HK1119487A1 - Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method - Google Patents

Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method

Info

Publication number
HK1119487A1
HK1119487A1 HK08110891.1A HK08110891A HK1119487A1 HK 1119487 A1 HK1119487 A1 HK 1119487A1 HK 08110891 A HK08110891 A HK 08110891A HK 1119487 A1 HK1119487 A1 HK 1119487A1
Authority
HK
Hong Kong
Prior art keywords
reflecting mirror
multilayer reflecting
manufacturing
optical system
exposure apparatus
Prior art date
Application number
HK08110891.1A
Other languages
English (en)
Inventor
Masayuki Shiraishi
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1119487A1 publication Critical patent/HK1119487A1/xx

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
    • G02B5/085—Multilayer mirrors, i.e. having two or more reflecting layers at least one of the reflecting layers comprising metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0891—Ultraviolet [UV] mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062—Devices having a multilayer structure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nanotechnology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Atmospheric Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Elements Other Than Lenses (AREA)
HK08110891.1A 2005-10-11 2008-09-30 Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method HK1119487A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005295856 2005-10-11
PCT/JP2006/319876 WO2007043414A1 (ja) 2005-10-11 2006-10-04 多層膜反射鏡、多層膜反射鏡の製造方法、光学系、露光装置及びデバイスの製造方法

Publications (1)

Publication Number Publication Date
HK1119487A1 true HK1119487A1 (en) 2009-03-06

Family

ID=37942658

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08110891.1A HK1119487A1 (en) 2005-10-11 2008-09-30 Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method

Country Status (7)

Country Link
EP (1) EP1947682B1 (zh)
JP (1) JP5061903B2 (zh)
KR (1) KR101310525B1 (zh)
CN (1) CN100559551C (zh)
HK (1) HK1119487A1 (zh)
TW (1) TWI410676B (zh)
WO (1) WO2007043414A1 (zh)

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DE102009017095A1 (de) * 2009-04-15 2010-10-28 Carl Zeiss Smt Ag Spiegel für den EUV-Wellenlängenbereich, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel und Projektionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv
DE102009029471A1 (de) * 2009-09-15 2011-03-31 Carl Zeiss Smt Gmbh Spiegel zur Verwendung in einer Mikrolithographie-Projektionsbelichtungsanlage
US8526104B2 (en) * 2010-04-30 2013-09-03 Corning Incorporated Plasma ion assisted deposition of Mo/Si multilayer EUV coatings
DE102011005543A1 (de) * 2011-03-15 2012-09-20 Carl Zeiss Smt Gmbh Verfahren zur Korrektur der Oberflächenform eines Spiegels
JP6093753B2 (ja) 2011-03-23 2017-03-08 カール・ツァイス・エスエムティー・ゲーエムベーハー Ｅｕｖミラー機構、ｅｕｖミラー機構を備えた光学系、及びｅｕｖミラー機構を備えた光学系を操作する方法
US9249501B2 (en) 2011-05-18 2016-02-02 Carl Zeiss Smt Gmbh Surface correction on coated mirrors
CN102681055B (zh) * 2012-05-30 2014-09-17 同济大学 一种硅铝合金/锆极紫外多层膜反射镜及其制备方法
DE102012223669A1 (de) 2012-12-19 2013-11-21 Carl Zeiss Smt Gmbh Wellenfrontkorrektur von beschichteten Spiegeln
DE102013212462A1 (de) 2013-06-27 2015-01-15 Carl Zeiss Smt Gmbh Oberflächenkorrektur von Spiegeln mit Entkopplungsbeschichtung
DE102013222330A1 (de) * 2013-11-04 2015-05-07 Carl Zeiss Smt Gmbh Spiegel, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage
US9739913B2 (en) * 2014-07-11 2017-08-22 Applied Materials, Inc. Extreme ultraviolet capping layer and method of manufacturing and lithography thereof
US9581890B2 (en) * 2014-07-11 2017-02-28 Applied Materials, Inc. Extreme ultraviolet reflective element with multilayer stack and method of manufacturing thereof
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DE102015213249A1 (de) 2015-07-15 2017-01-19 Carl Zeiss Smt Gmbh Verfahren zum Herstellen eines Spiegels, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage
DE102015224238A1 (de) 2015-12-03 2016-12-15 Carl Zeiss Smt Gmbh Optisches Element, Projektionssystem und EUV-Lithographiesystem damit und Verfahren zur Korrektur einer Oberflächenform
US10217729B2 (en) 2016-09-30 2019-02-26 Intel Corporation Apparatus for micro pick and bond
DE102016224113A1 (de) 2016-12-05 2018-06-07 Carl Zeiss Smt Gmbh Intensitätsanpassungsfilter für die euv - mikrolithographie und verfahren zur herstellung desselben sowie beleuchtungssystem mit einem entsprechenden filter
US20180166294A1 (en) * 2016-12-13 2018-06-14 Intel Corporation Apparatus and methods to achieve uniform package thickness
TWI845677B (zh) * 2019-05-22 2024-06-21 美商應用材料股份有限公司 極紫外光遮罩吸收材料
TWI764614B (zh) * 2021-03-10 2022-05-11 台灣積體電路製造股份有限公司 微影系統及其方法
CN116463588B (zh) * 2023-04-23 2023-11-03 有研国晶辉新材料有限公司 一种红外滤光薄膜的制备方法、红外陷波光学元件

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Also Published As

Publication number Publication date
EP1947682B1 (en) 2012-01-18
CN101278376A (zh) 2008-10-01
WO2007043414A1 (ja) 2007-04-19
JP5061903B2 (ja) 2012-10-31
EP1947682A1 (en) 2008-07-23
CN100559551C (zh) 2009-11-11
KR101310525B1 (ko) 2013-09-23
TWI410676B (zh) 2013-10-01
KR20080056763A (ko) 2008-06-23
TW200714930A (en) 2007-04-16
JPWO2007043414A1 (ja) 2009-04-16
EP1947682A4 (en) 2009-06-24

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20221004