HK1050377A1 - Composition and method for planarizing surfaces. - Google Patents
Composition and method for planarizing surfaces.Info
- Publication number
- HK1050377A1 HK1050377A1 HK03102537A HK03102537A HK1050377A1 HK 1050377 A1 HK1050377 A1 HK 1050377A1 HK 03102537 A HK03102537 A HK 03102537A HK 03102537 A HK03102537 A HK 03102537A HK 1050377 A1 HK1050377 A1 HK 1050377A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- composition
- planarizing
- polishing
- abrasive particles
- planarizing surfaces
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000002245 particle Substances 0.000 abstract 3
- 238000005498 polishing Methods 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000012876 topography Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Chemically Coating (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/440,401 US6293848B1 (en) | 1999-11-15 | 1999-11-15 | Composition and method for planarizing surfaces |
US09/625,142 US6527817B1 (en) | 1999-11-15 | 2000-07-25 | Composition and method for planarizing surfaces |
PCT/US2000/031653 WO2001036554A1 (fr) | 1999-11-15 | 2000-11-15 | Composition et procede de planarisation de surfaces |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1050377A1 true HK1050377A1 (en) | 2003-06-20 |
Family
ID=27032408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03102537A HK1050377A1 (en) | 1999-11-15 | 2003-04-09 | Composition and method for planarizing surfaces. |
Country Status (11)
Country | Link |
---|---|
US (2) | US6527817B1 (fr) |
EP (1) | EP1250390B1 (fr) |
JP (1) | JP4943613B2 (fr) |
KR (1) | KR100732078B1 (fr) |
CN (1) | CN1160430C (fr) |
AT (1) | ATE258577T1 (fr) |
AU (1) | AU1660001A (fr) |
DE (1) | DE60008025T2 (fr) |
HK (1) | HK1050377A1 (fr) |
TW (1) | TW524836B (fr) |
WO (1) | WO2001036554A1 (fr) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2045307A1 (fr) * | 2000-05-12 | 2009-04-08 | Nissan Chemical Industries, Ltd. | Composition de polissage |
US6468137B1 (en) | 2000-09-07 | 2002-10-22 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an oxidized halide-containing polishing system |
TW591089B (en) * | 2001-08-09 | 2004-06-11 | Cheil Ind Inc | Slurry composition for use in chemical mechanical polishing of metal wiring |
US6953389B2 (en) * | 2001-08-09 | 2005-10-11 | Cheil Industries, Inc. | Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching |
US20050028449A1 (en) * | 2001-09-03 | 2005-02-10 | Norihiko Miyata | Polishing composition |
US6755721B2 (en) | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
US20040144038A1 (en) * | 2002-12-09 | 2004-07-29 | Junaid Ahmed Siddiqui | Composition and associated method for oxide chemical mechanical planarization |
US7422730B2 (en) | 2003-04-02 | 2008-09-09 | Saint-Gobain Ceramics & Plastics, Inc. | Nanoporous ultrafine α-alumina powders and sol-gel process of preparing same |
US7306748B2 (en) | 2003-04-25 | 2007-12-11 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machining ceramics |
US8025808B2 (en) | 2003-04-25 | 2011-09-27 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machine ceramics |
CA2532114A1 (fr) * | 2003-07-11 | 2005-01-27 | W.R. Grace & Co.-Conn. | Particules abrasives pour polissage mecanico-chimique |
JP4974447B2 (ja) * | 2003-11-26 | 2012-07-11 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
JP4249008B2 (ja) * | 2003-12-25 | 2009-04-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
JP2005244123A (ja) * | 2004-02-27 | 2005-09-08 | Fujimi Inc | 研磨用組成物 |
JP4267546B2 (ja) | 2004-04-06 | 2009-05-27 | 花王株式会社 | 基板の製造方法 |
JP4027929B2 (ja) * | 2004-11-30 | 2007-12-26 | 花王株式会社 | 半導体基板用研磨液組成物 |
US8353740B2 (en) | 2005-09-09 | 2013-01-15 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive hydrocarbon fluid |
US7708904B2 (en) | 2005-09-09 | 2010-05-04 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive hydrocarbon fluid |
KR20070041330A (ko) * | 2005-10-14 | 2007-04-18 | 가오가부시끼가이샤 | 반도체 기판용 연마액 조성물 |
CA2672146C (fr) | 2006-12-20 | 2012-08-21 | Saint-Gobain Ceramics & Plastics, Inc. | Procedes pour usiner des pieces a travailler inorganiques, non metalliques |
KR101418626B1 (ko) * | 2007-02-27 | 2014-07-14 | 히타치가세이가부시끼가이샤 | 금속용 연마액 및 연마방법 |
AU2008308583B2 (en) * | 2007-10-05 | 2012-03-08 | Saint-Gobain Ceramics & Plastics, Inc. | Polishing of sapphire with composite slurries |
CA2700408A1 (fr) * | 2007-10-05 | 2009-04-09 | Saint-Gobain Ceramics & Plastics, Inc. | Particules de carbure de silicium ameliorees, procedes de fabrication et procedes d'utilisation de celles-ci |
US8523968B2 (en) * | 2008-12-23 | 2013-09-03 | Saint-Gobain Abrasives, Inc. | Abrasive article with improved packing density and mechanical properties and method of making |
US20120264303A1 (en) * | 2011-04-15 | 2012-10-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing slurry, system and method |
JP5945123B2 (ja) * | 2012-02-01 | 2016-07-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2013247341A (ja) | 2012-05-29 | 2013-12-09 | Fujimi Inc | 研磨用組成物並びにそれを用いた研磨方法及びデバイス製造方法 |
MA35300B1 (fr) * | 2013-01-18 | 2014-08-01 | Univ Hassan 1Er Settat | Optimisation des phosphates pour les traitements de surface et les opérations de polissage |
SG10201710610PA (en) * | 2013-07-05 | 2018-02-27 | Wako Pure Chem Ind Ltd | Etching agent, etching method and etching agent preparation liquid |
US20150114928A1 (en) * | 2013-10-30 | 2015-04-30 | Jia-Ni Chu | Abrasive Particles for Chemical Mechanical Polishing |
US9551075B2 (en) * | 2014-08-04 | 2017-01-24 | Sinmat, Inc. | Chemical mechanical polishing of alumina |
CN107075310B (zh) * | 2014-10-21 | 2019-04-02 | 嘉柏微电子材料股份公司 | 钴凹陷控制剂 |
US10253216B2 (en) | 2016-07-01 | 2019-04-09 | Versum Materials Us, Llc | Additives for barrier chemical mechanical planarization |
US11286403B2 (en) | 2018-07-20 | 2022-03-29 | Dongjin Semichem Co., Ltd | Chemical mechanical polishing composition, chemical mechanical polishing slurry and method for polishing substrate |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4057939A (en) | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
US4169337A (en) | 1978-03-30 | 1979-10-02 | Nalco Chemical Company | Process for polishing semi-conductor materials |
US4304575A (en) | 1980-03-20 | 1981-12-08 | Nalco Chemical Company | Preparation of large particle silica sols |
US4462188A (en) | 1982-06-21 | 1984-07-31 | Nalco Chemical Company | Silica sol compositions for polishing silicon wafers |
US4954142A (en) | 1989-03-07 | 1990-09-04 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
JP2877440B2 (ja) * | 1989-06-09 | 1999-03-31 | ナルコ ケミカル カンパニー | コロイド状シリカ研磨性スラリー |
US4959113C1 (en) | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
US5137544A (en) | 1990-04-10 | 1992-08-11 | Rockwell International Corporation | Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing |
US5228886A (en) | 1990-10-09 | 1993-07-20 | Buehler, Ltd. | Mechanochemical polishing abrasive |
US5264010A (en) | 1992-04-27 | 1993-11-23 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
US5575837A (en) * | 1993-04-28 | 1996-11-19 | Fujimi Incorporated | Polishing composition |
BE1007281A3 (nl) | 1993-07-12 | 1995-05-09 | Philips Electronics Nv | Werkwijze voor het polijsten van een oppervlak van koper of een in hoofdzaak koper bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze, röntgenstralingcollimerend element en röntgenstralingreflecterend element, beide voorzien van een volgens de werkwijze gepolijst oppervlak en polijstmiddel geschikt voor toepassing in de werkwijze. |
US5340370A (en) | 1993-11-03 | 1994-08-23 | Intel Corporation | Slurries for chemical mechanical polishing |
US5605490A (en) | 1994-09-26 | 1997-02-25 | The United States Of America As Represented By The Secretary Of The Army | Method of polishing langasite |
US5693239A (en) | 1995-10-10 | 1997-12-02 | Rodel, Inc. | Polishing slurries comprising two abrasive components and methods for their use |
JP3359479B2 (ja) | 1995-11-07 | 2002-12-24 | 三井金属鉱業株式会社 | 研磨材、その製造方法及び研磨方法 |
JPH09190626A (ja) | 1995-11-10 | 1997-07-22 | Kao Corp | 研磨材組成物、磁気記録媒体用基板及びその製造方法並びに磁気記録媒体 |
DE69611653T2 (de) | 1995-11-10 | 2001-05-03 | Tokuyama Corp | Poliersuspensionen und Verfahren zu ihrer Herstellung |
JP3514908B2 (ja) | 1995-11-13 | 2004-04-05 | 株式会社東芝 | 研磨剤 |
US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
JP4052607B2 (ja) * | 1998-04-20 | 2008-02-27 | 株式会社東芝 | 研磨剤及び半導体基板のポリッシング方法 |
US6159076A (en) * | 1998-05-28 | 2000-12-12 | Komag, Inc. | Slurry comprising a ligand or chelating agent for polishing a surface |
US6132298A (en) | 1998-11-25 | 2000-10-17 | Applied Materials, Inc. | Carrier head with edge control for chemical mechanical polishing |
JP2000160139A (ja) * | 1998-12-01 | 2000-06-13 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
US6293848B1 (en) * | 1999-11-15 | 2001-09-25 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
-
2000
- 2000-07-25 US US09/625,142 patent/US6527817B1/en not_active Expired - Lifetime
- 2000-11-15 DE DE60008025T patent/DE60008025T2/de not_active Expired - Lifetime
- 2000-11-15 WO PCT/US2000/031653 patent/WO2001036554A1/fr active IP Right Grant
- 2000-11-15 AU AU16600/01A patent/AU1660001A/en not_active Abandoned
- 2000-11-15 AT AT00979195T patent/ATE258577T1/de not_active IP Right Cessation
- 2000-11-15 EP EP00979195A patent/EP1250390B1/fr not_active Expired - Lifetime
- 2000-11-15 KR KR1020027006172A patent/KR100732078B1/ko active IP Right Grant
- 2000-11-15 JP JP2001539035A patent/JP4943613B2/ja not_active Expired - Fee Related
- 2000-11-15 CN CNB008157227A patent/CN1160430C/zh not_active Expired - Fee Related
- 2000-12-01 TW TW089124166A patent/TW524836B/zh not_active IP Right Cessation
-
2003
- 2003-01-10 US US10/340,561 patent/US6716755B2/en not_active Expired - Fee Related
- 2003-04-09 HK HK03102537A patent/HK1050377A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6527817B1 (en) | 2003-03-04 |
JP2003514949A (ja) | 2003-04-22 |
CN1399668A (zh) | 2003-02-26 |
KR100732078B1 (ko) | 2007-06-27 |
US6716755B2 (en) | 2004-04-06 |
AU1660001A (en) | 2001-05-30 |
CN1160430C (zh) | 2004-08-04 |
EP1250390B1 (fr) | 2004-01-28 |
EP1250390A1 (fr) | 2002-10-23 |
KR20020056913A (ko) | 2002-07-10 |
DE60008025T2 (de) | 2004-06-09 |
ATE258577T1 (de) | 2004-02-15 |
TW524836B (en) | 2003-03-21 |
DE60008025D1 (de) | 2004-03-04 |
JP4943613B2 (ja) | 2012-05-30 |
WO2001036554A1 (fr) | 2001-05-25 |
US20030124852A1 (en) | 2003-07-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CHRG | Changes in the register |
Free format text: CORRECTION OF THE NAME OF THE INVENTOR FROM BRAIN L. MUELLER TO BRIAN L. MUELLER |
|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20111115 |