HK1072929A1 - A heat conductive material - Google Patents

A heat conductive material

Info

Publication number
HK1072929A1
HK1072929A1 HK05104806A HK05104806A HK1072929A1 HK 1072929 A1 HK1072929 A1 HK 1072929A1 HK 05104806 A HK05104806 A HK 05104806A HK 05104806 A HK05104806 A HK 05104806A HK 1072929 A1 HK1072929 A1 HK 1072929A1
Authority
HK
Hong Kong
Prior art keywords
heat conductive
conductive material
sup
heat
thermal conductivity
Prior art date
Application number
HK05104806A
Other languages
English (en)
Inventor
Thommy Ekstrom
Jie Zheng
Kauthar Kloub
Sergey K Gordeev
Liya V Danchukova
Original Assignee
Skeleton Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skeleton Technologies Ag filed Critical Skeleton Technologies Ag
Publication of HK1072929A1 publication Critical patent/HK1072929A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Carbon And Carbon Compounds (AREA)
HK05104806A 2000-11-21 2005-06-08 A heat conductive material HK1072929A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2000129403A RU2206502C2 (ru) 2000-11-21 2000-11-21 Композиционный материал
PCT/EP2001/010439 WO2002042240A2 (en) 2000-11-21 2001-09-10 A heat conductive material

Publications (1)

Publication Number Publication Date
HK1072929A1 true HK1072929A1 (en) 2005-09-16

Family

ID=20242528

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05104806A HK1072929A1 (en) 2000-11-21 2005-06-08 A heat conductive material

Country Status (13)

Country Link
US (1) US6914025B2 (xx)
EP (1) EP1337497B1 (xx)
JP (1) JP4862169B2 (xx)
KR (1) KR100758178B1 (xx)
CN (1) CN1263704C (xx)
AT (1) ATE342244T1 (xx)
AU (1) AU9184801A (xx)
DE (1) DE60123825T2 (xx)
ES (1) ES2273889T3 (xx)
HK (1) HK1072929A1 (xx)
RU (1) RU2206502C2 (xx)
WO (1) WO2002042240A2 (xx)
ZA (1) ZA200303525B (xx)

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US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
JP4251986B2 (ja) * 2001-11-09 2009-04-08 住友電工ハードメタル株式会社 高熱伝導性ダイヤモンド焼結体とその製造方法
GB0223321D0 (en) * 2002-10-08 2002-11-13 Element Six Ltd Heat spreader
US7173334B2 (en) * 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
AT7382U1 (de) * 2003-03-11 2005-02-25 Plansee Ag Wärmesenke mit hoher wärmeleitfähigkeit
CN100345637C (zh) * 2003-03-14 2007-10-31 攀枝花钢铁有限责任公司钢铁研究院 一种耐冲击构件及制造方法
SE0301117L (sv) 2003-04-14 2004-10-15 Skeleton Technologies Ag Metod att tillverka en diamantkomposit
US7279023B2 (en) * 2003-10-02 2007-10-09 Materials And Electrochemical Research (Mer) Corporation High thermal conductivity metal matrix composites
DE102005024790A1 (de) 2005-05-26 2006-12-07 Eos Gmbh Electro Optical Systems Strahlungsheizung zum Heizen des Aufbaumaterials in einer Lasersintervorrichtung
US7359487B1 (en) * 2005-09-15 2008-04-15 Revera Incorporated Diamond anode
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
WO2010027504A1 (en) * 2008-09-08 2010-03-11 Materials And Electrochemical Research (Mer) Corporation Machinable metal/diamond metal matrix composite compound structure and method of making same
US20110027603A1 (en) * 2008-12-03 2011-02-03 Applied Nanotech, Inc. Enhancing Thermal Properties of Carbon Aluminum Composites
US20100139885A1 (en) * 2008-12-09 2010-06-10 Renewable Thermodynamics, Llc Sintered diamond heat exchanger apparatus
US20100149756A1 (en) * 2008-12-16 2010-06-17 David Rowcliffe Heat spreader
KR101005608B1 (ko) * 2008-12-26 2011-01-05 대중기계 주식회사 재단기의 재단도 높이 조정 장치
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
CN101578030B (zh) * 2009-06-12 2011-10-26 陈伟恩 散热结构及其制造方法
JP5519788B2 (ja) 2009-07-10 2014-06-11 エタリム インコーポレイテッド 熱エネルギーと機械エネルギーとの間の変換を行うスターリングサイクル変換器
RU2413329C9 (ru) * 2009-09-08 2016-04-20 ООО "Научно-производственное предприятие "Томилинский электронный завод" Теплоотводящий элемент
WO2011049479A1 (en) * 2009-10-21 2011-04-28 Andrey Mikhailovich Abyzov Composite material having high thermal conductivity and process of fabricating same
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
US8531026B2 (en) 2010-09-21 2013-09-10 Ritedia Corporation Diamond particle mololayer heat spreaders and associated methods
JP2014501868A (ja) 2010-11-18 2014-01-23 エタリム インコーポレイテッド スターリングサイクル変換器装置
US8946603B2 (en) * 2011-09-16 2015-02-03 Be Aerospace, Inc. Drain/fill fitting
US9315732B1 (en) * 2014-12-12 2016-04-19 Infinitus Renewable Energy, LLC Ash filter and reboiler
JP6684292B2 (ja) * 2015-04-06 2020-04-22 エム キューブド テクノロジーズ， インコーポレイテッド ダイヤモンドのみの接触面を有する物品
KR102356026B1 (ko) 2018-07-16 2022-02-08 코닝 인코포레이티드 개선된 특성을 갖는 유리 세라믹 물품 및 이의 제조 방법
WO2020018408A1 (en) 2018-07-16 2020-01-23 Corning Incorporated Methods for ceramming glass with nucleation and growth density and viscosity changes
WO2020018290A1 (en) * 2018-07-16 2020-01-23 Corning Incorporated Setter plates and methods of ceramming glass articles using the same
CN112437760A (zh) 2018-07-16 2021-03-02 康宁股份有限公司 包含均匀脱模剂涂层的玻璃基材及其陶瓷化方法
CN112437759A (zh) 2018-07-16 2021-03-02 康宁股份有限公司 具有改善的翘曲的玻璃制品的陶瓷化方法
RU2731703C1 (ru) * 2019-11-15 2020-09-08 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт конструкционных материалов "Прометей" имени И.В. Горынина Национального исследовательского центра "Курчатовский институт" (НИЦ "Курчатовский институт" - ЦНИИ КМ "Прометей") Композиционный материал
RU2759858C1 (ru) * 2020-12-25 2021-11-18 Государственное Научное Учреждение Институт Порошковой Металлургии Имени Академика О.В. Романа Способ получения износостойкого композиционного материала на основе карбида кремния
CN112694335B (zh) * 2020-12-29 2022-09-27 北京科技大学广州新材料研究院 金刚石-碳化硅基板及其制备方法与应用

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US4151686A (en) 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US4220455A (en) 1978-10-24 1980-09-02 General Electric Company Polycrystalline diamond and/or cubic boron nitride body and process for making said body
US4242106A (en) 1979-01-02 1980-12-30 General Electric Company Composite of polycrystalline diamond and/or cubic boron nitride body/silicon carbide substrate
WO1982000140A1 (en) 1980-07-09 1982-01-21 Gen Electric Silicon carbide composite and process for production
AU7919682A (en) 1981-01-21 1982-07-29 General Electric Company Silicon carbide-diamond/boron nitride composite
US4381271A (en) 1981-02-02 1983-04-26 General Electric Company Use of fired fibrous graphite in fabricating polycrystalline diamond and/or cubic boron nitride/silicon carbide/silicon composite bodies
US5106393A (en) 1988-08-17 1992-04-21 Australian National University Diamond compact possessing low electrical resistivity
JPH06199571A (ja) 1991-06-20 1994-07-19 Nippon Seratetsuku:Kk 耐摩耗性セラミックス材料およびその製造方法
RU2036779C1 (ru) 1992-12-08 1995-06-09 Акционерное общество закрытого типа "Карбид" Способ получения алмазосодержащего материала
US6264882B1 (en) 1994-05-20 2001-07-24 The Regents Of The University Of California Process for fabricating composite material having high thermal conductivity
JP3617232B2 (ja) 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP3893681B2 (ja) 1997-08-19 2007-03-14 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法
BR9811633A (pt) 1997-09-05 2000-09-26 Frenton Ltd Processo para fabricar um compósito de diamante-carbeto de silìcio-silìcio de partìculas de diamante, e, corpo em que as partìculas de diamante estão ligadas a uma matriz de carbeto de silicone
US6447852B1 (en) * 1999-03-04 2002-09-10 Ambler Technologies, Inc. Method of manufacturing a diamond composite and a composite produced by same
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Also Published As

Publication number Publication date
DE60123825T2 (de) 2007-05-16
US20040053039A1 (en) 2004-03-18
ZA200303525B (en) 2004-03-30
CN1575265A (zh) 2005-02-02
EP1337497A2 (en) 2003-08-27
US6914025B2 (en) 2005-07-05
WO2002042240A3 (en) 2002-10-10
JP2004525050A (ja) 2004-08-19
EP1337497B1 (en) 2006-10-11
KR100758178B1 (ko) 2007-09-12
AU9184801A (en) 2002-06-03
ATE342244T1 (de) 2006-11-15
RU2206502C2 (ru) 2003-06-20
ES2273889T3 (es) 2007-05-16
CN1263704C (zh) 2006-07-12
DE60123825D1 (de) 2006-11-23
WO2002042240A2 (en) 2002-05-30
KR20030074623A (ko) 2003-09-19
JP4862169B2 (ja) 2012-01-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100910