HK1078616A1 - Method and device for coating a substrate - Google Patents

Method and device for coating a substrate

Info

Publication number
HK1078616A1
HK1078616A1 HK05110333A HK05110333A HK1078616A1 HK 1078616 A1 HK1078616 A1 HK 1078616A1 HK 05110333 A HK05110333 A HK 05110333A HK 05110333 A HK05110333 A HK 05110333A HK 1078616 A1 HK1078616 A1 HK 1078616A1
Authority
HK
Hong Kong
Prior art keywords
substrate
vaporized
coating
space
electromagnetic field
Prior art date
Application number
HK05110333A
Other languages
English (en)
Inventor
Johannes Alphonsus Franciscus Schade Van West
Gerardus Gleijm
Original Assignee
Corus Technology Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corus Technology Bv filed Critical Corus Technology Bv
Publication of HK1078616A1 publication Critical patent/HK1078616A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
HK05110333A 2002-02-21 2005-11-18 Method and device for coating a substrate HK1078616A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1020059A NL1020059C2 (nl) 2002-02-21 2002-02-21 Werkwijze en inrichting voor het bekleden van een substraat.
PCT/NL2003/000139 WO2003071000A1 (en) 2002-02-21 2003-02-21 Method and device for coating a substrate

Publications (1)

Publication Number Publication Date
HK1078616A1 true HK1078616A1 (en) 2006-03-17

Family

ID=27752086

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05110333A HK1078616A1 (en) 2002-02-21 2005-11-18 Method and device for coating a substrate

Country Status (15)

Country Link
US (1) US7323229B2 (xx)
EP (1) EP1483425B1 (xx)
JP (1) JP4522709B2 (xx)
KR (1) KR100956491B1 (xx)
CN (1) CN100545299C (xx)
AT (1) ATE399889T1 (xx)
AU (1) AU2003221458A1 (xx)
BR (1) BR0307800B1 (xx)
CA (1) CA2476855C (xx)
DE (1) DE60321893D1 (xx)
ES (1) ES2309305T3 (xx)
HK (1) HK1078616A1 (xx)
NL (1) NL1020059C2 (xx)
RU (1) RU2316611C2 (xx)
WO (1) WO2003071000A1 (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004080640A1 (en) * 2003-03-14 2004-09-23 Hille & Müller GMBH Aluminium layered brazing product and method of its manufacture
ZA200701534B (en) 2004-08-23 2008-10-29 Corus Technology Bv Apparatus and method for levitation of an amount of conductive material
EP1785010B1 (en) * 2004-08-23 2009-04-08 Corus Technology BV Apparatus and method for levitation of an amount of conductive material
JP5394061B2 (ja) * 2005-05-31 2014-01-22 タタ、スティール、ネダーランド、テクノロジー、ベスローテン、フェンノートシャップ 基材を被覆する装置および方法
US7524385B2 (en) * 2006-10-03 2009-04-28 Elemetric, Llc Controlled phase transition of metals
KR100961371B1 (ko) 2007-12-28 2010-06-07 주식회사 포스코 실러 접착성 및 내식성이 우수한 아연계 합금도금강판과 그제조방법
KR101639813B1 (ko) * 2009-10-08 2016-07-15 주식회사 포스코 연속 코팅 장치
US9267203B2 (en) * 2010-12-13 2016-02-23 Posco Continuous coating apparatus
KR101207719B1 (ko) * 2010-12-27 2012-12-03 주식회사 포스코 건식 코팅 장치
RU2522666C2 (ru) * 2012-06-27 2014-07-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Юго-Западный государственный университет" (ЮЗГУ) Устройство для левитации некоторого количества материала
KR101355817B1 (ko) * 2012-07-09 2014-02-05 한국표준과학연구원 전자기 부양 금속 박막 증착 장치
RU2693852C2 (ru) * 2017-11-07 2019-07-05 Федеральное государственное бюджетное образовательное учреждение высшего образования " Юго-Западный государственный университет" (ЮЗГУ) Устройство для левитации некоторого количества материала
KR102098455B1 (ko) * 2017-12-26 2020-04-07 주식회사 포스코 연속 증착 장치 및 연속 증착 방법
CN109518133A (zh) * 2018-10-23 2019-03-26 集美大学 一种电磁加热的pvd设备及其生产工艺
CN112760608A (zh) * 2020-12-14 2021-05-07 兰州空间技术物理研究所 碳纤维复合材料表面薄膜沉积过程防止层间放气的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2664852A (en) * 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
US2957064A (en) * 1958-09-30 1960-10-18 Westinghouse Electric Corp Stabilizing of levitation melting
GB1206586A (en) * 1966-09-07 1970-09-23 Mini Of Technology Vacuum deposition process of forming alloys
BE713308A (xx) * 1968-04-05 1968-10-07
DE2934011A1 (de) * 1979-08-22 1981-03-26 André Etienne de Dr. Lausanne Rudnay Vorrichtung zum aufdampfen von elektrisch leitenden stoffen (metallen) im hochvakuum
JPS621863A (ja) * 1985-06-28 1987-01-07 Ishikawajima Harima Heavy Ind Co Ltd 金属蒸発装置
JP3563083B2 (ja) * 1992-09-11 2004-09-08 真空冶金株式会社 超微粒子のガスデポジション方法及び装置
JPH07252639A (ja) * 1994-03-15 1995-10-03 Kao Corp 金属薄膜体の製造方法
US5534314A (en) * 1994-08-31 1996-07-09 University Of Virginia Patent Foundation Directed vapor deposition of electron beam evaporant
JPH08104981A (ja) * 1994-10-05 1996-04-23 Sumitomo Electric Ind Ltd Pvd装置
JP2783193B2 (ja) 1995-06-26 1998-08-06 大同特殊鋼株式会社 レビテーション溶解法及びレビテーション溶解・鋳造装置
US5736073A (en) * 1996-07-08 1998-04-07 University Of Virginia Patent Foundation Production of nanometer particles by directed vapor deposition of electron beam evaporant
DE19811816A1 (de) * 1997-03-24 1998-10-01 Fuji Electric Co Ltd Verfahren zur Herstellung eines Elektrodenmaterials für Vakuum-Leistungsschalter
CA2269632C (en) * 1997-08-27 2003-09-02 Josuke Nakata Spherical semiconductor device and method of manufacturing same
JPH1171605A (ja) * 1997-08-29 1999-03-16 Ishikawajima Harima Heavy Ind Co Ltd 微粒子製造方法及び装置
EP1321545A1 (en) * 2001-12-20 2003-06-25 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Method for producing particles with diamond structure

Also Published As

Publication number Publication date
RU2004128083A (ru) 2005-06-10
US7323229B2 (en) 2008-01-29
EP1483425B1 (en) 2008-07-02
US20050064110A1 (en) 2005-03-24
KR100956491B1 (ko) 2010-05-07
KR20040085192A (ko) 2004-10-07
BR0307800B1 (pt) 2012-09-04
BR0307800A (pt) 2004-12-14
ATE399889T1 (de) 2008-07-15
ES2309305T3 (es) 2008-12-16
NL1020059C2 (nl) 2003-08-25
RU2316611C2 (ru) 2008-02-10
WO2003071000A1 (en) 2003-08-28
JP2005523381A (ja) 2005-08-04
CN1636077A (zh) 2005-07-06
AU2003221458A1 (en) 2003-09-09
EP1483425A1 (en) 2004-12-08
CN100545299C (zh) 2009-09-30
DE60321893D1 (de) 2008-08-14
JP4522709B2 (ja) 2010-08-11
CA2476855A1 (en) 2003-08-28
CA2476855C (en) 2009-12-22

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140221