JP4467977B2 - 半導体ウェハ運搬容器のためのウェハ支持体取付け - Google Patents
半導体ウェハ運搬容器のためのウェハ支持体取付け Download PDFInfo
- Publication number
- JP4467977B2 JP4467977B2 JP2003543922A JP2003543922A JP4467977B2 JP 4467977 B2 JP4467977 B2 JP 4467977B2 JP 2003543922 A JP2003543922 A JP 2003543922A JP 2003543922 A JP2003543922 A JP 2003543922A JP 4467977 B2 JP4467977 B2 JP 4467977B2
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- JP
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- Prior art keywords
- wafer
- housing
- wafer support
- closed
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/4984—Retaining clearance for motion between assembled parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/4984—Retaining clearance for motion between assembled parts
- Y10T29/49844—Through resilient media
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49998—Work holding
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Description
本発明の幾つかの実施形態の別の目的および利点は、静電荷を散逸させるための接地電気路を維持する望ましい特性を有するウェハ支持体を提供することにある。
ハ支持体の、上縁と反対側の縁には堅固な取付方法が用いられる。この縁に堅固な取付を用いることにより、容器底部に取り付けられた機械インタフェースが、処理中にウェハディスクを正確に配置するための基準面として用いられることができる。公差スタッキングによる影響を最小にし、かつ導電性を高めるために、ウェハ支持体の底縁の一部が筐体底部の穴を通って延在し、動的連結部に直接締結されることが好ましい。
はz軸を中心とした回転に関する本文中の記載は、いずれもこれらの座標軸に基づいている。y軸は、ウェハの容器への挿入、および容器からの取出しの方向における容器の前後方向に延在し、z軸は鉛直方向に延在し、x軸は、z軸およびy軸に対して垂直であり、かつ、容器の側方から側方へ横方向に延在する。
しにくいことが、ウェハ支持体がz軸を中心に回転運動することへの抵抗ももたらす。
材190,196を押し、それにより、締結具187,191、および、締結具が連結されたウェハ支持体122に伝達される上向きの力の量を大幅に低減する。
Claims (13)
- 少なくとも、上部、底部、1対の対向する側部、背部、開放前部、および、開放前部を閉鎖するためのドアを有する筐体部と、
前記筐体部の内側に配置された1対のウェハ支持体とを備え、該ウェハ支持体はスロットを画成するための鉛直方向に積み重ねられた複数の棚を形成し、各ウェハ支持体は底縁、上縁、底縁に形成された複数の締結ボス、および、上縁に配置された複数の板バネを有し、前記板バネの各々は前記ウェハ支持体と結合されて支点を形成する第1の端部と締結ボスを有する第2の端部とを有し、前記ウェハ支持体の各々の底縁は前記筐体部の底部に前記複数の締結ボスにより固定され、前記板バネの各々の締結ボスは前記筐体部の上部に取り付けられている、ウェハ容器。 - 前記筐体部の底部に動的連結部をさらに有し、各ウェハ支持体の底縁における前記複数の締結ボスの各々は前記筐体部の底部の穴に延在し、かつ前記動的連結部と接触する請求項1に記載のウェハ容器。
- 前記ウェハ支持体の各々、動的連結部、および、前記板バネの各々が導電性材料から形成されている請求項2に記載のウェハ容器。
- 導電性材料が導電性プラスチックである請求項3に記載のウェハ容器。
- 少なくとも閉鎖上部、閉鎖底部、1対の対向する閉鎖側部、閉鎖背部、開放前部、および、開放前部を閉鎖するためのドアを有する筐体部と、
前記筐体部の内側に配置された1対のウェハ支持体と、該ウェハ支持体はウェハスロットを画成するための鉛直方向に積み重ねられた複数の棚を形成することと、各ウェハ支持体は底縁および上縁を有し、前記上縁が前記筐体部の前記閉鎖上部に弾性的に締結され、前記底縁が前記筐体部の前記閉鎖底部に堅固に固定されることとを備え、
各ウェハ支持体が、筐体部の底部、対向する側部、背部、および前部に対して横方向、前後方向および鉛直方向に移動しないように堅固に拘束され、これにより、各ウェハ支持体が、前記筐体部の前記上部の歪みおよび鉛直方向の相対移動から弾性的に隔離されている、ウェハ容器。 - 動的連結部をさらに備え、前記動的連結部が前記筐体部の前記閉鎖底部に配置され、各ウェハ支持体が前記動的連結部に直接固定されている請求項5に記載のウェハ容器。
- 前記ウェハ支持体の各々、動的連結部、および、前記板バネの各々が導電性材料から形成されている請求項6に記載のウェハ容器。
- 導電性材料が導電性プラスチックである請求項7に記載のウェハ容器。
- 筐体部を含むウェハ容器において、前記筐体部は複数のウェハを収容しかつ保持するための開放前部と開放前部を閉鎖するためのドアとを有し、前記筐体部は閉鎖上部、閉鎖底部、1対の対向する閉鎖側部、閉鎖背部、および、開放前部を有し、同筐体部はさらに、筐体部の内側に配置された1対のウェハ支持体を含み、各ウェハ支持体は上縁および底縁を有し、かつウェハ着座位置を画成する複数の棚を含み、ウェハ支持体の各々は閉鎖底部に堅固に取り付けられているとともに閉鎖上部に弾性的に取り付けられている、ウェハ容器。
- ウェハ支持体の各々が閉鎖上部に、閉鎖上部とウェハ支持体の各々の上縁との間に延在する弾性的に柔軟なプラスチックコネクタにより弾性的に取り付けられた請求項9に記載のウェハ容器。
- 弾性的に柔軟なプラスチックコネクタの各々が、閉鎖上部の取付点からウェハ支持体の取付点に延在する延長部を有し、前記延長部の水平成分の長さが鉛直成分の長さよりも長い請求項10に記載のウェハ容器。
- 弾性的に柔軟なプラスチックコネクタの各々が平坦なバーを含み、バーの幅がバーの厚さよりも大きく、バーの長さがバーの幅よりも大きい請求項10に記載のウェハ容器。
- ウェハ支持体の各々が閉鎖上部に、閉鎖上部とウェハ支持体の各々の上縁との間に延在する細長い板バネとして構成された弾性的に柔軟なプラスチックコネクタにより弾性的に取り付けられた請求項9に記載のウェハ容器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33268701P | 2001-11-14 | 2001-11-14 | |
PCT/US2002/036407 WO2003042073A1 (en) | 2001-11-14 | 2002-11-13 | Wafer support attachment for a semi-conductor wafer transport container |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005509304A JP2005509304A (ja) | 2005-04-07 |
JP4467977B2 true JP4467977B2 (ja) | 2010-05-26 |
Family
ID=23299389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003543922A Expired - Lifetime JP4467977B2 (ja) | 2001-11-14 | 2002-11-13 | 半導体ウェハ運搬容器のためのウェハ支持体取付け |
Country Status (8)
Country | Link |
---|---|
US (2) | US6811029B2 (ja) |
EP (1) | EP1446338A1 (ja) |
JP (1) | JP4467977B2 (ja) |
KR (1) | KR100909747B1 (ja) |
CN (1) | CN1298599C (ja) |
MY (1) | MY135079A (ja) |
TW (1) | TWI283452B (ja) |
WO (1) | WO2003042073A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1446338A1 (en) * | 2001-11-14 | 2004-08-18 | Entegris, Inc. | Wafer support attachment for a semi-conductor wafer transport container |
US7201276B2 (en) * | 2003-11-07 | 2007-04-10 | Entegris, Inc. | Front opening substrate container with bottom plate |
JP2005256983A (ja) * | 2004-03-12 | 2005-09-22 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
CN1313331C (zh) * | 2004-08-30 | 2007-05-02 | 财团法人工业技术研究院 | 洁净容器结构 |
US8452966B1 (en) * | 2005-10-26 | 2013-05-28 | Adobe Systems Incorporated | Methods and apparatus for verifying a purported user identity |
JP2007123673A (ja) * | 2005-10-31 | 2007-05-17 | Asyst Shinko Inc | 物品収納用容器の防振機構 |
JP4827500B2 (ja) * | 2005-11-16 | 2011-11-30 | 信越ポリマー株式会社 | 梱包体 |
US20080299520A1 (en) * | 2005-12-29 | 2008-12-04 | Ali Mahfuza B | Foamable Dental Compositions and Methods |
FR2902235B1 (fr) * | 2006-06-09 | 2008-10-31 | Alcatel Sa | Dispositif de transport, de stockage et de transfert de substrats |
WO2008029796A1 (fr) | 2006-09-08 | 2008-03-13 | Ntn Corporation | Roulement à rouleaux, segment d'arrêt pour roulement à rouleaux de support d'arbre d'aéromoteur, et une structure de support d'arbre d'aéromoteur |
US20090200250A1 (en) * | 2008-02-07 | 2009-08-13 | Multimetrixs, Llc | Cleanliness-improved wafer container |
US8453841B1 (en) | 2009-04-23 | 2013-06-04 | Western Digital Technologies, Inc. | Disk placement and storage assembly with disk cassette and disk slotter |
JP2011018771A (ja) * | 2009-07-09 | 2011-01-27 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
TWI363030B (en) * | 2009-07-10 | 2012-05-01 | Gudeng Prec Industral Co Ltd | Wafer container with top flange structure |
JP5596356B2 (ja) * | 2010-01-18 | 2014-09-24 | 旭化成ケミカルズ株式会社 | 樹脂製容器 |
TWI541177B (zh) * | 2010-10-19 | 2016-07-11 | 安堤格里斯公司 | 具晶圓緩衝件之前開式晶圓容器 |
CN103204320A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 一种多功能储存箱及存放方法 |
CN103204322A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 一种多功能储存箱及存放方法 |
CN103204290A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 一种多功能储存箱及存放方法 |
DE102013203289A1 (de) | 2013-02-27 | 2014-08-28 | Franz Baur | Verbindungsmittel |
TWI464472B (zh) * | 2013-03-15 | 2014-12-11 | Protai Photonic Co Ltd | 光纖連接器之尾柱 |
US10304710B2 (en) | 2013-06-18 | 2019-05-28 | Entegris, Inc. | Front opening wafer container with weight ballast |
JP6375186B2 (ja) * | 2014-09-05 | 2018-08-15 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
JP6549027B2 (ja) * | 2015-12-14 | 2019-07-24 | 信越ポリマー株式会社 | 基板収納容器 |
US9892948B2 (en) * | 2016-06-08 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer container having damping device |
TWI682484B (zh) * | 2017-04-20 | 2020-01-11 | 家登精密工業股份有限公司 | 卡匣結構轉載容器 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5575394A (en) * | 1994-07-15 | 1996-11-19 | Fluoroware, Inc. | Wafer shipper and package |
US5452795A (en) * | 1994-11-07 | 1995-09-26 | Gallagher; Gary M. | Actuated rotary retainer for silicone wafer box |
US5788304A (en) * | 1996-05-17 | 1998-08-04 | Micron Technology, Inc. | Wafer carrier having both a rigid structure and resistance to corrosive environments |
US5788082A (en) | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
US6039186A (en) | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
US6010008A (en) | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
US6398032B2 (en) * | 1998-05-05 | 2002-06-04 | Asyst Technologies, Inc. | SMIF pod including independently supported wafer cassette |
US6216874B1 (en) * | 1998-07-10 | 2001-04-17 | Fluoroware, Inc. | Wafer carrier having a low tolerance build-up |
US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
JP3556519B2 (ja) * | 1999-04-30 | 2004-08-18 | 信越ポリマー株式会社 | 基板収納容器の識別構造及び基板収納容器の識別方法 |
EP1446338A1 (en) * | 2001-11-14 | 2004-08-18 | Entegris, Inc. | Wafer support attachment for a semi-conductor wafer transport container |
US7121414B2 (en) * | 2001-12-28 | 2006-10-17 | Brooks Automation, Inc. | Semiconductor cassette reducer |
US7455180B2 (en) * | 2002-10-25 | 2008-11-25 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
US7201276B2 (en) * | 2003-11-07 | 2007-04-10 | Entegris, Inc. | Front opening substrate container with bottom plate |
-
2002
- 2002-11-13 EP EP02780644A patent/EP1446338A1/en not_active Withdrawn
- 2002-11-13 CN CNB028271114A patent/CN1298599C/zh not_active Expired - Fee Related
- 2002-11-13 WO PCT/US2002/036407 patent/WO2003042073A1/en active Application Filing
- 2002-11-13 JP JP2003543922A patent/JP4467977B2/ja not_active Expired - Lifetime
- 2002-11-13 KR KR1020047007238A patent/KR100909747B1/ko not_active IP Right Cessation
- 2002-11-13 US US10/293,210 patent/US6811029B2/en not_active Expired - Fee Related
- 2002-11-14 TW TW091133364A patent/TWI283452B/zh not_active IP Right Cessation
- 2002-11-14 MY MYPI20024250A patent/MY135079A/en unknown
-
2004
- 2004-11-02 US US10/979,780 patent/US7131176B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1446338A1 (en) | 2004-08-18 |
US6811029B2 (en) | 2004-11-02 |
TWI283452B (en) | 2007-07-01 |
CN1298599C (zh) | 2007-02-07 |
KR20050044436A (ko) | 2005-05-12 |
KR100909747B1 (ko) | 2009-07-29 |
US20050109666A1 (en) | 2005-05-26 |
JP2005509304A (ja) | 2005-04-07 |
CN1615257A (zh) | 2005-05-11 |
MY135079A (en) | 2008-01-31 |
US20030106830A1 (en) | 2003-06-12 |
TW200303591A (en) | 2003-09-01 |
US7131176B2 (en) | 2006-11-07 |
WO2003042073A1 (en) | 2003-05-22 |
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