HK1059843A1 - Low resistance polymer matrix fuse apparatus and method - Google Patents

Low resistance polymer matrix fuse apparatus and method

Info

Publication number
HK1059843A1
HK1059843A1 HK04101120A HK04101120A HK1059843A1 HK 1059843 A1 HK1059843 A1 HK 1059843A1 HK 04101120 A HK04101120 A HK 04101120A HK 04101120 A HK04101120 A HK 04101120A HK 1059843 A1 HK1059843 A1 HK 1059843A1
Authority
HK
Hong Kong
Prior art keywords
low resistance
polymer matrix
resistance polymer
fuse apparatus
matrix fuse
Prior art date
Application number
HK04101120A
Other languages
English (en)
Inventor
Bender Joan L Winnett
Robert Parker
Daniel M Manoukian
Original Assignee
Cooper Technologies Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooper Technologies Co filed Critical Cooper Technologies Co
Publication of HK1059843A1 publication Critical patent/HK1059843A1/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046Fuses formed as printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039Means for influencing the rupture process of the fusible element
    • H01H85/0047Heating means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02Manufacture of fuses
    • H01H69/022Manufacture of fuses of printed circuit fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039Means for influencing the rupture process of the fusible element
    • H01H85/0047Heating means
    • H01H85/006Heat reflective or insulating layer on the casing or on the fuse support
HK04101120A 2002-01-10 2004-02-17 Low resistance polymer matrix fuse apparatus and method HK1059843A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34809802P 2002-01-10 2002-01-10

Publications (1)

Publication Number Publication Date
HK1059843A1 true HK1059843A1 (en) 2004-07-16

Family

ID=27613225

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04101120A HK1059843A1 (en) 2002-01-10 2004-02-17 Low resistance polymer matrix fuse apparatus and method

Country Status (7)

Country Link
US (1) US7570148B2 (fr)
EP (1) EP1327999A3 (fr)
JP (1) JP2003263949A (fr)
KR (1) KR20030061353A (fr)
CN (1) CN1276454C (fr)
HK (1) HK1059843A1 (fr)
TW (1) TWI274363B (fr)

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US7385475B2 (en) * 2002-01-10 2008-06-10 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
US7436284B2 (en) * 2002-01-10 2008-10-14 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
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US7494596B2 (en) * 2003-03-21 2009-02-24 Hewlett-Packard Development Company, L.P. Measurement of etching
WO2005039256A1 (fr) * 2003-10-17 2005-04-28 Koninklijke Philips Electronics N.V. Carte de circuits imprimes avec un fusible
US7029228B2 (en) 2003-12-04 2006-04-18 General Electric Company Method and apparatus for convective cooling of side-walls of turbine nozzle segments
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JP4510858B2 (ja) * 2007-08-08 2010-07-28 釜屋電機株式会社 チップヒューズ及びその製造方法
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
US8203420B2 (en) * 2009-06-26 2012-06-19 Cooper Technologies Company Subminiature fuse with surface mount end caps and improved connectivity
JP5260592B2 (ja) * 2010-04-08 2013-08-14 デクセリアルズ株式会社 保護素子、バッテリ制御装置、及びバッテリパック
PL2408277T3 (pl) * 2010-07-16 2016-08-31 Schurter Ag Element bezpiecznikowy
US9847203B2 (en) * 2010-10-14 2017-12-19 Avx Corporation Low current fuse
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CN103650070A (zh) * 2011-04-07 2014-03-19 拜耳知识产权有限责任公司 导电聚合物熔断器
EP2828901B1 (fr) 2012-03-21 2017-01-04 Parker Hannifin Corporation Procédés de fabrication de rouleau à rouleau pour la production de dispositifs à polymère électroactif autoréparant
KR20150002811A (ko) 2012-04-12 2015-01-07 바이엘 머티리얼사이언스 아게 개선된 성능의 eap 트랜스듀서
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
JP5979654B2 (ja) * 2012-09-28 2016-08-24 釜屋電機株式会社 チップヒューズ及びその製造方法
WO2014066576A1 (fr) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Diode polymère
JP6294165B2 (ja) * 2014-06-19 2018-03-14 Koa株式会社 チップ型ヒューズ
CN104157518B (zh) * 2014-08-22 2016-09-21 Aem科技(苏州)股份有限公司 一种中空结构熔断器的制造方法
JP2017073373A (ja) 2015-10-09 2017-04-13 デクセリアルズ株式会社 ヒューズ素子
WO2017061458A1 (fr) * 2015-10-09 2017-04-13 デクセリアルズ株式会社 Dispositif fusible
EP3179495B1 (fr) * 2015-12-09 2018-05-02 ABB Schweiz AG Condensateur de puissance pour applications à haute pression
US10141150B2 (en) * 2016-02-17 2018-11-27 Littelfuse, Inc. High current one-piece fuse element and split body
CN105551905B (zh) * 2016-02-18 2017-11-21 Aem科技(苏州)股份有限公司 一种悬空熔丝型表面贴装熔断器及其制备方法
JP6452001B2 (ja) * 2016-06-08 2019-01-16 株式会社村田製作所 電子装置、及び電子装置の製造方法
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WO2020135914A1 (fr) 2018-12-27 2020-07-02 Schurter Ag Fusible
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ
US11217415B2 (en) * 2019-09-25 2022-01-04 Littelfuse, Inc. High breaking capacity chip fuse
EP3926647A3 (fr) * 2020-06-15 2022-03-16 Littelfuse, Inc. Méthode de revêtement en couche mince d'un dispositif ayant des liaisons fusibles et mouillables
WO2023099029A1 (fr) * 2021-11-30 2023-06-08 Eaton Intelligent Power Limited Fabrication de fusible imprimé en céramique

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Also Published As

Publication number Publication date
EP1327999A3 (fr) 2004-05-19
KR20030061353A (ko) 2003-07-18
JP2003263949A (ja) 2003-09-19
TW200402077A (en) 2004-02-01
EP1327999A2 (fr) 2003-07-16
CN1276454C (zh) 2006-09-20
TWI274363B (en) 2007-02-21
CN1447365A (zh) 2003-10-08
US7570148B2 (en) 2009-08-04
US20030142453A1 (en) 2003-07-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160110