HK1109420A1 - Transparent polyamide molding compositions - Google Patents

Transparent polyamide molding compositions

Info

Publication number
HK1109420A1
HK1109420A1 HK08103571.3A HK08103571A HK1109420A1 HK 1109420 A1 HK1109420 A1 HK 1109420A1 HK 08103571 A HK08103571 A HK 08103571A HK 1109420 A1 HK1109420 A1 HK 1109420A1
Authority
HK
Hong Kong
Prior art keywords
transparent
polyamide
injection
extruder
pigments
Prior art date
Application number
HK08103571.3A
Other languages
English (en)
Inventor
Friedrich Severin Buhler
Nikolai Lamberts
Ralph Hala
Botho Hoffmann
Original Assignee
Ems Chemie Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ems Chemie Ag filed Critical Ems Chemie Ag
Publication of HK1109420A1 publication Critical patent/HK1109420A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • C08L33/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
HK08103571.3A 2006-04-21 2008-03-31 Transparent polyamide molding compositions HK1109420A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06112935A EP1847569B1 (de) 2006-04-21 2006-04-21 Transparente Polyamid-Formmassen

Publications (1)

Publication Number Publication Date
HK1109420A1 true HK1109420A1 (en) 2008-06-06

Family

ID=36406629

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08103571.3A HK1109420A1 (en) 2006-04-21 2008-03-31 Transparent polyamide molding compositions

Country Status (8)

Country Link
US (1) US20070249789A1 (xx)
EP (1) EP1847569B1 (xx)
JP (1) JP5682900B2 (xx)
KR (1) KR101413047B1 (xx)
CN (1) CN101058670B (xx)
AT (1) ATE454429T1 (xx)
DE (1) DE502006005838D1 (xx)
HK (1) HK1109420A1 (xx)

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JP4681073B2 (ja) * 2007-12-28 2011-05-11 住友電工ファインポリマー株式会社 光学レンズ
DE102008016436A1 (de) 2008-03-31 2009-10-01 Ems-Patent Ag Polyamidformmasse für lackfreie, zähe Gehäuse mit Hochglanz-Oberfläche
WO2009146742A1 (en) * 2008-06-04 2009-12-10 Ems-Patent Ag Sealing strips for vehicle windows
WO2009156323A2 (de) * 2008-06-26 2009-12-30 Ems-Patent Ag Polyamidformmassen, enthaltend teilkristalline, transparente copolyamide, zur herstellung von transparenten formteilen mit hoher flexibilität, hoher kerbschlagzähigkeit, niedriger wasseraufnahme und ausgezeichneter chemikalienbeständigkeit
JP2010037475A (ja) * 2008-08-07 2010-02-18 Sumitomo Electric Fine Polymer Inc 透明樹脂成形体及び光学レンズ
FR2940296B1 (fr) * 2008-12-19 2011-03-18 Rhodia Poliamida E Especialidades Ltda Procede de preparation de polymere thermoplastique lubrifie
DE102009011165A1 (de) * 2009-03-04 2010-09-09 Tesa Se Haftklebemasse
JP5351127B2 (ja) * 2009-12-07 2013-11-27 ダウ・ヨーロッパ・ゲーエムベーハー 架橋性ラテックス
FR2957603B1 (fr) * 2010-03-22 2013-05-03 Rhodia Poliamida E Especialidades Ltda Utilisation de polyamide pour la preparation d'articles moules par injection et articles moules ainsi obtenus
CN102372922B (zh) * 2010-08-18 2014-09-10 上海杰事杰新材料(集团)股份有限公司 一种聚酯酰胺多嵌段共聚物及其制备方法
FR2969525A1 (fr) * 2010-12-27 2012-06-29 Arkema France Composite bois/polymere a stabilite thermique amelioree
EP2949704B1 (de) * 2012-12-21 2019-04-24 Ems-Patent Ag Anfärberesistente artikel und ihre verwendung
KR101557543B1 (ko) * 2012-12-28 2015-10-06 제일모직주식회사 폴리아미드 수지, 이의 제조방법 및 이를 포함하는 성형품
CN103910877B (zh) * 2012-12-31 2016-05-25 中国科学院化学研究所 一种透明聚酰胺及其制备方法
CN103122065B (zh) * 2013-02-05 2015-01-21 中北大学 透明聚酰胺-聚酰胺11共聚物的制备方法
FR3027908B1 (fr) 2014-11-04 2018-05-11 Arkema France Composition a base de polyamide transparent et resistance aux impacts
CN105984186A (zh) * 2015-03-04 2016-10-05 赢创特种化学（上海）有限公司 纤维增强的聚酰胺复合材料结构件及其制备方法
CN105482102B (zh) * 2015-12-07 2017-09-19 中北大学 半芳香族透明聚酰胺及其合成方法
FR3051475B1 (fr) 2016-05-17 2020-02-21 Arkema France Composition transparente resistante aux chocs
EP3281983B1 (de) * 2016-08-12 2022-06-15 Evonik Operations GmbH Zähe polyamidformmasse
EP3444113B1 (de) * 2017-08-18 2021-01-20 Ems-Chemie Ag Verstärkte polyamid-formmassen mit geringem haze und formkörper daraus
EP3444112B1 (de) * 2017-08-18 2020-12-23 Ems-Chemie Ag Verstärkte polyamid-formmassen mit geringem haze und formkörper daraus
EP3444114B1 (de) * 2017-08-18 2023-10-25 Ems-Chemie Ag Verstärkte polyamid-formmassen mit geringem haze und formkörper daraus
TWI821234B (zh) 2018-01-09 2023-11-11 美商康寧公司 具光改變特徵之塗覆製品及用於製造彼等之方法
CN109082114A (zh) * 2018-07-23 2018-12-25 芜湖金光汽车配件有限责任公司 一种汽车尼龙塑料件加工工艺
JP7088499B2 (ja) 2019-02-01 2022-06-21 エルジー・ケム・リミテッド ポリアミド樹脂フィルムおよびそれを用いた樹脂積層体
CN112662174B (zh) * 2019-10-16 2023-06-13 上海凯赛生物技术股份有限公司 包括聚酯酰胺和聚酰胺的组合物、其制备方法及其制品纤维
US20220011478A1 (en) 2020-07-09 2022-01-13 Corning Incorporated Textured region of a substrate to reduce specular reflectance incorporating surface features with an elliptical perimeter or segments thereof, and method of making the same
CN112480662A (zh) * 2020-11-23 2021-03-12 山东广垠新材料有限公司 可吸收红外线透明尼龙及其制备方法
CN112592586B (zh) * 2020-12-14 2022-11-22 上海长伟锦磁工程塑料有限公司 一种高亮黑耐刮擦的免喷涂尼龙材料及其制备方法
KR20220113600A (ko) * 2021-02-05 2022-08-16 삼성전자주식회사 하우징을 포함하는 전자 장치 및 하우징의 제조 방법
CN113549319B (zh) * 2021-07-01 2023-05-26 万华化学(四川)有限公司 一种透明增韧尼龙12合金材料及其制备方法

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US4579914A (en) * 1985-03-18 1986-04-01 The Dow Chemical Company Blends of polyesteramides and polyamides
DE4119301A1 (de) * 1991-06-12 1992-12-17 Huels Chemische Werke Ag Formmassen auf basis aromatischer polyamide
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DE4327024A1 (de) * 1993-08-12 1995-02-16 Bayer Ag Thermoplastisch verarbeitbare und biologisch abbaubare aliphatische Polyesteramide
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EP0922731A1 (de) * 1997-12-11 1999-06-16 Wolff Walsrode Aktiengesellschaft Mischungen aus Polyamid mit Polyesteramiden
DE19820661C2 (de) * 1998-05-08 2002-10-24 Inventa Ag Weichmacherfreies Polyamid und Formmasse und dessen Verwendung
FR2820141B1 (fr) * 2001-01-26 2003-03-21 Atofina Composition transparente a base de polyamide
EP1227131B1 (fr) * 2001-01-26 2006-03-15 Arkema Composition transparente à base de polyamide
DE10122188B4 (de) * 2001-05-08 2007-04-12 Ems-Chemie Ag Polyamidformmassen zur Herstellung optischer Linsen
DE10224947B4 (de) * 2002-06-05 2006-07-06 Ems Chemie Ag Transparente Polyamid-Formmassen mit verbesserter Transparenz, Chemikalienbeständigkeit und dynamischer Belastbarkeit
DE10308226A1 (de) * 2003-02-25 2004-09-23 Degussa Ag Transparente Formmasse für optische Anwendungen

Also Published As

Publication number Publication date
EP1847569A1 (de) 2007-10-24
JP5682900B2 (ja) 2015-03-11
CN101058670A (zh) 2007-10-24
KR101413047B1 (ko) 2014-06-30
KR20070104246A (ko) 2007-10-25
DE502006005838D1 (de) 2010-02-25
CN101058670B (zh) 2011-12-21
JP2007327049A (ja) 2007-12-20
US20070249789A1 (en) 2007-10-25
EP1847569B1 (de) 2010-01-06
ATE454429T1 (de) 2010-01-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210417