HK1078099A1 - Hardener composition for epoxy resins - Google Patents
Hardener composition for epoxy resinsInfo
- Publication number
- HK1078099A1 HK1078099A1 HK05110150A HK05110150A HK1078099A1 HK 1078099 A1 HK1078099 A1 HK 1078099A1 HK 05110150 A HK05110150 A HK 05110150A HK 05110150 A HK05110150 A HK 05110150A HK 1078099 A1 HK1078099 A1 HK 1078099A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- hardener composition
- epoxy resins
- copolymer
- ethylenically unsaturated
- anhydride
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/306,311 US20040101689A1 (en) | 2002-11-26 | 2002-11-26 | Hardener composition for epoxy resins |
PCT/US2003/036150 WO2004048470A1 (en) | 2002-11-26 | 2003-11-14 | Hardener composition for epoxy resins |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1078099A1 true HK1078099A1 (en) | 2006-03-03 |
Family
ID=32325650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05110150A HK1078099A1 (en) | 2002-11-26 | 2005-11-12 | Hardener composition for epoxy resins |
Country Status (12)
Country | Link |
---|---|
US (3) | US20040101689A1 (de) |
EP (1) | EP1567589B1 (de) |
JP (1) | JP4643272B2 (de) |
KR (1) | KR101098175B1 (de) |
CN (1) | CN100390233C (de) |
AT (1) | ATE324409T1 (de) |
AU (1) | AU2003287713A1 (de) |
DE (1) | DE60304895T2 (de) |
HK (1) | HK1078099A1 (de) |
MY (1) | MY134917A (de) |
TW (1) | TWI370058B (de) |
WO (1) | WO2004048470A1 (de) |
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US9217065B2 (en) * | 2006-06-16 | 2015-12-22 | Georgia-Pacific Chemicals Llc | Binder compositions for making fiberglass products |
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KR102270374B1 (ko) | 2016-10-24 | 2021-07-01 | 생-고뱅 퍼포먼스 플라스틱스 코포레이션 | 중합체 조성물, 재료 및 제조 방법 |
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JP7110711B2 (ja) * | 2018-05-11 | 2022-08-02 | 昭和電工マテリアルズ株式会社 | 導体基板、配線基板、ストレッチャブルデバイス及び配線基板の製造方法 |
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CN1129648C (zh) | 1997-01-21 | 2003-12-03 | 陶氏环球技术公司 | 用于环氧固化体系的潜伏催化剂 |
US6093774A (en) * | 1997-09-26 | 2000-07-25 | Reichhold Chemicals, Inc. | Low gloss powder coating composition |
GB9817799D0 (en) | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
AU1598800A (en) | 1998-11-06 | 2000-05-29 | Dow Chemical Company, The | Fabricated articles produced from alpha-olefin/vinyl or vinylidene aromatic and/or hindered aliphatic or cycloaliphatic vinyl or vinylidene interpolymer compositions |
CA2373154A1 (en) | 1999-05-07 | 2000-11-16 | Isola Laminate Systems Corp. | Thermosetting polymer systems and electronic laminates |
WO2000076764A1 (en) * | 1999-06-10 | 2000-12-21 | Isola Laminate Systems Corp. | Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer |
US6221486B1 (en) * | 1999-12-09 | 2001-04-24 | Zms, Llc | Expandable polymeric fibers and their method of production |
WO2001042253A2 (en) * | 1999-12-13 | 2001-06-14 | The Dow Chemical Company | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
CN1423678B (zh) * | 1999-12-13 | 2010-11-10 | 陶氏环球技术公司 | 含磷元素阻燃剂环氧树脂组合物 |
US6534181B2 (en) * | 2000-03-27 | 2003-03-18 | Neltec, Inc. | Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds |
DE10025356A1 (de) | 2000-05-23 | 2001-11-29 | Gewerk Keramchemie | Hartgummi-Beschichtungen für den Korrosionsschutz |
KR100792099B1 (ko) * | 2001-01-30 | 2008-01-04 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물 및 그의 용도 |
JP2004538352A (ja) * | 2001-08-14 | 2004-12-24 | ポリイー インコーポレイテッド | 高内相ポリマー性エマルジョン組成物 |
-
2002
- 2002-11-26 US US10/306,311 patent/US20040101689A1/en not_active Abandoned
-
2003
- 2003-11-14 EP EP20030781918 patent/EP1567589B1/de not_active Expired - Lifetime
- 2003-11-14 AT AT03781918T patent/ATE324409T1/de active
- 2003-11-14 AU AU2003287713A patent/AU2003287713A1/en not_active Abandoned
- 2003-11-14 WO PCT/US2003/036150 patent/WO2004048470A1/en active IP Right Grant
- 2003-11-14 CN CNB2003801041297A patent/CN100390233C/zh not_active Expired - Fee Related
- 2003-11-14 KR KR1020057009564A patent/KR101098175B1/ko not_active IP Right Cessation
- 2003-11-14 JP JP2004555431A patent/JP4643272B2/ja not_active Expired - Fee Related
- 2003-11-14 DE DE2003604895 patent/DE60304895T2/de not_active Expired - Lifetime
- 2003-11-21 MY MYPI20034486A patent/MY134917A/en unknown
- 2003-11-25 TW TW092133056A patent/TWI370058B/zh not_active IP Right Cessation
-
2005
- 2005-02-28 US US11/067,854 patent/US20050143524A1/en not_active Abandoned
- 2005-11-12 HK HK05110150A patent/HK1078099A1/xx not_active IP Right Cessation
-
2008
- 2008-01-11 US US11/972,986 patent/US7547745B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1567589B1 (de) | 2006-04-26 |
KR20050085172A (ko) | 2005-08-29 |
EP1567589A1 (de) | 2005-08-31 |
US20080108739A1 (en) | 2008-05-08 |
DE60304895T2 (de) | 2006-11-30 |
CN100390233C (zh) | 2008-05-28 |
JP4643272B2 (ja) | 2011-03-02 |
AU2003287713A1 (en) | 2004-06-18 |
US20040101689A1 (en) | 2004-05-27 |
MY134917A (en) | 2008-01-31 |
CN1717451A (zh) | 2006-01-04 |
JP2006515030A (ja) | 2006-05-18 |
DE60304895D1 (de) | 2006-06-01 |
ATE324409T1 (de) | 2006-05-15 |
TW200417464A (en) | 2004-09-16 |
WO2004048470A1 (en) | 2004-06-10 |
US7547745B2 (en) | 2009-06-16 |
US20050143524A1 (en) | 2005-06-30 |
TWI370058B (en) | 2012-08-11 |
KR101098175B1 (ko) | 2011-12-26 |
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Legal Events
Date | Code | Title | Description |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20141114 |