HK1080554A1 - Radiation curable resin composition and rapid prototyping process using the same - Google Patents
Radiation curable resin composition and rapid prototyping process using the sameInfo
- Publication number
- HK1080554A1 HK1080554A1 HK06100453.4A HK06100453A HK1080554A1 HK 1080554 A1 HK1080554 A1 HK 1080554A1 HK 06100453 A HK06100453 A HK 06100453A HK 1080554 A1 HK1080554 A1 HK 1080554A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- resin composition
- same
- curable resin
- radiation curable
- rapid prototyping
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37723902P | 2002-05-03 | 2002-05-03 | |
PCT/NL2003/000320 WO2003093901A1 (fr) | 2002-05-03 | 2003-05-01 | Composition de resine durcissable par irradiation et procede de prototypage rapide faisant appel a celle-ci |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1080554A1 true HK1080554A1 (en) | 2006-04-28 |
Family
ID=29401462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06100453.4A HK1080554A1 (en) | 2002-05-03 | 2006-01-11 | Radiation curable resin composition and rapid prototyping process using the same |
Country Status (9)
Country | Link |
---|---|
US (3) | US7183040B2 (fr) |
EP (2) | EP2466378B1 (fr) |
JP (2) | JP2005529200A (fr) |
KR (3) | KR20120086737A (fr) |
CN (2) | CN100576069C (fr) |
AU (1) | AU2003224516A1 (fr) |
ES (1) | ES2405107T3 (fr) |
HK (1) | HK1080554A1 (fr) |
WO (1) | WO2003093901A1 (fr) |
Families Citing this family (59)
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GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
US20040077745A1 (en) * | 2002-10-18 | 2004-04-22 | Jigeng Xu | Curable compositions and rapid prototyping process using the same |
US20040137368A1 (en) * | 2003-01-13 | 2004-07-15 | 3D Systems, Inc. | Stereolithographic resins containing selected oxetane compounds |
US20050040564A1 (en) * | 2003-08-18 | 2005-02-24 | Jones Oliver | Systems and methods for using norbornene based curable materials |
EP1661690A4 (fr) * | 2003-08-27 | 2009-08-12 | Fujifilm Corp | Procede de production d'un modele tridimensionnel |
US7232850B2 (en) * | 2003-10-03 | 2007-06-19 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
US20070149667A1 (en) * | 2003-10-16 | 2007-06-28 | Dsm Ip Assets B.V. | Curable compositions and rapid prototyping process using the same |
WO2005045525A1 (fr) * | 2003-11-06 | 2005-05-19 | Dsm Ip Assets B.V. | Compositions durcissables et procede de prototypage faisant intervenir celles-ci |
WO2005054330A1 (fr) * | 2003-12-02 | 2005-06-16 | Dsm Ip Assets B.V. | Compositions ignifuges durcissables par exposition a un rayonnement |
US20070267134A1 (en) * | 2004-09-03 | 2007-11-22 | Konarski Mark M | Photoinitiated Cationic Epoxy Compositions |
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JP4702784B2 (ja) * | 2005-08-08 | 2011-06-15 | ソニー株式会社 | 液体吐出型記録ヘッドの流路構成材料 |
US7279210B2 (en) * | 2005-09-07 | 2007-10-09 | 3M Innovative Properties Company | Curable compositions, methods of making and using the same, and articles therefrom |
CA2620714A1 (fr) | 2005-09-13 | 2007-03-22 | Huntsman Advanced Materials (Switzerland) Gmbh | Compositions photodurcissables pour preparer des articles de type abs |
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JP5280615B2 (ja) * | 2006-06-16 | 2013-09-04 | シーメット株式会社 | 光学的立体造形用樹脂組成物 |
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JP4350832B2 (ja) * | 1999-04-19 | 2009-10-21 | Jsr株式会社 | 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物 |
US6413699B1 (en) * | 1999-10-11 | 2002-07-02 | Macdermid Graphic Arts, Inc. | UV-absorbing support layers and flexographic printing elements comprising same |
JP3893833B2 (ja) * | 2000-02-09 | 2007-03-14 | ブラザー工業株式会社 | インクジェット記録方式用エネルギー線硬化型組成物 |
JP2001310938A (ja) | 2000-04-28 | 2001-11-06 | Showa Denko Kk | 重合性組成物、その硬化物と製造方法 |
JP3974336B2 (ja) * | 2001-03-01 | 2007-09-12 | ナブテスコ株式会社 | 光学的立体造形用の活性エネルギー線硬化性樹脂組成物 |
US20030149124A1 (en) * | 2001-11-27 | 2003-08-07 | Thommes Glen A. | Radiation curable resin composition for making colored three dimensional objects |
-
2003
- 2003-05-01 KR KR1020127016516A patent/KR20120086737A/ko not_active Application Discontinuation
- 2003-05-01 WO PCT/NL2003/000320 patent/WO2003093901A1/fr active Application Filing
- 2003-05-01 ES ES03721169T patent/ES2405107T3/es not_active Expired - Lifetime
- 2003-05-01 AU AU2003224516A patent/AU2003224516A1/en not_active Abandoned
- 2003-05-01 CN CN03810052A patent/CN100576069C/zh not_active Expired - Lifetime
- 2003-05-01 EP EP12154838.2A patent/EP2466378B1/fr not_active Expired - Lifetime
- 2003-05-01 CN CN200910224789A patent/CN101706639A/zh active Pending
- 2003-05-01 EP EP03721169A patent/EP1502155B1/fr not_active Expired - Lifetime
- 2003-05-01 KR KR10-2004-7017652A patent/KR20050007372A/ko not_active Application Discontinuation
- 2003-05-01 KR KR1020117006984A patent/KR101176747B1/ko active IP Right Grant
- 2003-05-01 JP JP2004502060A patent/JP2005529200A/ja active Pending
- 2003-07-21 US US10/623,153 patent/US7183040B2/en not_active Expired - Lifetime
-
2006
- 2006-01-11 HK HK06100453.4A patent/HK1080554A1/xx not_active IP Right Cessation
-
2007
- 2007-01-08 US US11/650,453 patent/US20070154840A1/en not_active Abandoned
- 2007-11-09 US US11/979,878 patent/US20080064780A1/en not_active Abandoned
-
2010
- 2010-02-22 JP JP2010036379A patent/JP5656419B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20050007372A (ko) | 2005-01-17 |
ES2405107T3 (es) | 2013-05-30 |
KR20120086737A (ko) | 2012-08-03 |
US20070154840A1 (en) | 2007-07-05 |
WO2003093901A1 (fr) | 2003-11-13 |
US7183040B2 (en) | 2007-02-27 |
JP2005529200A (ja) | 2005-09-29 |
JP5656419B2 (ja) | 2015-01-21 |
KR101176747B1 (ko) | 2012-08-23 |
EP2466378B1 (fr) | 2014-01-08 |
CN101706639A (zh) | 2010-05-12 |
KR20110051258A (ko) | 2011-05-17 |
CN1650231A (zh) | 2005-08-03 |
US20080064780A1 (en) | 2008-03-13 |
CN100576069C (zh) | 2009-12-30 |
JP2010189641A (ja) | 2010-09-02 |
EP2466378A3 (fr) | 2012-09-05 |
EP1502155B1 (fr) | 2013-01-30 |
EP2466378A2 (fr) | 2012-06-20 |
EP1502155A1 (fr) | 2005-02-02 |
AU2003224516A1 (en) | 2003-11-17 |
US20040142274A1 (en) | 2004-07-22 |
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