HK1074531A1 - Semiconductor device using low dielectric constantmaterial film and method of fabricating the same - Google Patents
Semiconductor device using low dielectric constantmaterial film and method of fabricating the sameInfo
- Publication number
- HK1074531A1 HK1074531A1 HK05108528A HK05108528A HK1074531A1 HK 1074531 A1 HK1074531 A1 HK 1074531A1 HK 05108528 A HK05108528 A HK 05108528A HK 05108528 A HK05108528 A HK 05108528A HK 1074531 A1 HK1074531 A1 HK 1074531A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- constantmaterial
- fabricating
- film
- semiconductor device
- same
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8221—Three dimensional integrated circuits stacked in different levels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001340076 | 2001-11-05 | ||
PCT/JP2002/011494 WO2003041167A1 (fr) | 2001-11-05 | 2002-11-05 | Dispositif semi-conducteur comprenant un film en materiau a constante dielectrique faible et procede de fabrication associe |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1074531A1 true HK1074531A1 (en) | 2005-11-11 |
Family
ID=19154331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05108528A HK1074531A1 (en) | 2001-11-05 | 2005-09-28 | Semiconductor device using low dielectric constantmaterial film and method of fabricating the same |
Country Status (8)
Country | Link |
---|---|
US (2) | US7091534B2 (fr) |
EP (1) | EP1453093A4 (fr) |
JP (1) | JP4472340B2 (fr) |
KR (1) | KR20050043730A (fr) |
CN (1) | CN1309077C (fr) |
HK (1) | HK1074531A1 (fr) |
TW (1) | TWI261892B (fr) |
WO (1) | WO2003041167A1 (fr) |
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US6821826B1 (en) * | 2003-09-30 | 2004-11-23 | International Business Machines Corporation | Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers |
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JP5487625B2 (ja) * | 2009-01-22 | 2014-05-07 | ソニー株式会社 | 半導体装置 |
US8507359B2 (en) * | 2009-12-02 | 2013-08-13 | Sharp Kabushiki Kaisha | Semiconductor device, process for producing same, and display device |
JP2010118675A (ja) * | 2010-01-12 | 2010-05-27 | Sony Corp | 固体撮像素子及びその製造方法 |
US8901613B2 (en) * | 2011-03-06 | 2014-12-02 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
US20180350686A1 (en) * | 2011-06-28 | 2018-12-06 | Monolithic 3D Inc. | 3d semiconductor device and system |
FR2980040B1 (fr) * | 2011-09-14 | 2016-02-05 | Commissariat Energie Atomique | Transistor organique a effet de champ |
US9117786B2 (en) * | 2012-12-04 | 2015-08-25 | Infineon Technologies Ag | Chip module, an insulation material and a method for fabricating a chip module |
EP2884542A3 (fr) * | 2013-12-10 | 2015-09-02 | IMEC vzw | Dispositif de circuit intégré avec un commutateur à déclenchement de puissance à l'extrémité arrière de ligne |
CN104752421B (zh) * | 2013-12-27 | 2018-03-20 | 中芯国际集成电路制造(上海)有限公司 | 一种集成电路及其制造方法 |
JP5856227B2 (ja) * | 2014-05-26 | 2016-02-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
WO2015195152A1 (fr) * | 2014-06-16 | 2015-12-23 | Intel Corporation | Métal des deux côtés avec acheminement inférieur de signaux et de puissance sélectionné à travers une porte d'horloge |
WO2017052562A1 (fr) * | 2015-09-24 | 2017-03-30 | Intel Corporation | Procédés de formation de trous d'interconnexion auto-alignés arrière et structures formées par ceux-ci |
CN107924947B (zh) * | 2015-09-25 | 2022-04-29 | 英特尔公司 | 用于器件两侧的金属的背面触点结构和制造 |
US11328951B2 (en) | 2016-04-01 | 2022-05-10 | Intel Corporation | Transistor cells including a deep via lined wit h a dielectric material |
WO2018106233A1 (fr) | 2016-12-07 | 2018-06-14 | Intel Corporation | Dispositif de circuit intégré avec tracé de trace métallique crénelé |
CN109643742A (zh) | 2016-08-26 | 2019-04-16 | 英特尔公司 | 集成电路器件结构和双侧制造技术 |
US9837302B1 (en) * | 2016-08-26 | 2017-12-05 | Qualcomm Incorporated | Methods of forming a device having semiconductor devices on two sides of a buried dielectric layer |
US10559594B2 (en) * | 2017-04-11 | 2020-02-11 | Ahmad Tarakji | Approach to the manufacturing of monolithic 3-dimensional high-rise integrated-circuits with vertically-stacked double-sided fully-depleted silicon-on-insulator transistors |
WO2019132863A1 (fr) | 2017-12-26 | 2019-07-04 | Intel Corporation | Transistors empilés avec forme de contact |
KR102601827B1 (ko) * | 2017-12-29 | 2023-11-14 | 엘지디스플레이 주식회사 | 유기발광표시 장치 |
WO2019172879A1 (fr) | 2018-03-05 | 2019-09-12 | Intel Corporation | Structures de métallisation pour connectivité de dispositif empilé et leurs procédés de fabrication |
US10580903B2 (en) | 2018-03-13 | 2020-03-03 | Psemi Corporation | Semiconductor-on-insulator transistor with improved breakdown characteristics |
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US10573674B2 (en) | 2018-07-19 | 2020-02-25 | Psemi Corporation | SLT integrated circuit capacitor structure and methods |
US10672806B2 (en) | 2018-07-19 | 2020-06-02 | Psemi Corporation | High-Q integrated circuit inductor structure and methods |
US10658386B2 (en) | 2018-07-19 | 2020-05-19 | Psemi Corporation | Thermal extraction of single layer transfer integrated circuits |
US20200043946A1 (en) | 2018-07-31 | 2020-02-06 | Psemi Corporation | Low Parasitic Capacitance RF Transistors |
US11688780B2 (en) | 2019-03-22 | 2023-06-27 | Intel Corporation | Deep source and drain for transistor structures with back-side contact metallization |
US10777636B1 (en) | 2019-06-12 | 2020-09-15 | Psemi Corporation | High density IC capacitor structure |
US11239325B2 (en) * | 2020-04-28 | 2022-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device having backside via and method of fabricating thereof |
US11411100B2 (en) * | 2020-09-29 | 2022-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming backside power rails |
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-
2002
- 2002-11-05 KR KR1020047006491A patent/KR20050043730A/ko not_active Application Discontinuation
- 2002-11-05 EP EP02778050A patent/EP1453093A4/fr not_active Withdrawn
- 2002-11-05 WO PCT/JP2002/011494 patent/WO2003041167A1/fr not_active Application Discontinuation
- 2002-11-05 CN CNB028217780A patent/CN1309077C/zh not_active Expired - Fee Related
- 2002-11-05 JP JP2003543101A patent/JP4472340B2/ja not_active Expired - Fee Related
- 2002-11-05 US US10/494,769 patent/US7091534B2/en not_active Expired - Fee Related
- 2002-11-05 TW TW91132556A patent/TWI261892B/zh not_active IP Right Cessation
-
2005
- 2005-09-28 HK HK05108528A patent/HK1074531A1/xx not_active IP Right Cessation
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2006
- 2006-01-26 US US11/275,733 patent/US7326642B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060115943A1 (en) | 2006-06-01 |
US20040266168A1 (en) | 2004-12-30 |
WO2003041167A1 (fr) | 2003-05-15 |
KR20050043730A (ko) | 2005-05-11 |
TWI261892B (en) | 2006-09-11 |
US7091534B2 (en) | 2006-08-15 |
US7326642B2 (en) | 2008-02-05 |
CN1625808A (zh) | 2005-06-08 |
CN1309077C (zh) | 2007-04-04 |
JP4472340B2 (ja) | 2010-06-02 |
EP1453093A4 (fr) | 2007-10-10 |
EP1453093A1 (fr) | 2004-09-01 |
JPWO2003041167A1 (ja) | 2005-03-03 |
TW200300279A (en) | 2003-05-16 |
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Free format text: ADDITION OF INTERNATIONAL APPLICATION DETAILS: WO2003/041167 15.05.2003 PCT/JP2002/011494 05.11.2002 Effective date: 20071024 |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20151105 |