HK1090097A1 - Electroless gold plating solution - Google Patents

Electroless gold plating solution

Info

Publication number
HK1090097A1
HK1090097A1 HK06110515.9A HK06110515A HK1090097A1 HK 1090097 A1 HK1090097 A1 HK 1090097A1 HK 06110515 A HK06110515 A HK 06110515A HK 1090097 A1 HK1090097 A1 HK 1090097A1
Authority
HK
Hong Kong
Prior art keywords
plating solution
gold plating
electroless gold
electroless
solution
Prior art date
Application number
HK06110515.9A
Other languages
English (en)
Inventor
Akihiro Aiba
Yoshiyuki Hisumi
Kazumi Kawamura
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1090097A1 publication Critical patent/HK1090097A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
HK06110515.9A 2003-06-05 2006-09-21 Electroless gold plating solution HK1090097A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003160974 2003-06-05
PCT/JP2004/001784 WO2004108987A1 (ja) 2003-06-05 2004-02-18 無電解金めっき液

Publications (1)

Publication Number Publication Date
HK1090097A1 true HK1090097A1 (en) 2006-12-15

Family

ID=33508589

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06110515.9A HK1090097A1 (en) 2003-06-05 2006-09-21 Electroless gold plating solution

Country Status (8)

Country Link
US (1) US7419536B2 (ko)
EP (1) EP1645658A4 (ko)
JP (1) JP4299300B2 (ko)
KR (1) KR100735259B1 (ko)
CN (1) CN100549228C (ko)
HK (1) HK1090097A1 (ko)
TW (1) TWI267564B (ko)
WO (1) WO2004108987A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006006367A1 (ja) * 2004-07-09 2006-01-19 Nippon Mining & Mrtals Co., Ltd. 無電解金めっき液
US7396394B2 (en) * 2004-11-15 2008-07-08 Nippon Mining & Metals Co., Ltd. Electroless gold plating solution
JP4941650B2 (ja) * 2007-01-11 2012-05-30 上村工業株式会社 無電解金めっき浴のめっき能維持管理方法
CN101845625B (zh) * 2010-06-01 2012-03-21 无锡阿尔法电子科技有限公司 一种在电容式触摸屏表面进行化学镀金的方法
CN103540973A (zh) * 2013-09-24 2014-01-29 沈阳建筑大学 一种用于芯片和线路板热沉的电镀金液及使用方法
CN108220934A (zh) * 2018-01-22 2018-06-29 昆山成功环保科技有限公司 一种无氰化学浸金溶液
JP7135384B2 (ja) * 2018-03-30 2022-09-13 住友大阪セメント株式会社 光導波路素子
CN112695306A (zh) * 2020-12-16 2021-04-23 昆山成功环保科技有限公司 应用在印制线路板领域的无毒环保的化学沉金溶液

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300328A (en) * 1963-11-12 1967-01-24 Clevite Corp Electroless plating of gold
DE2803147C2 (de) * 1978-01-25 1984-03-08 W.C. Heraeus Gmbh, 6450 Hanau Tauchgoldbad
CN1003524B (zh) * 1985-10-14 1989-03-08 株式会社日立制作所 无电浸镀金溶液
JP3030113B2 (ja) 1991-04-12 2000-04-10 エヌ・イーケムキャット株式会社 置換無電解金めつき液
US5232492A (en) * 1992-01-23 1993-08-03 Applied Electroless Concepts Inc. Electroless gold plating composition
WO1994012686A1 (en) * 1992-11-25 1994-06-09 Kanto Kagaku Kabushiki Kaisha Electroless gold plating bath
JPH08291389A (ja) 1995-04-18 1996-11-05 Hitachi Chem Co Ltd 非シアン置換金めっき液及びこの液を用いた金めっき方法
JP3532046B2 (ja) 1996-10-25 2004-05-31 株式会社大和化成研究所 非シアン置換銀めっき浴
JP3566498B2 (ja) 1997-05-14 2004-09-15 株式会社大和化成研究所 置換金めっき浴
US5935306A (en) * 1998-02-10 1999-08-10 Technic Inc. Electroless gold plating bath
GB9822822D0 (en) * 1998-10-19 1998-12-16 Dyno Particles As Particles
JP3876634B2 (ja) * 2001-03-14 2007-02-07 トヨタ自動車株式会社 合金触媒と排気ガス浄化用触媒の製造方法
JP3482402B2 (ja) 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
WO2006006367A1 (ja) * 2004-07-09 2006-01-19 Nippon Mining & Mrtals Co., Ltd. 無電解金めっき液

Also Published As

Publication number Publication date
US20060230979A1 (en) 2006-10-19
US7419536B2 (en) 2008-09-02
EP1645658A4 (en) 2011-08-03
JPWO2004108987A1 (ja) 2006-07-20
TWI267564B (en) 2006-12-01
JP4299300B2 (ja) 2009-07-22
KR20060026035A (ko) 2006-03-22
CN100549228C (zh) 2009-10-14
KR100735259B1 (ko) 2007-07-03
CN1802451A (zh) 2006-07-12
EP1645658A1 (en) 2006-04-12
WO2004108987A1 (ja) 2004-12-16
TW200427865A (en) 2004-12-16

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20240217