HK1115997A1 - Latent curing agent - Google Patents

Latent curing agent

Info

Publication number
HK1115997A1
HK1115997A1 HK08106381.6A HK08106381A HK1115997A1 HK 1115997 A1 HK1115997 A1 HK 1115997A1 HK 08106381 A HK08106381 A HK 08106381A HK 1115997 A1 HK1115997 A1 HK 1115997A1
Authority
HK
Hong Kong
Prior art keywords
curing agent
latent curing
latent
agent
curing
Prior art date
Application number
HK08106381.6A
Other languages
English (en)
Inventor
Katsuhiko Komuro
Tadasu Kawashima
Masahiko Ito
Daisuke Masuko
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1115997A1 publication Critical patent/HK1115997A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C08G59/682—Alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/02—Cellulose; Modified cellulose
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50—Physical properties
    • C08G2261/59—Stability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polyurethanes Or Polyureas (AREA)
HK08106381.6A 2006-02-07 2008-06-10 Latent curing agent HK1115997A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006030038A JP5267757B2 (ja) 2006-02-07 2006-02-07 潜在性硬化剤
PCT/JP2006/322713 WO2007091358A1 (ja) 2006-02-07 2006-11-15 潜在性硬化剤

Publications (1)

Publication Number Publication Date
HK1115997A1 true HK1115997A1 (en) 2008-12-12

Family

ID=38344965

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08106381.6A HK1115997A1 (en) 2006-02-07 2008-06-10 Latent curing agent

Country Status (6)

Country Link
JP (1) JP5267757B2 (zh)
KR (1) KR101342766B1 (zh)
CN (1) CN101115782B (zh)
HK (1) HK1115997A1 (zh)
TW (1) TWI404741B (zh)
WO (1) WO2007091358A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5130501B2 (ja) * 2007-01-24 2013-01-30 デクセリアルズ株式会社 潜在性硬化剤
KR101039546B1 (ko) * 2007-01-24 2011-06-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 잠재성 경화제
JP5298431B2 (ja) * 2007-01-24 2013-09-25 デクセリアルズ株式会社 潜在性硬化剤
JP5707662B2 (ja) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物
JP5417715B2 (ja) 2008-02-20 2014-02-19 デクセリアルズ株式会社 マイクロカプセル化シランカップリング剤
JP5382846B2 (ja) * 2008-06-10 2014-01-08 日本化薬株式会社 感光性化合物、それを含む組成物及びその硬化物
JP5321082B2 (ja) * 2009-01-21 2013-10-23 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤及びその製造方法
KR101940166B1 (ko) 2016-04-14 2019-01-18 삼성에스디아이 주식회사 다공성 내열층 조성물, 다공성 내열층을 포함하는 분리막, 및 상기 분리막을 이용한 전기 화학 전지
JP6670688B2 (ja) * 2016-06-15 2020-03-25 デクセリアルズ株式会社 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物
JP6948114B2 (ja) * 2016-06-15 2021-10-13 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物、及びその製造方法
WO2019139112A1 (ja) * 2018-01-12 2019-07-18 味の素株式会社 被覆粒子
JP2022034224A (ja) * 2020-08-18 2022-03-03 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH078899B2 (ja) * 1987-03-12 1995-02-01 田岡化学工業株式会社 硬化性組成物
JPH05313173A (ja) * 1992-05-11 1993-11-26 Toshiba Corp 液晶セル
JP3875859B2 (ja) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP4148685B2 (ja) * 2002-02-18 2008-09-10 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
CN101143998B (zh) * 2002-12-05 2011-03-09 索尼化学株式会社 潜在性硬化剂、其制造方法和粘接剂
CN1285660C (zh) * 2002-12-05 2006-11-22 索尼化学株式会社 潜在性硬化剂、其制造方法及粘接剂
JP2004339366A (ja) * 2003-05-15 2004-12-02 Kawaken Fine Chem Co Ltd 樹脂用硬化剤及び硬化性樹脂組成物
JP4381255B2 (ja) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP5057011B2 (ja) * 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤

Also Published As

Publication number Publication date
TWI404741B (zh) 2013-08-11
CN101115782B (zh) 2012-02-08
CN101115782A (zh) 2008-01-30
JP2007211056A (ja) 2007-08-23
JP5267757B2 (ja) 2013-08-21
KR101342766B1 (ko) 2013-12-19
TW200738774A (en) 2007-10-16
WO2007091358A1 (ja) 2007-08-16
KR20080092832A (ko) 2008-10-16

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