TWI318448B - Methods and systems for attaching die in stacked-die packages - Google Patents

Methods and systems for attaching die in stacked-die packages

Info

Publication number
TWI318448B
TWI318448B TW094125492A TW94125492A TWI318448B TW I318448 B TWI318448 B TW I318448B TW 094125492 A TW094125492 A TW 094125492A TW 94125492 A TW94125492 A TW 94125492A TW I318448 B TWI318448 B TW I318448B
Authority
TW
Taiwan
Prior art keywords
die
attaching
stacked
systems
methods
Prior art date
Application number
TW094125492A
Other languages
English (en)
Other versions
TW200620611A (en
Inventor
Rahul Manepalli
Shinobu Kourakata
Nina Ricci Buenaseda
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200620611A publication Critical patent/TW200620611A/zh
Application granted granted Critical
Publication of TWI318448B publication Critical patent/TWI318448B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
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    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW094125492A 2004-08-13 2005-07-27 Methods and systems for attaching die in stacked-die packages TWI318448B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/918,585 US7224075B2 (en) 2004-08-13 2004-08-13 Methods and systems for attaching die in stacked-die packages

Publications (2)

Publication Number Publication Date
TW200620611A TW200620611A (en) 2006-06-16
TWI318448B true TWI318448B (en) 2009-12-11

Family

ID=35447545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125492A TWI318448B (en) 2004-08-13 2005-07-27 Methods and systems for attaching die in stacked-die packages

Country Status (8)

Country Link
US (2) US7224075B2 (zh)
JP (1) JP4732456B2 (zh)
KR (1) KR20070032817A (zh)
CN (1) CN100594609C (zh)
DE (1) DE112005001962B4 (zh)
HK (1) HK1110437A1 (zh)
TW (1) TWI318448B (zh)
WO (1) WO2006020428A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070158807A1 (en) * 2005-12-29 2007-07-12 Daoqiang Lu Edge interconnects for die stacking
US20070152314A1 (en) * 2005-12-30 2007-07-05 Intel Corporation Low stress stacked die packages
US7420269B2 (en) * 2006-04-18 2008-09-02 Stats Chippac Ltd. Stacked integrated circuit package-in-package system
TWI335654B (en) * 2007-05-04 2011-01-01 Advanced Semiconductor Eng Package for reducing stress
EP2414801B1 (en) 2009-03-30 2021-05-26 QUALCOMM Incorporated Chip package with stacked processor and memory chips

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157589A (en) * 1990-07-02 1992-10-20 General Electric Company Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's
TW289900B (zh) * 1994-04-22 1996-11-01 Gould Electronics Inc
US5721452A (en) * 1995-08-16 1998-02-24 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US20010006677A1 (en) * 1996-10-29 2001-07-05 Mcginity James W. Effervescence polymeric film drug delivery system
JP3920399B2 (ja) * 1997-04-25 2007-05-30 株式会社東芝 マルチチップ半導体装置用チップの位置合わせ方法、およびマルチチップ半導体装置の製造方法・製造装置
DE69918815T2 (de) * 1998-03-05 2005-08-18 Omnova Solutions Inc., Fairlawn Einfach reinigbare polymere mehrschichtstoffe
US6212767B1 (en) * 1999-08-31 2001-04-10 Micron Technology, Inc. Assembling a stacked die package
AU7247000A (en) * 2000-01-11 2001-07-19 Givaudan Sa Composite materials
JP2001250907A (ja) * 2000-03-08 2001-09-14 Toshiba Corp 半導体装置及びその製造方法
MY143567A (en) * 2000-04-25 2011-05-31 Hitachi Chemical Co Ltd Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
US6858941B2 (en) * 2000-12-07 2005-02-22 International Business Machines Corporation Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
JP2002246539A (ja) * 2001-02-19 2002-08-30 Hitachi Ltd 半導体装置の製造方法
JP3839323B2 (ja) * 2001-04-06 2006-11-01 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2002367172A (ja) * 2001-06-05 2002-12-20 Tdk Corp マルチレベル光記録媒体、マルチレベル記録方法およびマルチレベル再生方法
JP3719234B2 (ja) * 2001-08-06 2005-11-24 日立化成工業株式会社 半導体用接着フィルム、およびこれを用いた半導体用接着フィルム付きリードフレームならびに半導体装置
JP2003124236A (ja) * 2001-10-09 2003-04-25 Mitsui Chemicals Inc 接着材料およびそれらを用いたスタックパッケージ
JP4343493B2 (ja) * 2002-06-19 2009-10-14 三井化学株式会社 半導体チップの積層方法
JP4705748B2 (ja) * 2003-05-30 2011-06-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20040245651A1 (en) * 2003-06-09 2004-12-09 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same
JP2005101312A (ja) * 2003-09-25 2005-04-14 Renesas Technology Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
HK1110437A1 (en) 2008-07-11
CN101002321A (zh) 2007-07-18
WO2006020428A1 (en) 2006-02-23
DE112005001962T5 (de) 2007-10-18
US20060033192A1 (en) 2006-02-16
JP2008509572A (ja) 2008-03-27
CN100594609C (zh) 2010-03-17
TW200620611A (en) 2006-06-16
US7224075B2 (en) 2007-05-29
JP4732456B2 (ja) 2011-07-27
DE112005001962B4 (de) 2014-08-21
US20060038276A1 (en) 2006-02-23
KR20070032817A (ko) 2007-03-22

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