TW372327B - Chemical mechanical abrasive composition for use in semiconductor processing - Google Patents

Chemical mechanical abrasive composition for use in semiconductor processing

Info

Publication number
TW372327B
TW372327B TW087100015A TW87100015A TW372327B TW 372327 B TW372327 B TW 372327B TW 087100015 A TW087100015 A TW 087100015A TW 87100015 A TW87100015 A TW 87100015A TW 372327 B TW372327 B TW 372327B
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
abrasive composition
semiconductor processing
mechanical abrasive
weight
Prior art date
Application number
TW087100015A
Other languages
Chinese (zh)
Inventor
Tsung-Ho Lee
Original Assignee
Epoch Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epoch Material Co Ltd filed Critical Epoch Material Co Ltd
Priority to TW087100015A priority Critical patent/TW372327B/en
Application granted granted Critical
Publication of TW372327B publication Critical patent/TW372327B/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A chemical-mechanical abrasive composition for use in polishing the surface of a semiconductor wafer comprises 2-20% by weight of an abrasive particle, and 0.01-10% by weight of an additive selected from nitroalcohols, and aminosulfonic acids and the salts thereof.
TW087100015A 1998-01-02 1998-01-02 Chemical mechanical abrasive composition for use in semiconductor processing TW372327B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW087100015A TW372327B (en) 1998-01-02 1998-01-02 Chemical mechanical abrasive composition for use in semiconductor processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087100015A TW372327B (en) 1998-01-02 1998-01-02 Chemical mechanical abrasive composition for use in semiconductor processing

Publications (1)

Publication Number Publication Date
TW372327B true TW372327B (en) 1999-10-21

Family

ID=57941629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087100015A TW372327B (en) 1998-01-02 1998-01-02 Chemical mechanical abrasive composition for use in semiconductor processing

Country Status (1)

Country Link
TW (1) TW372327B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103595376B (en) * 2012-08-13 2017-06-23 快捷韩国半导体有限公司 Piezoelectric driving circuit and its driving method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103595376B (en) * 2012-08-13 2017-06-23 快捷韩国半导体有限公司 Piezoelectric driving circuit and its driving method

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