HK1056791A1 - Metal powder - Google Patents

Metal powder

Info

Publication number
HK1056791A1
HK1056791A1 HK03109133A HK03109133A HK1056791A1 HK 1056791 A1 HK1056791 A1 HK 1056791A1 HK 03109133 A HK03109133 A HK 03109133A HK 03109133 A HK03109133 A HK 03109133A HK 1056791 A1 HK1056791 A1 HK 1056791A1
Authority
HK
Hong Kong
Prior art keywords
metal powder
powder
metal
Prior art date
Application number
HK03109133A
Other languages
English (en)
Inventor
Morishige Uchida
Original Assignee
Kawatetsu Mining
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawatetsu Mining filed Critical Kawatetsu Mining
Publication of HK1056791A1 publication Critical patent/HK1056791A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Ceramic Capacitors (AREA)
HK03109133A 2001-12-21 2003-12-15 Metal powder HK1056791A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001389998 2001-12-21
JP2002265835 2002-09-11
JP2002338014A JP4020764B2 (ja) 2001-12-21 2002-11-21 分散性に優れた金属超微粉スラリー

Publications (1)

Publication Number Publication Date
HK1056791A1 true HK1056791A1 (en) 2004-02-27

Family

ID=27347985

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03109133A HK1056791A1 (en) 2001-12-21 2003-12-15 Metal powder

Country Status (9)

Country Link
US (1) US6881239B2 (xx)
EP (1) EP1323485B1 (xx)
JP (1) JP4020764B2 (xx)
KR (1) KR100652325B1 (xx)
CN (1) CN1288670C (xx)
CA (1) CA2415035C (xx)
DE (1) DE60204650T2 (xx)
HK (1) HK1056791A1 (xx)
TW (1) TWI245295B (xx)

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JP4495644B2 (ja) * 2004-07-30 2010-07-07 Ｊｆｅミネラル株式会社 金属超微粉スラリー
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JP4581584B2 (ja) * 2004-09-17 2010-11-17 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
PL1791702T3 (pl) * 2005-01-14 2011-08-31 Cabot Corp Zabezpieczenia, ich zastosowanie i sposób ich wytwarzania
US7533361B2 (en) * 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076611A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features
WO2006076614A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
KR100790856B1 (ko) * 2005-07-15 2008-01-03 삼성전기주식회사 인산계 분산제를 포함하는 적층 세라믹 콘덴서
KR100768706B1 (ko) * 2006-06-08 2007-10-19 삼성전기주식회사 잉크젯용 금속 잉크 조성물
KR100777662B1 (ko) * 2006-06-14 2007-11-29 삼성전기주식회사 잉크젯용 전도성 잉크 조성물
EP2050792B1 (en) * 2006-08-09 2013-11-20 DIC Corporation Metal nanoparticle dispersion and production process of the same
DE102007037079A1 (de) * 2006-10-25 2008-04-30 Bayer Materialscience Ag Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
EP1987960B1 (en) 2007-05-03 2013-10-23 Teknologian tutkimuskeskus VTT Conductive ink and conductor
JP2011011182A (ja) * 2009-07-06 2011-01-20 Sanyo Chem Ind Ltd 分散剤
JP5890603B2 (ja) * 2009-08-28 2016-03-22 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子とその凝集体、金属ナノ粒子分散体、それを用いて形成された部材
DE112010004973T5 (de) * 2009-12-22 2013-02-28 Dic Corp. Leitpaste für Siebdruckverfahren
WO2011148520A1 (ja) * 2010-05-26 2011-12-01 第一工業製薬株式会社 分散剤および分散体組成物
DE102011077907B4 (de) * 2011-06-21 2013-07-11 Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. Verfahren zur herstellung von gedruckten magnetischen funktionselementen für widerstandssensoren und gedruckte magnetische funktionselemente
JP5795949B2 (ja) * 2011-11-25 2015-10-14 第一工業製薬株式会社 光学材料用樹脂組成物
CN102664057B (zh) * 2012-05-17 2013-11-27 合肥工业大学 一种片式陶瓷电容器表层电极用导电铜浆料及其制备方法
JP5969354B2 (ja) * 2012-10-31 2016-08-17 新日鉄住金化学株式会社 分散性ニッケル微粒子スラリーの製造方法
US9085699B2 (en) * 2013-01-22 2015-07-21 Eastman Kodak Company Silver metal nanoparticle composition
JP6398847B2 (ja) * 2014-04-16 2018-10-03 信越化学工業株式会社 酸化チタン固溶体有機溶剤分散液、その製造方法、及びコーティング剤
CN104174841B (zh) * 2014-08-18 2016-08-24 东莞市戍普电子科技有限公司 超高容mlcc用镍浆的制作方法及镍浆、mlcc
JP6222373B2 (ja) * 2014-09-26 2017-11-01 住友金属鉱山株式会社 ニッケルペースト及びニッケルペーストの製造方法
CN105161221B (zh) * 2015-10-20 2017-05-24 西安创联光电新材料有限公司 一种压电陶瓷用铜电子浆料的制备方法
JP6897278B2 (ja) * 2016-04-25 2021-06-30 住友金属鉱山株式会社 ニッケルペースト及びニッケルペーストの製造方法
JP7064684B2 (ja) * 2017-02-01 2022-05-11 住友金属鉱山株式会社 内部電極用ペーストとその製造方法、及び積層セラミックコンデンサ
JP7263694B2 (ja) * 2017-12-07 2023-04-25 住友金属鉱山株式会社 積層セラミックコンデンサ用ニッケルペースト
KR20210109531A (ko) * 2019-01-08 2021-09-06 스미토모 긴조쿠 고잔 가부시키가이샤 적층 세라믹 콘덴서용 니켈 페이스트
TWI795509B (zh) * 2019-01-14 2023-03-11 日商住友金屬鑛山股份有限公司 積層陶瓷電容器用鎳糊料
CN110340374A (zh) * 2019-08-06 2019-10-18 攀钢集团研究院有限公司 钒铬钛粉的制备方法
CN113270270B (zh) * 2021-05-27 2022-04-05 广东省先进陶瓷材料科技有限公司 一种抗氧化镍浆及其制备方法与应用

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JP4385457B2 (ja) * 1999-11-19 2009-12-16 堺化学工業株式会社 微細球状金属ニッケル微粉末の製造方法
WO2001057885A1 (fr) 2000-01-31 2001-08-09 Toho Titanium Co., Ltd. Dispersion de nickel pulverulent, son procede de production et procede de production de pate conductrice

Also Published As

Publication number Publication date
US20030145680A1 (en) 2003-08-07
TWI245295B (en) 2005-12-11
EP1323485B1 (en) 2005-06-15
DE60204650D1 (de) 2005-07-21
DE60204650T2 (de) 2005-11-03
CN1288670C (zh) 2006-12-06
CA2415035A1 (en) 2003-06-21
KR100652325B1 (ko) 2006-11-29
TW200301491A (en) 2003-07-01
JP2004158397A (ja) 2004-06-03
KR20030053036A (ko) 2003-06-27
JP4020764B2 (ja) 2007-12-12
CA2415035C (en) 2009-04-21
CN1427422A (zh) 2003-07-02
US6881239B2 (en) 2005-04-19
EP1323485A1 (en) 2003-07-02

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20171223