483A1 publication Critical patent/HK1128483A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
HK09106173.7A 2006-04-10 2009-07-09 Hardening resin composition HK1128483A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006108111A JP2007277467A (ja) 2006-04-10 2006-04-10 硬化性樹脂組成物
PCT/JP2007/055063 WO2007116625A1 (fr) 2006-04-10 2007-03-14 Composition de résine durcissante

Publications (1)

Publication Number Publication Date
HK1128483A1 true HK1128483A1 (en) 2009-10-30

Family

ID=38580927

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09106173.7A HK1128483A1 (en) 2006-04-10 2009-07-09 Hardening resin composition

Country Status (5)

Country Link
US (1) US7868109B2 (fr)
JP (1) JP2007277467A (fr)
CN (1) CN101415736B (fr)
HK (1) HK1128483A1 (fr)
WO (1) WO2007116625A1 (fr)

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US20080258111A1 (en) * 2007-04-17 2008-10-23 General Electric Company Polycarbazolyl(meth)acrylate light emissive compositions
TWI379840B (en) * 2008-08-01 2012-12-21 Eternal Chemical Co Ltd Polymerizable composition and its uses
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KR101216817B1 (ko) * 2009-03-30 2012-12-28 쇼와 덴코 가부시키가이샤 경화성 조성물 및 그의 경화물
US8829070B2 (en) 2009-08-31 2014-09-09 Kabushiki Kaisha Toshiba Ultraviolet-curable resin material for pattern transfer and magnetic recording medium manufacturing method using the same
SG183402A1 (en) 2010-02-19 2012-09-27 Toray Industries Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, led package, light -emitting device, and process for production of led-mounted substrate
CN102858823A (zh) * 2010-04-09 2013-01-02 日本化药株式会社 光学透镜片用能量射线固化型树脂组合物及其固化物
WO2012020688A1 (fr) * 2010-08-12 2012-02-16 ダイセル化学工業株式会社 Composition de résine à faible perméabilité à l'humidité et matériau durci de celle-ci
JP5626630B2 (ja) * 2010-09-01 2014-11-19 Dic株式会社 材料組成物およびそれを用いた光学素子
WO2012053377A1 (fr) * 2010-10-18 2012-04-26 株式会社ダイセル Composition de résine à indice de réfraction élevé et résine durcie
JP4988032B2 (ja) * 2010-12-08 2012-08-01 株式会社東芝 磁気記録媒体の製造方法
JP5039199B2 (ja) * 2010-12-08 2012-10-03 株式会社東芝 パターン転写に用いられる紫外線硬化性樹脂材料
SG190320A1 (en) * 2010-12-13 2013-07-31 Toray Industries Phosphor sheet, led and light emitting device using same and method for producing led
EP2762503B1 (fr) 2011-09-27 2017-11-08 Maruzen Petrochemical Co., Ltd. Matériau d'élément optique et procédé de production de celui-ci
KR101525286B1 (ko) * 2012-09-03 2015-06-02 (주)엘지하우시스 고굴절층 코팅용 조성물 및 이를 포함하는 투명 도전성 필름
JP2014077117A (ja) * 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料
KR101635722B1 (ko) * 2013-09-05 2016-07-01 주식회사 다이셀 수지 조성물 및 그의 경화물
CN103804560A (zh) * 2014-02-26 2014-05-21 江苏华天通纳米科技有限公司 一种高折射率光学树脂及其制备方法
CN106795386A (zh) 2014-07-25 2017-05-31 科迪华公司 有机薄膜油墨组合物和方法
KR101788366B1 (ko) 2014-11-24 2017-10-20 삼성디스플레이 주식회사 고굴절률 캡핑층을 포함하는 유기발광 표시장치
JP6507683B2 (ja) * 2015-02-02 2019-05-08 日立化成株式会社 樹脂組成物及び光学部材
KR101943689B1 (ko) * 2015-06-19 2019-01-30 삼성에스디아이 주식회사 유기발광표시장치
KR101943688B1 (ko) * 2015-06-19 2019-01-30 삼성에스디아이 주식회사 유기발광표시장치
KR20180048690A (ko) 2015-08-31 2018-05-10 카티바, 인크. 디- 및 모노(메트)아크릴레이트 기초 유기 박막 잉크 조성물
TWI708803B (zh) * 2016-03-10 2020-11-01 日商迪愛生股份有限公司 硬化性組成物及光學構件
CN106356440A (zh) * 2016-08-31 2017-01-25 肥城芯联新材料科技有限公司 固晶胶及光电元件封装结构
WO2018070256A1 (fr) * 2016-10-11 2018-04-19 Dic株式会社 Composition de résine durcissable par rayonnement d'énergie active, destinée à des articles optiques, produit durci et feuille optique
CN118510305A (zh) 2017-04-21 2024-08-16 柯狄公司 用于形成有机薄膜的组合物和技术
CN110959018B (zh) 2017-07-28 2022-03-08 株式会社尼康 三维立体光刻用光固化性组合物及三维物体
CN114174262A (zh) * 2019-07-08 2022-03-11 索尼集团公司 化合物、聚合物和有机材料、以及使用该有机材料的光学设备、光学部件和图像显示设备
WO2023068239A1 (fr) * 2021-10-19 2023-04-27 積水化学工業株式会社 Composition de résine pour utilisation d'étanchéité

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US5175248A (en) * 1990-06-04 1992-12-29 Sartomer Company, Inc. Process for the removal of n-vinylcarbazole from poly(n-vinylcarbazole)
JP3088795B2 (ja) * 1991-09-19 2000-09-18 大日本印刷株式会社 光学素子の製造方法
JP4530565B2 (ja) 2001-03-29 2010-08-25 大阪瓦斯株式会社 モノアクリレートフルオレン化合物、該化合物を含有する組成物、及びその硬化物
JP4774648B2 (ja) * 2001-07-31 2011-09-14 Ｄｉｃ株式会社 光学素子用重合性組成物及びこれを用いた光学素子
WO2003069957A1 (fr) * 2002-02-12 2003-08-21 Idemitsu Kosan Co., Ltd. Ecran electroluminescent et son procede de fabrication
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US6870311B2 (en) 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles

Also Published As

Publication number Publication date
CN101415736B (zh) 2012-01-04
US7868109B2 (en) 2011-01-11
US20090143505A1 (en) 2009-06-04
JP2007277467A (ja) 2007-10-25
WO2007116625A1 (fr) 2007-10-18
CN101415736A (zh) 2009-04-22

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