HK1109708A2 - Interface card and apparatus and process for the formation thereof - Google Patents

Interface card and apparatus and process for the formation thereof

Info

Publication number
HK1109708A2
HK1109708A2 HK07104374A HK07104374A HK1109708A2 HK 1109708 A2 HK1109708 A2 HK 1109708A2 HK 07104374 A HK07104374 A HK 07104374A HK 07104374 A HK07104374 A HK 07104374A HK 1109708 A2 HK1109708 A2 HK 1109708A2
Authority
HK
Hong Kong
Prior art keywords
formation
interface card
card
interface
Prior art date
Application number
HK07104374A
Other languages
English (en)
Inventor
Oded Bashan
Guy Shafran
Original Assignee
On Track Innovations Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41129289&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1109708(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to HK07104374A priority Critical patent/HK1109708A2/xx
Application filed by On Track Innovations Ltd filed Critical On Track Innovations Ltd
Priority to BRPI0721672A priority patent/BRPI0721672B1/pt
Priority to ES07827351T priority patent/ES2377220T3/es
Priority to US12/596,893 priority patent/US9038913B2/en
Priority to KR1020097024350A priority patent/KR101285907B1/ko
Priority to EP07827351A priority patent/EP2143046B1/fr
Priority to PL07827351T priority patent/PL2143046T3/pl
Priority to PT07827351T priority patent/PT2143046E/pt
Priority to CN2007800534702A priority patent/CN101689249B/zh
Priority to AT07827351T priority patent/ATE540378T1/de
Priority to PCT/IL2007/001378 priority patent/WO2008129526A2/fr
Priority to TW096142616A priority patent/TWI452523B/zh
Priority to CL200800113A priority patent/CL2008000113A1/es
Priority to CN200880021562.7A priority patent/CN101816066B/zh
Priority to BRPI0811086-7A2A priority patent/BRPI0811086A2/pt
Priority to KR1020097024341A priority patent/KR20100017257A/ko
Priority to PCT/IL2008/000538 priority patent/WO2008129547A2/fr
Priority to TW097114420A priority patent/TWI426836B/zh
Priority to ARP080101717A priority patent/AR066272A1/es
Publication of HK1109708A2 publication Critical patent/HK1109708A2/xx
Priority to US12/742,013 priority patent/US8333004B2/en
Priority to EP08847977A priority patent/EP2212975B1/fr
Priority to RU2010121963/07A priority patent/RU2461105C2/ru
Priority to JP2010532705A priority patent/JP5249341B2/ja
Priority to BRPI0818708-8A priority patent/BRPI0818708B1/pt
Priority to CN2008801152733A priority patent/CN101904060B/zh
Priority to TW097141043A priority patent/TWI457836B/zh
Priority to US13/625,287 priority patent/US8689428B2/en
Priority to US14/694,430 priority patent/US9773201B2/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
HK07104374A 2007-04-17 2007-04-24 Interface card and apparatus and process for the formation thereof HK1109708A2 (en)

Priority Applications (28)

Application Number Priority Date Filing Date Title
HK07104374A HK1109708A2 (en) 2007-04-24 2007-04-24 Interface card and apparatus and process for the formation thereof
PCT/IL2007/001378 WO2008129526A2 (fr) 2007-04-24 2007-11-08 Appareil d'interface électronique et procédé et système de fabrication de celui-ci
KR1020097024350A KR101285907B1 (ko) 2007-04-24 2007-11-08 전자식 인터페이스 장치 및 그 제조 방법과 시스템
ES07827351T ES2377220T3 (es) 2007-04-24 2007-11-08 Tarjeta de chip, procedimiento y sistema para la fabricación de una tarjeta de chip
US12/596,893 US9038913B2 (en) 2007-04-24 2007-11-08 Electronic interface apparatus and method and system for manufacturing same
BRPI0721672A BRPI0721672B1 (pt) 2007-04-24 2007-11-08 aparelho de interface eletrônico e seu método e sistema de fabricação
EP07827351A EP2143046B1 (fr) 2007-04-24 2007-11-08 Carte à puce, procédé et système pour la fabrication d'une carte à puce.
PL07827351T PL2143046T3 (pl) 2007-04-24 2007-11-08 Karta procesorowa, sposób i układ do wytwarzania karty procesorowej
PT07827351T PT2143046E (pt) 2007-04-24 2007-11-08 Instrumento de interface electrónica e método e sistema para o seu fabrico
CN2007800534702A CN101689249B (zh) 2007-04-24 2007-11-08 电子接口装置及其制造方法和系统
AT07827351T ATE540378T1 (de) 2007-04-24 2007-11-08 Chipkarte, verfahren und vorrichtung zur herstellung einer chipkarte
TW096142616A TWI452523B (zh) 2007-04-24 2007-11-09 電子介面裝置及其製造方法與系統
CL200800113A CL2008000113A1 (es) 2007-04-24 2008-01-15 Metodo de fabricacion de una tarjeta de interfaz electronica que comprende definir un par de aperturas en la capa de substrato, asociar una antena con dicha capa tal que extremos opuestos de la antena terminen en dichas aperturas, ubicar un elemento
CN200880021562.7A CN101816066B (zh) 2007-04-24 2008-04-17 制造电子接口卡的方法和系统以及使用该方法和系统制造的卡
PCT/IL2008/000538 WO2008129547A2 (fr) 2007-04-24 2008-04-17 Procédé et système de fabrication d'une carte d'interface électronique et carte fabriquée à l'aide de ceux-ci
BRPI0811086-7A2A BRPI0811086A2 (pt) 2007-04-24 2008-04-17 Método e sistema para fabricação de um cartão de interface eletrônica e um cartão fabricado usando os mesmos
KR1020097024341A KR20100017257A (ko) 2007-04-24 2008-04-17 전자식 인터페이스 카드의 제조 방법 및 시스템과 이를 이용하여 제조된 카드
TW097114420A TWI426836B (zh) 2007-04-24 2008-04-18 用於製造電子介面卡之方法及系統及使用其製造的卡
ARP080101717A AR066272A1 (es) 2007-04-24 2008-04-23 Aparato de interfaz electronica y su metodo y sistema de fabricacion
CN2008801152733A CN101904060B (zh) 2007-04-24 2008-10-23 电子接口装置及其制造方法和制造系统
BRPI0818708-8A BRPI0818708B1 (pt) 2007-04-17 2008-10-23 Aparelho de interface eletrônica e método e sistema para produção do mesmo
US12/742,013 US8333004B2 (en) 2007-04-24 2008-10-23 Electronic interface apparatus and method and system for manufacturing same
EP08847977A EP2212975B1 (fr) 2007-04-24 2008-10-23 Appareil d'interface électronique et procédé et système pour sa fabrication
RU2010121963/07A RU2461105C2 (ru) 2007-04-24 2008-10-23 Устройство с электронным интерфейсом, система и способ его изготовления
JP2010532705A JP5249341B2 (ja) 2007-04-24 2008-10-23 電子インターフェース装置、並びにその製造方法及び製造システム
TW097141043A TWI457836B (zh) 2007-04-24 2008-10-24 電子介面裝置及其製造方法及系統
US13/625,287 US8689428B2 (en) 2007-04-24 2012-09-24 Method and system for manufacturing an electronic interface apparatus
US14/694,430 US9773201B2 (en) 2007-04-24 2015-04-23 Electronic interface apparatus and method and system for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
HK07104374A HK1109708A2 (en) 2007-04-24 2007-04-24 Interface card and apparatus and process for the formation thereof

Publications (1)

Publication Number Publication Date
HK1109708A2 true HK1109708A2 (en) 2008-06-13

Family

ID=41129289

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07104374A HK1109708A2 (en) 2007-04-17 2007-04-24 Interface card and apparatus and process for the formation thereof

Country Status (16)

Country Link
US (4) US9038913B2 (fr)
EP (2) EP2143046B1 (fr)
JP (1) JP5249341B2 (fr)
KR (2) KR101285907B1 (fr)
CN (3) CN101689249B (fr)
AR (1) AR066272A1 (fr)
AT (1) ATE540378T1 (fr)
BR (3) BRPI0721672B1 (fr)
CL (1) CL2008000113A1 (fr)
ES (1) ES2377220T3 (fr)
HK (1) HK1109708A2 (fr)
PL (1) PL2143046T3 (fr)
PT (1) PT2143046E (fr)
RU (1) RU2461105C2 (fr)
TW (3) TWI452523B (fr)
WO (2) WO2008129526A2 (fr)

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HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
PL2256672T3 (pl) * 2008-02-22 2016-11-30 Transponder i postać książki
FR2942561B1 (fr) * 2009-02-20 2011-04-22 Oberthur Technologies Support pour carte a microcircuit, carte a microcircuit comprenant un tel support.
FR2947392B1 (fr) 2009-06-29 2019-05-10 Idemia France Procede de raccordement electrique de deux organes entre eux
US8186603B2 (en) 2009-09-22 2012-05-29 On Track Innovation Ltd. Contactless smart sticker
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
FR2963139B1 (fr) 2010-07-20 2012-09-14 Oberthur Technologies Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102011114635A1 (de) 2011-10-04 2013-04-04 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
CN102426659B (zh) * 2011-11-03 2014-12-10 北京德鑫泉物联网科技股份有限公司 同时具有两种读写模式基体的智能卡及其生产方法
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
FR2986372B1 (fr) * 2012-01-31 2014-02-28 Commissariat Energie Atomique Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage
US9178265B2 (en) 2012-02-09 2015-11-03 Hid Global Gmbh Anti-crack means for wire antenna in transponder
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
CN103632186B (zh) * 2012-08-23 2017-01-25 东莞市锐祥智能卡科技有限公司 双界面卡芯片碰焊及封装的方法及其装置
EP2711874B1 (fr) 2012-09-21 2015-04-15 Oberthur Technologies Support de module de puce et procédé d'incorporation d'un tel support de module de puce dans une carte support de données
WO2014082401A1 (fr) * 2012-11-30 2014-06-05 Xue Yuan Carte à puce bi-interface et procédé de fabrication de celle-ci
HK1193540A2 (en) * 2013-07-26 2014-09-19 Cardmatix Co Ltd A method of manufacturing a smart card
KR101762778B1 (ko) 2014-03-04 2017-07-28 엘지이노텍 주식회사 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치
FR3023419B1 (fr) * 2014-07-01 2016-07-15 Oberthur Technologies Support d'antenne destine a etre integre dans un document electronique
US10318852B2 (en) * 2014-11-10 2019-06-11 Golden Spring Internet Of Things Inc. Smart card simultaneously having two read/write modes and method for producing same
CN107912065B (zh) * 2015-06-23 2020-11-03 立联信控股有限公司 具有至少一个用于无接触地传输信息的接口的智能卡坯件
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US20100293784A1 (en) 2010-11-25
TWI457836B (zh) 2014-10-21
CN101816066A (zh) 2010-08-25
TW200901836A (en) 2009-01-01
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EP2212975A4 (fr) 2011-07-27
RU2010121963A (ru) 2011-12-20
US8689428B2 (en) 2014-04-08
WO2008129547A2 (fr) 2008-10-30
EP2143046B1 (fr) 2012-01-04
CN101816066B (zh) 2014-02-05
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US20150227830A1 (en) 2015-08-13
BRPI0818708A2 (pt) 2015-04-22
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TWI426836B (zh) 2014-02-11
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JP2011503708A (ja) 2011-01-27
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US20130014382A1 (en) 2013-01-17
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