HK1066321A1 - Printed circuit boards with plated resistors and process for the manufacturing the same - Google Patents

Printed circuit boards with plated resistors and process for the manufacturing the same

Info

Publication number
HK1066321A1
HK1066321A1 HK04109030A HK04109030A HK1066321A1 HK 1066321 A1 HK1066321 A1 HK 1066321A1 HK 04109030 A HK04109030 A HK 04109030A HK 04109030 A HK04109030 A HK 04109030A HK 1066321 A1 HK1066321 A1 HK 1066321A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
same
printed circuit
circuit boards
plated resistors
Prior art date
Application number
HK04109030A
Other languages
English (en)
Inventor
Peter Kukanskis
Dennis Fritz
Frank Durso
Steven Castaldi
David Sawoska
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of HK1066321A1 publication Critical patent/HK1066321A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
HK04109030A 2001-02-15 2004-11-16 Printed circuit boards with plated resistors and process for the manufacturing the same HK1066321A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/784,242 US6585904B2 (en) 2001-02-15 2001-02-15 Method for the manufacture of printed circuit boards with plated resistors
PCT/US2002/001409 WO2002066256A2 (en) 2001-02-15 2002-01-15 Process for the manufacture of printed circuit boards with plated resistors

Publications (1)

Publication Number Publication Date
HK1066321A1 true HK1066321A1 (en) 2005-03-18

Family

ID=25131802

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04109030A HK1066321A1 (en) 2001-02-15 2004-11-16 Printed circuit boards with plated resistors and process for the manufacturing the same

Country Status (9)

Country Link
US (4) US6585904B2 (xx)
EP (1) EP1360720A4 (xx)
JP (2) JP2004519105A (xx)
CN (1) CN1302545C (xx)
AU (1) AU2002235402A1 (xx)
CA (1) CA2434161C (xx)
HK (1) HK1066321A1 (xx)
TW (1) TW558930B (xx)
WO (1) WO2002066256A2 (xx)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG98017A1 (en) * 2000-12-19 2003-08-20 Inst Materials Research & Eng Method of forming selective electronics plating on polymer surfaces
US6767445B2 (en) * 2002-10-16 2004-07-27 Peter Kukanskis Method for the manufacture of printed circuit boards with integral plated resistors
US20040075528A1 (en) * 2002-10-22 2004-04-22 Oak-Mitsui, Inc. Printed circuit heaters with ultrathin low resistivity materials
KR100736665B1 (ko) * 2003-06-30 2007-07-06 이비덴 가부시키가이샤 프린트 배선판
JP4515858B2 (ja) * 2004-08-18 2010-08-04 ローム株式会社 サーマルプリントヘッドの製造方法
ATE538629T1 (de) * 2007-02-20 2012-01-15 Dynamic Details Inc Mehrschichtige bestückte leiterplatten mit kupfergefüllten durchgangslöchern
WO2009086023A2 (en) * 2007-12-19 2009-07-09 Applied Materials, Inc. Methods for cleaning process kits and chambers, and for ruthenium recovery
TWI347807B (en) * 2008-05-13 2011-08-21 Unimicron Technology Corp Electrically interconnect structure and process thereof and circuit board structure
CN102938980B (zh) * 2012-11-13 2015-05-20 无锡江南计算技术研究所 软硬结合板阻焊褪洗方法
TWI542729B (zh) * 2015-07-09 2016-07-21 旭德科技股份有限公司 線路板及其製作方法
CN107743341A (zh) * 2017-09-28 2018-02-27 衢州顺络电路板有限公司 提高内埋电阻信赖性的印制线路板及其制造方法
CN109121312B (zh) * 2018-10-12 2021-01-05 深圳崇达多层线路板有限公司 一种基于过孔可精确调节埋阻值的方法

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US2662957A (en) 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
US3607389A (en) * 1967-10-21 1971-09-21 Elettrotecnica Chimica Italian Metallic film resistors
GB1302272A (xx) * 1970-02-27 1973-01-04
US3808576A (en) 1971-01-15 1974-04-30 Mica Corp Circuit board with resistance layer
US3982045A (en) 1974-10-11 1976-09-21 Macdermid Incorporated Method of manufacture of additive printed circuitboards using permanent resist mask
DE2915240A1 (de) * 1978-06-28 1980-01-03 Mitsumi Electric Co Gedruckte schaltung
US4191938A (en) * 1978-07-03 1980-03-04 International Business Machines Corporation Cermet resistor trimming method
US4863758A (en) 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
JPS59164156A (ja) * 1983-03-09 1984-09-17 Oki Electric Ind Co Ltd サ−マルヘツド
US4847114A (en) 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
US5246817A (en) 1985-08-02 1993-09-21 Shipley Company, Inc. Method for manufacture of multilayer circuit board
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
US4976990A (en) 1986-09-30 1990-12-11 Macdermid, Incorporated Process for metallizing non-conductive substrates
US5322976A (en) 1987-02-24 1994-06-21 Polyonics Corporation Process for forming polyimide-metal laminates
US4892776A (en) 1987-09-02 1990-01-09 Ohmega Electronics, Inc. Circuit board material and electroplating bath for the production thereof
US5032427A (en) 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US4978422A (en) 1990-03-20 1990-12-18 Macdermid, Incorporated Method for improving insulation resistance of printed circuits
JP2777747B2 (ja) 1990-11-26 1998-07-23 東亞合成株式会社 電磁波シールド層を有するプリント抵抗器内蔵多層プリント回路板
US5119111A (en) * 1991-05-22 1992-06-02 Dynamics Research Corporation Edge-type printhead with contact pads
US5221418A (en) 1992-02-11 1993-06-22 Macdermid, Incorporated Method for improving the surface insulation resistance of printed circuits
JP2865472B2 (ja) * 1992-02-20 1999-03-08 信越化学工業株式会社 静電チャック
US5207867A (en) 1992-03-17 1993-05-04 Macdermid, Incorporated Composition and method for improving the surface insulation resistance of a printed circuit
US5517758A (en) * 1992-05-29 1996-05-21 Matsushita Electric Industrial Co., Ltd. Plating method and method for producing a multi-layered printed wiring board using the same
US5254968A (en) * 1992-06-15 1993-10-19 General Motors Corporation Electrically conductive plastic speed control resistor for an automotive blower motor
US5296334A (en) 1992-08-28 1994-03-22 Macdermid, Incorporated Radiation-curable composition useful for preparation of solder masks
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US5431959A (en) 1994-08-26 1995-07-11 Macdermid, Incorporated Process for the activation of nickel - phosphorous surfaces
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KR100302677B1 (ko) * 1996-06-26 2001-11-22 사토 게니치로 칩저항기및그제조방법
US5747098A (en) 1996-09-24 1998-05-05 Macdermid, Incorporated Process for the manufacture of printed circuit boards
US6281090B1 (en) * 1996-10-16 2001-08-28 Macdermid, Incorporated Method for the manufacture of printed circuit boards with plated resistors
ES2224209T3 (es) * 1996-10-16 2005-03-01 Macdermid Incorporated Procedimiento para la fabricacion de placas de circuito impreso con resistencias metalizadas impresas.
DE69735406T2 (de) * 1996-10-25 2006-08-31 Canon K.K. Glasschaltungssubstrat und Verfahren zu dessen Herstellung
EP0848585A1 (en) * 1996-12-13 1998-06-17 Macdermid Incorporated Process for the manufacture of printed circuit boards with plated resistors
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Also Published As

Publication number Publication date
WO2002066256A3 (en) 2002-11-21
EP1360720A2 (en) 2003-11-12
JP2004519105A (ja) 2004-06-24
JP2007158362A (ja) 2007-06-21
CA2434161C (en) 2006-12-05
US20080003351A1 (en) 2008-01-03
WO2002066256A2 (en) 2002-08-29
CA2434161A1 (en) 2002-08-29
US20020135459A1 (en) 2002-09-26
AU2002235402A1 (en) 2002-09-04
TW558930B (en) 2003-10-21
EP1360720A4 (en) 2007-01-10
CN1302545C (zh) 2007-02-28
US7279108B2 (en) 2007-10-09
CN1515031A (zh) 2004-07-21
US6585904B2 (en) 2003-07-01
US20030205551A1 (en) 2003-11-06
US7034231B2 (en) 2006-04-25
US20060124583A1 (en) 2006-06-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190115