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Application filed by Epoch Material Co LtdfiledCriticalEpoch Material Co Ltd
Priority to TW087100015ApriorityCriticalpatent/TW372327B/en
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Publication of TW372327BpublicationCriticalpatent/TW372327B/en
A chemical-mechanical abrasive composition for use in polishing the surface of a semiconductor wafer comprises 2-20% by weight of an abrasive particle, and 0.01-10% by weight of an additive selected from nitroalcohols, and aminosulfonic acids and the salts thereof.
TW087100015A1998-01-021998-01-02Chemical mechanical abrasive composition for use in semiconductor processing
TW372327B
(en)