ATE538629T1 - Mehrschichtige bestückte leiterplatten mit kupfergefüllten durchgangslöchern - Google Patents
Mehrschichtige bestückte leiterplatten mit kupfergefüllten durchgangslöchernInfo
- Publication number
- ATE538629T1 ATE538629T1 AT08725858T AT08725858T ATE538629T1 AT E538629 T1 ATE538629 T1 AT E538629T1 AT 08725858 T AT08725858 T AT 08725858T AT 08725858 T AT08725858 T AT 08725858T AT E538629 T1 ATE538629 T1 AT E538629T1
- Authority
- AT
- Austria
- Prior art keywords
- holes
- printed circuit
- copper
- circuit boards
- plated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90254507P | 2007-02-20 | 2007-02-20 | |
PCT/US2008/002265 WO2008112068A1 (en) | 2007-02-20 | 2008-02-20 | Multilayer printed wiring boards with copper filled through-holes |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE538629T1 true ATE538629T1 (de) | 2012-01-15 |
Family
ID=39705672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08725858T ATE538629T1 (de) | 2007-02-20 | 2008-02-20 | Mehrschichtige bestückte leiterplatten mit kupfergefüllten durchgangslöchern |
Country Status (5)
Country | Link |
---|---|
US (2) | US8250751B2 (de) |
EP (2) | EP2416635A1 (de) |
CN (1) | CN101641461B (de) |
AT (1) | ATE538629T1 (de) |
WO (1) | WO2008112068A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9913382B2 (en) * | 2015-04-23 | 2018-03-06 | Viasystems Technologies Corp. L.L.C. | Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap |
TWI711355B (zh) | 2019-12-10 | 2020-11-21 | 欣興電子股份有限公司 | 電路板及其製造方法 |
CN113660787B (zh) * | 2021-06-28 | 2023-08-25 | 广德博亚新星电子科技有限公司 | 一种能够使高频板侧面铜与基材齐平的制作方法、生产线及高频板 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5319159A (en) * | 1992-12-15 | 1994-06-07 | Sony Corporation | Double-sided printed wiring board and method of manufacture thereof |
US5830374A (en) | 1996-09-05 | 1998-11-03 | International Business Machines Corporation | Method for producing multi-layer circuit board and resulting article of manufacture |
US6141870A (en) * | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US6598291B2 (en) | 1998-03-20 | 2003-07-29 | Viasystems, Inc. | Via connector and method of making same |
US6242078B1 (en) * | 1998-07-28 | 2001-06-05 | Isola Laminate Systems Corp. | High density printed circuit substrate and method of fabrication |
MY144574A (en) * | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
US6409930B1 (en) * | 1999-11-01 | 2002-06-25 | Bmc Industries, Inc. | Lamination of circuit sub-elements while assuring registration |
JP2001267726A (ja) * | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | 配線基板の電解メッキ方法及び配線基板の電解メッキ装置 |
US6585904B2 (en) | 2001-02-15 | 2003-07-01 | Peter Kukanskis | Method for the manufacture of printed circuit boards with plated resistors |
US20040099441A1 (en) * | 2001-04-24 | 2004-05-27 | Akira Ichiryu | Printed circuit board,its manufacturing method and csp manufacturing method |
JP3910387B2 (ja) * | 2001-08-24 | 2007-04-25 | 新光電気工業株式会社 | 半導体パッケージ及びその製造方法並びに半導体装置 |
US7083901B2 (en) * | 2002-10-01 | 2006-08-01 | International Business Machines Corporation | Joining member for Z-interconnect in electronic devices without conductive paste |
KR20040104144A (ko) * | 2003-06-03 | 2004-12-10 | 삼성전기주식회사 | 솔더 레지스트 패턴 형성 방법 |
TWI335195B (en) * | 2003-12-16 | 2010-12-21 | Ngk Spark Plug Co | Multilayer wiring board |
KR100632560B1 (ko) * | 2004-08-05 | 2006-10-09 | 삼성전기주식회사 | 병렬적 인쇄회로기판 제조 방법 |
KR100632552B1 (ko) | 2004-12-30 | 2006-10-11 | 삼성전기주식회사 | 내부 비아홀의 필 도금 구조 및 그 제조 방법 |
US7834273B2 (en) * | 2005-07-07 | 2010-11-16 | Ibiden Co., Ltd. | Multilayer printed wiring board |
JP4671829B2 (ja) * | 2005-09-30 | 2011-04-20 | 富士通株式会社 | インターポーザ及び電子装置の製造方法 |
JP2007134364A (ja) * | 2005-11-08 | 2007-05-31 | Hitachi Cable Ltd | 多層配線基板の製造方法及び多層配線基板並びにそれを用いた電子装置 |
-
2008
- 2008-02-20 AT AT08725858T patent/ATE538629T1/de active
- 2008-02-20 WO PCT/US2008/002265 patent/WO2008112068A1/en active Application Filing
- 2008-02-20 CN CN200880005688.5A patent/CN101641461B/zh active Active
- 2008-02-20 EP EP11187947A patent/EP2416635A1/de not_active Withdrawn
- 2008-02-20 EP EP08725858A patent/EP2113038B1/de not_active Not-in-force
- 2008-02-20 US US12/070,811 patent/US8250751B2/en active Active
-
2012
- 2012-08-27 US US13/594,971 patent/US20130220675A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2113038B1 (de) | 2011-12-21 |
US20080196935A1 (en) | 2008-08-21 |
WO2008112068A1 (en) | 2008-09-18 |
EP2113038A4 (de) | 2010-06-09 |
CN101641461B (zh) | 2012-03-14 |
US20130220675A1 (en) | 2013-08-29 |
CN101641461A (zh) | 2010-02-03 |
EP2113038A1 (de) | 2009-11-04 |
EP2416635A1 (de) | 2012-02-08 |
US8250751B2 (en) | 2012-08-28 |
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