HK1099925A1 - Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel - Google Patents

Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel

Info

Publication number
HK1099925A1
HK1099925A1 HK07107510.9A HK07107510A HK1099925A1 HK 1099925 A1 HK1099925 A1 HK 1099925A1 HK 07107510 A HK07107510 A HK 07107510A HK 1099925 A1 HK1099925 A1 HK 1099925A1
Authority
HK
Hong Kong
Prior art keywords
cutter wheel
material substrate
manufacturing
fragile material
scribing
Prior art date
Application number
HK07107510.9A
Other languages
English (en)
Inventor
Kazuya Maekawa
Ryota Sakaguchi
Yoshitaka Miura
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34824510&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1099925(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of HK1099925A1 publication Critical patent/HK1099925A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
HK07107510.9A 2004-02-02 2007-07-13 Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel HK1099925A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004059772 2004-02-02
PCT/JP2005/001428 WO2005072926A1 (fr) 2004-02-02 2005-02-01 Molette coupante, procédé de traçage et procédé de coupe pour des substrats en matériau fragile utilisant la molette coupante et procédé de fabrication de la molette coupante

Publications (1)

Publication Number Publication Date
HK1099925A1 true HK1099925A1 (en) 2007-08-31

Family

ID=34824510

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07107510.9A HK1099925A1 (en) 2004-02-02 2007-07-13 Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel

Country Status (8)

Country Link
EP (2) EP2851172A1 (fr)
JP (4) JP5022602B2 (fr)
KR (7) KR20120068976A (fr)
CN (4) CN1914014B (fr)
HK (1) HK1099925A1 (fr)
SG (1) SG149824A1 (fr)
TW (5) TWI435853B (fr)
WO (1) WO2005072926A1 (fr)

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KR20120068976A (ko) 2004-02-02 2012-06-27 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 방법 및 절단방법
TWI409231B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd Method for manufacturing scratches for brittle materials
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101228959B1 (ko) * 2008-05-30 2013-02-01 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 모따기 방법
US20110132954A1 (en) * 2008-06-05 2011-06-09 Maoko Tomei Scribing wheel and method for scribing brittle material substrate
CN101745990A (zh) * 2008-12-01 2010-06-23 孙春雨 一种切割脆性材料的刀轮及其加工方法
TWI477375B (zh) * 2009-05-08 2015-03-21 Sun Chun Yu Cutting wheel of brittle material and its processing method
JP5438422B2 (ja) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法並びに加工装置
CN102050568B (zh) * 2009-10-29 2013-02-13 孙春雨 一种切割玻璃材料的刀轮及其加工方法
JP5174112B2 (ja) * 2010-09-28 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール
JP5365602B2 (ja) * 2010-10-08 2013-12-11 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP5174118B2 (ja) * 2010-10-08 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP5156080B2 (ja) 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP5966564B2 (ja) * 2011-06-08 2016-08-10 三星ダイヤモンド工業株式会社 スクライビングホイール及びスクライブ方法
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
TWI474983B (zh) * 2011-10-04 2015-03-01 Mitsuboshi Diamond Ind Co Ltd Scoring Method and Breaking Method of Mother Substrate
JP5867159B2 (ja) * 2012-02-27 2016-02-24 三星ダイヤモンド工業株式会社 セラミックス基板の割断方法
JP5998574B2 (ja) * 2012-03-29 2016-09-28 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
CN104136182B (zh) * 2012-03-08 2016-09-07 三星钻石工业股份有限公司 划线轮及其制造方法
JP2013184388A (ja) * 2012-03-08 2013-09-19 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
JP2013233793A (ja) * 2012-04-13 2013-11-21 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
WO2014017878A2 (fr) * 2012-07-27 2014-01-30 이화다이아몬드공업 주식회사 Roue d'écriture ayant une rainure à structure fine
CN103864452B (zh) 2012-12-10 2015-10-21 富泰华精密电子(郑州)有限公司 面板及其制造方法
JP5499150B2 (ja) * 2012-12-21 2014-05-21 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
KR101641652B1 (ko) 2013-02-12 2016-07-21 포리프라스틱 가부시키가이샤 홈붙이 수지 성형품
JP2015143174A (ja) * 2013-12-27 2015-08-06 AvanStrate株式会社 ガラス板の製造方法、シートガラスのスクライブ装置、及びガラス板の製造装置
JP5884852B2 (ja) * 2014-04-18 2016-03-15 坂東機工株式会社 炭化珪素板のスクライブ方法及びスクライブ装置
JP2016007739A (ja) * 2014-06-24 2016-01-18 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
CN106660853B (zh) * 2014-08-04 2019-05-14 Agc 株式会社 无碱玻璃板的切割方法、显示面板的切割方法、无碱玻璃板的制造方法、以及显示面板的制造方法
CN104609717B (zh) * 2014-12-08 2016-09-07 福州大学 一种手工切割玻璃瓶的简易方法
KR101667229B1 (ko) 2015-05-19 2016-10-28 주식회사 비츠로테크 전원절환개폐기의 구동부 구조
JP6234418B2 (ja) * 2015-10-28 2017-11-22 三星ダイヤモンド工業株式会社 スクライビングホイール
JP2016106046A (ja) * 2015-12-28 2016-06-16 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6234534B2 (ja) * 2016-10-31 2017-11-22 三星ダイヤモンド工業株式会社 スクライビングホイール
JP2018086785A (ja) * 2016-11-29 2018-06-07 三星ダイヤモンド工業株式会社 スクライビングホイール及びそのスクライブ方法
JP6255467B2 (ja) * 2016-11-30 2017-12-27 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
KR20180071649A (ko) * 2016-12-20 2018-06-28 현대자동차주식회사 연성 평면 케이블, 이를 포함하는 차량 및 연성 평면 케이블의 제조방법
JP6897951B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
JP6869527B2 (ja) * 2016-12-28 2021-05-12 三星ダイヤモンド工業株式会社 スクライビングホイール
JP6897950B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
CN107672065B (zh) * 2017-10-10 2019-04-05 新昌县群娇农业发展有限公司 硅片的裂片装置
CN110526563A (zh) * 2019-09-09 2019-12-03 东莞通华液晶有限公司 一种薄型液晶玻璃基板的切割裂片方法
JP2022038435A (ja) * 2020-08-26 2022-03-10 ファインテック株式会社 脆性材料基板用のスクライビングホイール及びその製造方法
CN113075908B (zh) * 2021-03-23 2022-04-19 王豪 数控雕铣加工宝玉石工艺品的方法

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Also Published As

Publication number Publication date
KR101267832B1 (ko) 2013-05-27
JP5022602B2 (ja) 2012-09-12
EP1712339A4 (fr) 2010-03-24
TW201206853A (en) 2012-02-16
KR20120108060A (ko) 2012-10-04
JP2013199131A (ja) 2013-10-03
EP1712339A1 (fr) 2006-10-18
KR20120121922A (ko) 2012-11-06
CN102161219A (zh) 2011-08-24
TW201425247A (zh) 2014-07-01
CN101774754B (zh) 2015-11-25
TW200536796A (en) 2005-11-16
CN101774754A (zh) 2010-07-14
KR20100028659A (ko) 2010-03-12
TWI440613B (zh) 2014-06-11
SG149824A1 (en) 2009-02-27
KR20120068975A (ko) 2012-06-27
JP5452547B2 (ja) 2014-03-26
KR20110074940A (ko) 2011-07-04
TWI435852B (zh) 2014-05-01
KR20060122926A (ko) 2006-11-30
KR101213020B1 (ko) 2012-12-18
KR101203903B1 (ko) 2012-11-23
TW201144244A (en) 2011-12-16
KR101213018B1 (ko) 2012-12-18
CN1914014B (zh) 2011-04-06
JP5185412B2 (ja) 2013-04-17
CN1914014A (zh) 2007-02-14
JPWO2005072926A1 (ja) 2007-09-13
JP5695134B2 (ja) 2015-04-01
KR101185753B1 (ko) 2012-09-26
KR20120068976A (ko) 2012-06-27
WO2005072926A1 (fr) 2005-08-11
CN102161218A (zh) 2011-08-24
JP2011213589A (ja) 2011-10-27
TWI466838B (zh) 2015-01-01
EP2851172A1 (fr) 2015-03-25
CN102161218B (zh) 2015-03-25
TWI435853B (zh) 2014-05-01
TWI532694B (zh) 2016-05-11
TW201141800A (en) 2011-12-01
JP2011207760A (ja) 2011-10-20

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210201