AU1267899A - Semiconductor component and manufacturing method for semiconductor components - Google Patents

Semiconductor component and manufacturing method for semiconductor components

Info

Publication number
AU1267899A
AU1267899A AU12678/99A AU1267899A AU1267899A AU 1267899 A AU1267899 A AU 1267899A AU 12678/99 A AU12678/99 A AU 12678/99A AU 1267899 A AU1267899 A AU 1267899A AU 1267899 A AU1267899 A AU 1267899A
Authority
AU
Australia
Prior art keywords
semiconductor
manufacturing
components
component
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU12678/99A
Inventor
Hikan Sjodin
Anders Soderbarg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU1267899A publication Critical patent/AU1267899A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76283—Lateral isolation by refilling of trenches with dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76286—Lateral isolation by refilling of trenches with polycristalline material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
AU12678/99A 1997-11-17 1998-11-16 Semiconductor component and manufacturing method for semiconductor components Abandoned AU1267899A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9704209 1997-11-17
SE9704209A SE9704209L (en) 1997-11-17 1997-11-17 Semiconductor components and manufacturing process for semiconductor components
PCT/SE1998/002063 WO1999026291A2 (en) 1997-11-17 1998-11-16 Semiconductor component and manufacturing method for semiconductor components

Publications (1)

Publication Number Publication Date
AU1267899A true AU1267899A (en) 1999-06-07

Family

ID=20409013

Family Applications (1)

Application Number Title Priority Date Filing Date
AU12678/99A Abandoned AU1267899A (en) 1997-11-17 1998-11-16 Semiconductor component and manufacturing method for semiconductor components

Country Status (4)

Country Link
AU (1) AU1267899A (en)
SE (1) SE9704209L (en)
TW (1) TW396434B (en)
WO (1) WO1999026291A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000353797A (en) * 1999-06-11 2000-12-19 Mitsubishi Electric Corp Semiconductor wafer and manufacture thereof
US20020140030A1 (en) * 2001-03-30 2002-10-03 Mandelman Jack A. SOI devices with integrated gettering structure
US6958264B1 (en) 2001-04-03 2005-10-25 Advanced Micro Devices, Inc. Scribe lane for gettering of contaminants on SOI wafers and gettering method
JP2004172362A (en) * 2002-11-20 2004-06-17 Hyogo Prefecture Impurity removing method in semiconductor wafer, the semiconductor wafer, and semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110752A (en) * 1991-07-10 1992-05-05 Industrial Technology Research Institute Roughened polysilicon surface capacitor electrode plate for high denity dram
US5430315A (en) * 1993-07-22 1995-07-04 Rumennik; Vladimir Bi-directional power trench MOS field effect transistor having low on-state resistance and low leakage current
JPH07273121A (en) * 1994-03-31 1995-10-20 Toshiba Corp Fabrication of semiconductor device
US5478758A (en) * 1994-06-03 1995-12-26 At&T Corp. Method of making a getterer for multi-layer wafers
US5646053A (en) * 1995-12-20 1997-07-08 International Business Machines Corporation Method and structure for front-side gettering of silicon-on-insulator substrates

Also Published As

Publication number Publication date
WO1999026291A3 (en) 1999-08-05
WO1999026291A2 (en) 1999-05-27
SE9704209L (en) 1999-05-18
TW396434B (en) 2000-07-01
SE9704209D0 (en) 1997-11-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase