ATE306186T1 - Mehrlagige leiterplatte mit an den kontaktlöchern verringerten verlusten - Google Patents

Mehrlagige leiterplatte mit an den kontaktlöchern verringerten verlusten

Info

Publication number
ATE306186T1
ATE306186T1 AT04250909T AT04250909T ATE306186T1 AT E306186 T1 ATE306186 T1 AT E306186T1 AT 04250909 T AT04250909 T AT 04250909T AT 04250909 T AT04250909 T AT 04250909T AT E306186 T1 ATE306186 T1 AT E306186T1
Authority
AT
Austria
Prior art keywords
circuit board
transmission line
contact holes
layer circuit
reduced losses
Prior art date
Application number
AT04250909T
Other languages
English (en)
Inventor
Torben Baras
Alan Michael Lyons
Carsten Metz
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Application granted granted Critical
Publication of ATE306186T1 publication Critical patent/ATE306186T1/de

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G13/00—Falsework, forms, or shutterings for particular parts of buildings, e.g. stairs, steps, cornices, balconies foundations, sills
    • E04G13/02—Falsework, forms, or shutterings for particular parts of buildings, e.g. stairs, steps, cornices, balconies foundations, sills for columns or like pillars; Special tying or clamping means therefor
    • E04G13/023—Falsework, forms, or shutterings for particular parts of buildings, e.g. stairs, steps, cornices, balconies foundations, sills for columns or like pillars; Special tying or clamping means therefor with means for modifying the sectional dimensions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0248—Skew reduction or using delay lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AT04250909T 2003-03-24 2004-02-20 Mehrlagige leiterplatte mit an den kontaktlöchern verringerten verlusten ATE306186T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/395,956 US7013452B2 (en) 2003-03-24 2003-03-24 Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards

Publications (1)

Publication Number Publication Date
ATE306186T1 true ATE306186T1 (de) 2005-10-15

Family

ID=32824948

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04250909T ATE306186T1 (de) 2003-03-24 2004-02-20 Mehrlagige leiterplatte mit an den kontaktlöchern verringerten verlusten

Country Status (7)

Country Link
US (1) US7013452B2 (de)
EP (1) EP1463387B1 (de)
JP (1) JP2004289164A (de)
KR (1) KR20040084780A (de)
CN (1) CN1592549A (de)
AT (1) ATE306186T1 (de)
DE (1) DE602004000109T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7055119B2 (en) * 2003-07-31 2006-05-30 International Business Machines Corporation Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages
US7448909B2 (en) * 2004-02-13 2008-11-11 Molex Incorporated Preferential via exit structures with triad configuration for printed circuit boards
WO2006025354A1 (ja) * 2004-09-01 2006-03-09 Matsushita Electric Industrial Co., Ltd. ヒートポンプ
US7501586B2 (en) * 2004-10-29 2009-03-10 Intel Corporation Apparatus and method for improving printed circuit board signal layer transitions
CN1916915A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 改良过孔阻抗的方法
US20070211443A1 (en) * 2006-03-09 2007-09-13 Rockwell Automation Technologies, Inc. System and method for postponing application of customizing components in a final drive
US20080005896A1 (en) * 2006-07-05 2008-01-10 Teamchem Company Method for fabricating multi-layered flexible printed circuit board without via holes
US20080017305A1 (en) * 2006-07-21 2008-01-24 Teamchem Company Method for fabricating multi-layered printed circuit board without via holes
US7667980B2 (en) * 2006-10-10 2010-02-23 International Business Machines Corporation Printed circuit boards for countering signal distortion
US20090159326A1 (en) * 2007-12-19 2009-06-25 Richard Mellitz S-turn via and method for reducing signal loss in double-sided printed wiring boards
JP2009158815A (ja) * 2007-12-27 2009-07-16 Fujitsu Ltd 多層配線基板の製造方法および多層配線基板構造
US7949979B1 (en) * 2008-08-13 2011-05-24 Xilinx, Inc. Predicting induced crosstalk for the pins of a programmable logic device
EP2420115B1 (de) * 2009-04-13 2015-04-08 Hewlett-Packard Development Company, L.P. Rückbohrungsverifikationsmerkmal
US8143976B2 (en) * 2009-10-27 2012-03-27 Xilinx, Inc. High impedance electrical connection via
US8412497B1 (en) * 2010-09-07 2013-04-02 Xilinx, Inc. Predicting simultaneous switching output noise of an integrated circuit
JP6176917B2 (ja) * 2012-11-20 2017-08-09 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
US9860985B1 (en) * 2012-12-17 2018-01-02 Lockheed Martin Corporation System and method for improving isolation in high-density laminated printed circuit boards
US10103054B2 (en) * 2013-03-13 2018-10-16 Intel Corporation Coupled vias for channel cross-talk reduction
US9504159B2 (en) * 2014-01-31 2016-11-22 Intel Corporation Circuit component bridge device
CN108475876B (zh) * 2015-11-06 2021-11-30 安费诺富加宜（亚洲）私人有限公司 包括散热孔的电连接器
CN111226348B (zh) * 2017-10-17 2022-03-11 康普技术有限责任公司 用于具有多层基板的微波和毫米波通信系统的垂直过渡
WO2020112481A1 (en) * 2018-11-29 2020-06-04 Lockheed Martin Corporation Apparatus and method for impedance balancing of long radio frequency (rf) via
US11604261B2 (en) 2019-02-06 2023-03-14 Lockeed Martin Corporation Extended laser active ranging system, method and computer readable program product
US11924966B1 (en) * 2021-07-09 2024-03-05 Innovium, Inc. Reconfigurable circuit devices
US12490373B2 (en) * 2023-05-16 2025-12-02 Dell Products L.P. System and method to maintain signal integrity between multiple signal paths connecting two traces in a printed circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438297A (en) 1992-12-30 1995-08-01 Intel Corporation Electrical trace having a closed loop configuration
JPH09139611A (ja) 1995-11-15 1997-05-27 Alps Electric Co Ltd マイクロストリップ線路共振素子
US5646368A (en) 1995-11-30 1997-07-08 International Business Machines Corporation Printed circuit board with an integrated twisted pair conductor
US6388208B1 (en) * 1999-06-11 2002-05-14 Teradyne, Inc. Multi-connection via with electrically isolated segments
US6622370B1 (en) * 2000-04-13 2003-09-23 Raytheon Company Method for fabricating suspended transmission line
US6542048B1 (en) * 2000-04-13 2003-04-01 Raytheon Company Suspended transmission line with embedded signal channeling device
JP4098459B2 (ja) * 2000-05-23 2008-06-11 株式会社日立製作所 電気長を考慮した信号線路の配線方法
JP3903701B2 (ja) * 2000-08-17 2007-04-11 松下電器産業株式会社 多層回路基板とその製造方法

Also Published As

Publication number Publication date
DE602004000109D1 (de) 2005-11-10
CN1592549A (zh) 2005-03-09
EP1463387A1 (de) 2004-09-29
US20040188138A1 (en) 2004-09-30
KR20040084780A (ko) 2004-10-06
JP2004289164A (ja) 2004-10-14
US7013452B2 (en) 2006-03-14
DE602004000109T2 (de) 2006-06-14
EP1463387B1 (de) 2005-10-05

Similar Documents

Publication Publication Date Title
DE602004000109T2 (de) Mehrlagige Leiterplatte mit an den Kontaktlöchern verringerten Verlusten
US7239526B1 (en) Printed circuit board and method of reducing crosstalk in a printed circuit board
US8418357B2 (en) Printed circuit board layout method
EP1283662A4 (de) It-laminat-doppelseiten-leiterplatte und herstellungsverfahren dafür und mehrschichtige leiterplatte verwendend
TW200507722A (en) Technique for interconnecting multilayer circuit boards
US7789700B2 (en) Cable connector with a flat cable and a printed circuit board
ATE553636T1 (de) Leiterplattentopologie für eine hochfrequenzschaltung
TW200513162A (en) PCB and layout thereof
CA2110892A1 (en) Electrical Interconnection Method and Apparatus Utilizing Raised Connecting Means
EP1672970A3 (de) Mehrschicht Schaltungsplatte und sein Herstellungsverfahren
US20070075432A1 (en) Printed circuit board with differential pair arrangement
WO2004062037A3 (en) Connector and printed circuit board for reducing cross-talk
DE602005016814D1 (de) Enten
EP1811823A4 (de) Mehrschichtige leiterplatte
MY131415A (en) Semiconductor device
KR20090032834A (ko) 인쇄회로기판
DE60204640D1 (de) Koaxialverbinder zum Verbinden von Leiterplatten
ATE492924T1 (de) Mosaik-subarray und diesbezügliche schaltungen und techniken
ATE218761T1 (de) Koaxialverbinder zum verbinden von zwei leiterplatten
WO2004054333A3 (en) Cross connect via for multilayer printed circuit boards
DE60238886D1 (de) Übersprechdämpfung für Schneidklemmenanschlussblock
ATE495653T1 (de) Leiterplatte mit einer darauf aufgebrachten kontakthülse
TWI452954B (zh) 印刷電路板
PL1649549T3 (pl) Moduł do przyłączania przewodów dla płytek drukowanych
JP2002198108A (ja) 複数回線グリッドコネクタ

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties