HK1099925A1 - Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel - Google Patents
Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheelInfo
- Publication number
- HK1099925A1 HK1099925A1 HK07107510.9A HK07107510A HK1099925A1 HK 1099925 A1 HK1099925 A1 HK 1099925A1 HK 07107510 A HK07107510 A HK 07107510A HK 1099925 A1 HK1099925 A1 HK 1099925A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- cutter wheel
- material substrate
- manufacturing
- fragile material
- scribing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004059772 | 2004-02-02 | ||
PCT/JP2005/001428 WO2005072926A1 (fr) | 2004-02-02 | 2005-02-01 | Molette coupante, procédé de traçage et procédé de coupe pour des substrats en matériau fragile utilisant la molette coupante et procédé de fabrication de la molette coupante |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1099925A1 true HK1099925A1 (en) | 2007-08-31 |
Family
ID=34824510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK07107510.9A HK1099925A1 (en) | 2004-02-02 | 2007-07-13 | Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel |
Country Status (8)
Country | Link |
---|---|
EP (2) | EP2851172A1 (fr) |
JP (4) | JP5022602B2 (fr) |
KR (7) | KR20120068976A (fr) |
CN (4) | CN1914014B (fr) |
HK (1) | HK1099925A1 (fr) |
SG (1) | SG149824A1 (fr) |
TW (5) | TWI435853B (fr) |
WO (1) | WO2005072926A1 (fr) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120068976A (ko) | 2004-02-02 | 2012-06-27 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이브 방법 및 절단방법 |
TWI409231B (zh) * | 2005-07-06 | 2013-09-21 | Mitsuboshi Diamond Ind Co Ltd | Method for manufacturing scratches for brittle materials |
JP5139852B2 (ja) * | 2008-03-17 | 2013-02-06 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
KR101228959B1 (ko) * | 2008-05-30 | 2013-02-01 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 모따기 방법 |
US20110132954A1 (en) * | 2008-06-05 | 2011-06-09 | Maoko Tomei | Scribing wheel and method for scribing brittle material substrate |
CN101745990A (zh) * | 2008-12-01 | 2010-06-23 | 孙春雨 | 一种切割脆性材料的刀轮及其加工方法 |
TWI477375B (zh) * | 2009-05-08 | 2015-03-21 | Sun Chun Yu | Cutting wheel of brittle material and its processing method |
JP5438422B2 (ja) * | 2009-07-31 | 2014-03-12 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法並びに加工装置 |
CN102050568B (zh) * | 2009-10-29 | 2013-02-13 | 孙春雨 | 一种切割玻璃材料的刀轮及其加工方法 |
JP5174112B2 (ja) * | 2010-09-28 | 2013-04-03 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
JP5365602B2 (ja) * | 2010-10-08 | 2013-12-11 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
JP5174118B2 (ja) * | 2010-10-08 | 2013-04-03 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
JP5156080B2 (ja) | 2010-11-05 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | 貼り合せ基板のスクライブ方法 |
JP5244202B2 (ja) * | 2011-01-27 | 2013-07-24 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
JP5966564B2 (ja) * | 2011-06-08 | 2016-08-10 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びスクライブ方法 |
JP5479424B2 (ja) * | 2011-09-30 | 2014-04-23 | 三星ダイヤモンド工業株式会社 | 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具 |
JP2013079170A (ja) * | 2011-10-04 | 2013-05-02 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ方法 |
TWI474983B (zh) * | 2011-10-04 | 2015-03-01 | Mitsuboshi Diamond Ind Co Ltd | Scoring Method and Breaking Method of Mother Substrate |
JP5867159B2 (ja) * | 2012-02-27 | 2016-02-24 | 三星ダイヤモンド工業株式会社 | セラミックス基板の割断方法 |
JP5998574B2 (ja) * | 2012-03-29 | 2016-09-28 | 三星ダイヤモンド工業株式会社 | スクライビングホイールの製造方法 |
CN104136182B (zh) * | 2012-03-08 | 2016-09-07 | 三星钻石工业股份有限公司 | 划线轮及其制造方法 |
JP2013184388A (ja) * | 2012-03-08 | 2013-09-19 | Mitsuboshi Diamond Industrial Co Ltd | スクライビングホイール及びその製造方法 |
JP2013233793A (ja) * | 2012-04-13 | 2013-11-21 | Mitsuboshi Diamond Industrial Co Ltd | スクライビングホイール及びその製造方法 |
WO2014017878A2 (fr) * | 2012-07-27 | 2014-01-30 | 이화다이아몬드공업 주식회사 | Roue d'écriture ayant une rainure à structure fine |
CN103864452B (zh) | 2012-12-10 | 2015-10-21 | 富泰华精密电子(郑州)有限公司 | 面板及其制造方法 |
JP5499150B2 (ja) * | 2012-12-21 | 2014-05-21 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
KR101641652B1 (ko) | 2013-02-12 | 2016-07-21 | 포리프라스틱 가부시키가이샤 | 홈붙이 수지 성형품 |
JP2015143174A (ja) * | 2013-12-27 | 2015-08-06 | AvanStrate株式会社 | ガラス板の製造方法、シートガラスのスクライブ装置、及びガラス板の製造装置 |
JP5884852B2 (ja) * | 2014-04-18 | 2016-03-15 | 坂東機工株式会社 | 炭化珪素板のスクライブ方法及びスクライブ装置 |
JP2016007739A (ja) * | 2014-06-24 | 2016-01-18 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
CN106660853B (zh) * | 2014-08-04 | 2019-05-14 | Agc 株式会社 | 无碱玻璃板的切割方法、显示面板的切割方法、无碱玻璃板的制造方法、以及显示面板的制造方法 |
CN104609717B (zh) * | 2014-12-08 | 2016-09-07 | 福州大学 | 一种手工切割玻璃瓶的简易方法 |
KR101667229B1 (ko) | 2015-05-19 | 2016-10-28 | 주식회사 비츠로테크 | 전원절환개폐기의 구동부 구조 |
JP6234418B2 (ja) * | 2015-10-28 | 2017-11-22 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
JP2016106046A (ja) * | 2015-12-28 | 2016-06-16 | 三星ダイヤモンド工業株式会社 | スクライビングホイールの製造方法 |
TW202039193A (zh) * | 2016-02-26 | 2020-11-01 | 日商三星鑽石工業股份有限公司 | 脆性基板之分斷方法 |
JP6234534B2 (ja) * | 2016-10-31 | 2017-11-22 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
JP2018086785A (ja) * | 2016-11-29 | 2018-06-07 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びそのスクライブ方法 |
JP6255467B2 (ja) * | 2016-11-30 | 2017-12-27 | 三星ダイヤモンド工業株式会社 | スクライビングホイールの製造方法 |
KR20180071649A (ko) * | 2016-12-20 | 2018-06-28 | 현대자동차주식회사 | 연성 평면 케이블, 이를 포함하는 차량 및 연성 평면 케이블의 제조방법 |
JP6897951B2 (ja) * | 2016-12-28 | 2021-07-07 | 三星ダイヤモンド工業株式会社 | カッターホイール |
JP6869527B2 (ja) * | 2016-12-28 | 2021-05-12 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
JP6897950B2 (ja) * | 2016-12-28 | 2021-07-07 | 三星ダイヤモンド工業株式会社 | カッターホイール |
CN107672065B (zh) * | 2017-10-10 | 2019-04-05 | 新昌县群娇农业发展有限公司 | 硅片的裂片装置 |
CN110526563A (zh) * | 2019-09-09 | 2019-12-03 | 东莞通华液晶有限公司 | 一种薄型液晶玻璃基板的切割裂片方法 |
JP2022038435A (ja) * | 2020-08-26 | 2022-03-10 | ファインテック株式会社 | 脆性材料基板用のスクライビングホイール及びその製造方法 |
CN113075908B (zh) * | 2021-03-23 | 2022-04-19 | 王豪 | 数控雕铣加工宝玉石工艺品的方法 |
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JPS53143622A (en) | 1977-05-23 | 1978-12-14 | Hitachi Ltd | Cutting blade for glass material |
JPS62158129A (ja) * | 1985-12-27 | 1987-07-14 | Kyocera Corp | ガラス切断用ホイ−ルカツタ |
JPH04224128A (ja) * | 1990-12-20 | 1992-08-13 | Idemitsu Petrochem Co Ltd | ガラス切断用刃 |
JPH081486A (ja) | 1994-06-15 | 1996-01-09 | Taihei Mach Works Ltd | 刃物の研削方法および装置 |
TW308581B (fr) * | 1995-11-06 | 1997-06-21 | Mitsuboshi Diamond Kogyo Kk | |
JP3074143B2 (ja) * | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | ガラスカッターホイール |
JPH09239647A (ja) * | 1996-03-06 | 1997-09-16 | Toyo Hamono Kk | 長尺刃物の刃先仕上装置 |
JPH11116260A (ja) | 1997-10-08 | 1999-04-27 | Mitsuboshi Diamond Kogyo Kk | ガラス加工装置 |
JP3055262U (ja) * | 1998-06-24 | 1999-01-12 | トーヨー産業株式会社 | カッターホイール |
JP3759317B2 (ja) * | 1998-08-04 | 2006-03-22 | トーヨー産業株式会社 | ガラス切断専用のカッターホイール |
JP2989602B1 (ja) * | 1999-01-28 | 1999-12-13 | 三星ダイヤモンド工業株式会社 | ガラスカッタホィ―ル |
TW544442B (en) * | 2000-08-11 | 2003-08-01 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel for brittle material substrate and scriber |
KR100554630B1 (ko) * | 2001-04-02 | 2006-02-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 커터 휠 및 그 커터 휠을 이용한 스크라이브 장치,스크라이브 방법, 접합기판의 절단방법 및 커터 휠을제조하는 커터 휠 제조방법과 제조장치 |
JP3085312U (ja) * | 2001-10-11 | 2002-04-26 | トーヨー産業株式会社 | カッターホイール |
KR100506874B1 (ko) * | 2003-03-17 | 2005-08-05 | 신한다이아몬드공업 주식회사 | 피시디 탬프 커터 및 그 제조방법 |
JP2005001941A (ja) * | 2003-06-12 | 2005-01-06 | Thk Co Ltd | ダイヤモンドホイール及びスクライブ装置 |
KR20120068976A (ko) | 2004-02-02 | 2012-06-27 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이브 방법 및 절단방법 |
-
2005
- 2005-02-01 KR KR1020127012334A patent/KR20120068976A/ko active Search and Examination
- 2005-02-01 CN CN2005800039034A patent/CN1914014B/zh active Active
- 2005-02-01 EP EP14174678.4A patent/EP2851172A1/fr not_active Ceased
- 2005-02-01 EP EP05709574A patent/EP1712339A4/fr not_active Ceased
- 2005-02-01 WO PCT/JP2005/001428 patent/WO2005072926A1/fr active Application Filing
- 2005-02-01 KR KR1020117012050A patent/KR101185753B1/ko not_active IP Right Cessation
- 2005-02-01 KR KR1020107002269A patent/KR101213020B1/ko not_active IP Right Cessation
- 2005-02-01 CN CN200910173800.2A patent/CN101774754B/zh not_active Expired - Fee Related
- 2005-02-01 KR KR1020067016285A patent/KR101203903B1/ko active IP Right Grant
- 2005-02-01 CN CN2011100260289A patent/CN102161219A/zh active Pending
- 2005-02-01 KR KR1020127012333A patent/KR20120068975A/ko active Search and Examination
- 2005-02-01 JP JP2005517561A patent/JP5022602B2/ja active Active
- 2005-02-01 CN CN201110026013.2A patent/CN102161218B/zh not_active Expired - Fee Related
- 2005-02-01 KR KR1020127023839A patent/KR101213018B1/ko active IP Right Grant
- 2005-02-01 KR KR1020127025242A patent/KR101267832B1/ko active IP Right Grant
- 2005-02-01 SG SG200900203-1A patent/SG149824A1/en unknown
- 2005-02-02 TW TW100124016A patent/TWI435853B/zh active
- 2005-02-02 TW TW100124015A patent/TWI435852B/zh not_active IP Right Cessation
- 2005-02-02 TW TW103111680A patent/TWI466838B/zh active
- 2005-02-02 TW TW100124017A patent/TWI532694B/zh not_active IP Right Cessation
- 2005-02-02 TW TW094103144A patent/TWI440613B/zh active
-
2007
- 2007-07-13 HK HK07107510.9A patent/HK1099925A1/xx not_active IP Right Cessation
-
2011
- 2011-05-31 JP JP2011121291A patent/JP5185412B2/ja not_active Expired - Fee Related
- 2011-05-31 JP JP2011121292A patent/JP5452547B2/ja active Active
-
2013
- 2013-06-27 JP JP2013134545A patent/JP5695134B2/ja not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20210201 |