HK1041863B - 具有低公差積累的晶片載體及其組裝方法 - Google Patents

具有低公差積累的晶片載體及其組裝方法

Info

Publication number
HK1041863B
HK1041863B HK02103837.9A HK02103837A HK1041863B HK 1041863 B HK1041863 B HK 1041863B HK 02103837 A HK02103837 A HK 02103837A HK 1041863 B HK1041863 B HK 1041863B
Authority
HK
Hong Kong
Prior art keywords
assembling
same
wafer carrier
low tolerance
tolerance build
Prior art date
Application number
HK02103837.9A
Other languages
English (en)
Other versions
HK1041863A1 (en
Inventor
格雷戈里‧W‧博雷斯
邁克爾‧C‧扎布卡
Original Assignee
恩特格里斯公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 恩特格里斯公司 filed Critical 恩特格里斯公司
Publication of HK1041863A1 publication Critical patent/HK1041863A1/xx
Publication of HK1041863B publication Critical patent/HK1041863B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Connection Of Plates (AREA)
HK02103837.9A 1998-07-10 2002-05-22 具有低公差積累的晶片載體及其組裝方法 HK1041863B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9228098P 1998-07-10 1998-07-10
US09/349,323 US6216874B1 (en) 1998-07-10 1999-07-08 Wafer carrier having a low tolerance build-up
PCT/US1999/015575 WO2000003416A2 (en) 1998-07-10 1999-07-09 A wafer carrier having a low tolerance build-up

Publications (2)

Publication Number Publication Date
HK1041863A1 HK1041863A1 (en) 2002-07-26
HK1041863B true HK1041863B (zh) 2004-04-16

Family

ID=26785481

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02103837.9A HK1041863B (zh) 1998-07-10 2002-05-22 具有低公差積累的晶片載體及其組裝方法

Country Status (8)

Country Link
US (2) US6216874B1 (zh)
EP (1) EP1097091A4 (zh)
JP (1) JP2003524550A (zh)
KR (1) KR100550076B1 (zh)
CN (1) CN1126702C (zh)
AU (1) AU5094399A (zh)
HK (1) HK1041863B (zh)
WO (1) WO2000003416A2 (zh)

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US9463831B2 (en) 2013-09-09 2016-10-11 GM Global Technology Operations LLC Elastic tube alignment and fastening system for providing precise alignment and fastening of components
US9457845B2 (en) 2013-10-02 2016-10-04 GM Global Technology Operations LLC Lobular elastic tube alignment and retention system for providing precise alignment of components
US9511802B2 (en) 2013-10-03 2016-12-06 GM Global Technology Operations LLC Elastically averaged alignment systems and methods
US9669774B2 (en) 2013-10-11 2017-06-06 GM Global Technology Operations LLC Reconfigurable vehicle interior assembly
US9481317B2 (en) 2013-11-15 2016-11-01 GM Global Technology Operations LLC Elastically deformable clip and method
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US9428123B2 (en) 2013-12-12 2016-08-30 GM Global Technology Operations LLC Alignment and retention system for a flexible assembly
US9216704B2 (en) 2013-12-17 2015-12-22 GM Global Technology Operations LLC Elastically averaged strap systems and methods
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US9238488B2 (en) 2013-12-20 2016-01-19 GM Global Technology Operations LLC Elastically averaged alignment systems and methods
US9541113B2 (en) 2014-01-09 2017-01-10 GM Global Technology Operations LLC Elastically averaged alignment systems and methods
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US9428046B2 (en) 2014-04-02 2016-08-30 GM Global Technology Operations LLC Alignment and retention system for laterally slideably engageable mating components
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USD776942S1 (en) * 2015-03-19 2017-01-24 3M Innovative Properties Company Display base
USD850095S1 (en) * 2016-05-23 2019-06-04 Medical Depot, Inc. Base for a tripod cane
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Also Published As

Publication number Publication date
HK1041863A1 (en) 2002-07-26
US6216874B1 (en) 2001-04-17
KR100550076B1 (ko) 2006-02-09
KR20010074691A (ko) 2001-08-09
EP1097091A2 (en) 2001-05-09
WO2000003416A9 (en) 2000-12-07
US6520338B2 (en) 2003-02-18
CN1126702C (zh) 2003-11-05
AU5094399A (en) 2000-02-01
JP2003524550A (ja) 2003-08-19
WO2000003416A3 (en) 2000-06-29
CN1328521A (zh) 2001-12-26
US20020125169A1 (en) 2002-09-12
EP1097091A4 (en) 2004-09-15
WO2000003416A2 (en) 2000-01-20

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090709