HK1110437A1 - Methods and systems for attaching die in stacked-die packages - Google Patents
Methods and systems for attaching die in stacked-die packagesInfo
- Publication number
- HK1110437A1 HK1110437A1 HK08100683.4A HK08100683A HK1110437A1 HK 1110437 A1 HK1110437 A1 HK 1110437A1 HK 08100683 A HK08100683 A HK 08100683A HK 1110437 A1 HK1110437 A1 HK 1110437A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- die
- attaching
- stacked
- systems
- methods
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/918,585 US7224075B2 (en) | 2004-08-13 | 2004-08-13 | Methods and systems for attaching die in stacked-die packages |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1110437A1 true HK1110437A1 (en) | 2008-07-11 |
Family
ID=35447545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08100683.4A HK1110437A1 (en) | 2004-08-13 | 2008-01-18 | Methods and systems for attaching die in stacked-die packages |
Country Status (8)
Country | Link |
---|---|
US (2) | US7224075B2 (ja) |
JP (1) | JP4732456B2 (ja) |
KR (1) | KR20070032817A (ja) |
CN (1) | CN100594609C (ja) |
DE (1) | DE112005001962B4 (ja) |
HK (1) | HK1110437A1 (ja) |
TW (1) | TWI318448B (ja) |
WO (1) | WO2006020428A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070158807A1 (en) * | 2005-12-29 | 2007-07-12 | Daoqiang Lu | Edge interconnects for die stacking |
US20070152314A1 (en) * | 2005-12-30 | 2007-07-05 | Intel Corporation | Low stress stacked die packages |
US7420269B2 (en) * | 2006-04-18 | 2008-09-02 | Stats Chippac Ltd. | Stacked integrated circuit package-in-package system |
TWI335654B (en) * | 2007-05-04 | 2011-01-01 | Advanced Semiconductor Eng | Package for reducing stress |
EP2414801B1 (en) | 2009-03-30 | 2021-05-26 | QUALCOMM Incorporated | Chip package with stacked processor and memory chips |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5157589A (en) * | 1990-07-02 | 1992-10-20 | General Electric Company | Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's |
TW289900B (ja) | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
US5721452A (en) * | 1995-08-16 | 1998-02-24 | Micron Technology, Inc. | Angularly offset stacked die multichip device and method of manufacture |
US20010006677A1 (en) * | 1996-10-29 | 2001-07-05 | Mcginity James W. | Effervescence polymeric film drug delivery system |
JP3920399B2 (ja) * | 1997-04-25 | 2007-05-30 | 株式会社東芝 | マルチチップ半導体装置用チップの位置合わせ方法、およびマルチチップ半導体装置の製造方法・製造装置 |
CA2322815C (en) * | 1998-03-05 | 2007-03-13 | Omnova Solutions Inc. | Easily cleanable polymer laminates |
US6212767B1 (en) | 1999-08-31 | 2001-04-10 | Micron Technology, Inc. | Assembling a stacked die package |
AU7247000A (en) * | 2000-01-11 | 2001-07-19 | Givaudan Sa | Composite materials |
JP2001250907A (ja) * | 2000-03-08 | 2001-09-14 | Toshiba Corp | 半導体装置及びその製造方法 |
KR100463558B1 (ko) * | 2000-04-25 | 2004-12-29 | 히다치 가세고교 가부시끼가이샤 | 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체 |
US6858941B2 (en) * | 2000-12-07 | 2005-02-22 | International Business Machines Corporation | Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
JP2002246539A (ja) * | 2001-02-19 | 2002-08-30 | Hitachi Ltd | 半導体装置の製造方法 |
JP3839323B2 (ja) * | 2001-04-06 | 2006-11-01 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP2002367172A (ja) * | 2001-06-05 | 2002-12-20 | Tdk Corp | マルチレベル光記録媒体、マルチレベル記録方法およびマルチレベル再生方法 |
JP3719234B2 (ja) * | 2001-08-06 | 2005-11-24 | 日立化成工業株式会社 | 半導体用接着フィルム、およびこれを用いた半導体用接着フィルム付きリードフレームならびに半導体装置 |
JP2003124236A (ja) * | 2001-10-09 | 2003-04-25 | Mitsui Chemicals Inc | 接着材料およびそれらを用いたスタックパッケージ |
JP4343493B2 (ja) * | 2002-06-19 | 2009-10-14 | 三井化学株式会社 | 半導体チップの積層方法 |
JP4705748B2 (ja) * | 2003-05-30 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20040245651A1 (en) * | 2003-06-09 | 2004-12-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
JP2005101312A (ja) * | 2003-09-25 | 2005-04-14 | Renesas Technology Corp | 半導体装置の製造方法 |
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2004
- 2004-08-13 US US10/918,585 patent/US7224075B2/en active Active
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2005
- 2005-07-27 TW TW094125492A patent/TWI318448B/zh not_active IP Right Cessation
- 2005-07-29 KR KR1020077003448A patent/KR20070032817A/ko not_active Application Discontinuation
- 2005-07-29 CN CN200580027379A patent/CN100594609C/zh active Active
- 2005-07-29 DE DE112005001962.4T patent/DE112005001962B4/de not_active Expired - Fee Related
- 2005-07-29 WO PCT/US2005/026940 patent/WO2006020428A1/en active Application Filing
- 2005-07-29 JP JP2007525649A patent/JP4732456B2/ja not_active Expired - Fee Related
- 2005-10-19 US US11/254,309 patent/US20060038276A1/en not_active Abandoned
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2008
- 2008-01-18 HK HK08100683.4A patent/HK1110437A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
KR20070032817A (ko) | 2007-03-22 |
JP2008509572A (ja) | 2008-03-27 |
CN101002321A (zh) | 2007-07-18 |
WO2006020428A1 (en) | 2006-02-23 |
TWI318448B (en) | 2009-12-11 |
US7224075B2 (en) | 2007-05-29 |
DE112005001962T5 (de) | 2007-10-18 |
DE112005001962B4 (de) | 2014-08-21 |
TW200620611A (en) | 2006-06-16 |
US20060033192A1 (en) | 2006-02-16 |
US20060038276A1 (en) | 2006-02-23 |
JP4732456B2 (ja) | 2011-07-27 |
CN100594609C (zh) | 2010-03-17 |
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